公开(公告)号：US07421778B2

公开(公告)日：2008-09-09

申请号：US11388100

申请日：2006-03-22

申请人： Jason A. Garcia ,  John J. Beatty

发明人： Jason A. Garcia ,  John J. Beatty

IPC分类号： H05K3/36

CPC分类号： H05K3/3436 ,  H01L24/13 ,  H01L24/14 ,  H01L24/17 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/05554 ,  H01L2224/05647 ,  H01L2224/13013 ,  H01L2224/13014 ,  H01L2224/13015 ,  H01L2224/13078 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/14051 ,  H01L2224/14141 ,  H01L2224/14142 ,  H01L2224/14145 ,  H01L2224/14146 ,  H01L2224/14177 ,  H01L2224/14505 ,  H01L2224/16 ,  H01L2224/16227 ,  H01L2224/81801 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15312 ,  H01L2924/3511 ,  H05K3/3426 ,  H05K2201/068 ,  H05K2201/10242 ,  H05K2201/10909 ,  Y02P70/613 ,  Y10T29/49126 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49204 ,  Y10T29/49222 ,  H01L2924/00014

摘要： According to one aspect of the invention, an electronic assembly is provided. The electronic assembly includes a first substrate having an integrated circuit formed therein and a second substrate. The first and second substrates are interconnected by a plurality of bi-material interconnects that are electrically connected to the integrated circuit and have a first component comprising a conductive first material with a first coefficient of thermal expansion and a second component comprising a second material with a second coefficient of thermal expansion. The first and second components are connected and shaped such that when the temperature of the bi-material interconnects changes the interconnects each bend towards the first or second component. When the temperature of the second substrate increases, the second substrate expands away from a central portion thereof. The bi-material interconnects are arranged such that the bi-material interconnects bend away from the central portion of the second substrate.

摘要翻译： 根据本发明的一个方面，提供一种电子组件。 电子组件包括其中形成有集成电路的第一基板和第二基板。 第一和第二基板通过电连接到集成电路的多个双材料互连互连，并且具有第一部件，该第一部件包括具有第一热膨胀系数的导电第一材料，第二部件包括具有第二材料的第二部件， 第二热膨胀系数。 第一和第二部件被连接和成形，使得当双材料互连件的温度改变时，互连件每个朝着第一或第二部件弯曲。 当第二基板的温度升高时，第二基板从其中心部分扩展。 双材料互连布置成使得双材料互连件远离第二基板的中心部分弯曲。

公开(公告)号：US06493238B1

公开(公告)日：2002-12-10

申请号：US09846554

申请日：2001-04-30

申请人： Deepak K. Pai

发明人： Deepak K. Pai

IPC分类号： H01R900

CPC分类号： H01L24/81 ,  H01L24/14 ,  H01L24/17 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/13012 ,  H01L2224/13013 ,  H01L2224/13017 ,  H01L2224/13099 ,  H01L2224/13147 ,  H01L2224/141 ,  H01L2224/14141 ,  H01L2224/81101 ,  H01L2224/81194 ,  H01L2224/812 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/30107 ,  H01R4/024 ,  H05K3/3436 ,  H05K2201/09418 ,  H05K2201/1025 ,  Y02P70/613 ,  H01L2224/05599

摘要： A method and system of utilizing inexpensively manufactured, electrically conductive and mechanically compliant disks to interconnect an area grid array (“AGA”) chip to a printed wiring board. The conductive disk shaped leads are stamped from a thin sheet of conductive material. To increase solderability and protect the disk surface, the disks can be plated with tin or an equivalent material. Each disk is positioned tangent to the surface of an AGA chip in a specific orientation. One edge of each disk is electrically connected and mechanically secured to a corresponding conductive pad located on the surface of the AGA chip. The opposite edge of each conductive disk is positioned to align with a corresponding conductive surface pad on a printed wiring board (“PWB”). Each opposite edge is electrically connected and mechanically secured to the surface of the PWB, thereby establishing a compliant electrical connection between the AGA chip and the PWB.

摘要翻译： 利用廉价制造的导电和机械柔性盘以将区域格栅阵列（“AGA”）芯片互连到印刷线路板的方法和系统。 导电盘形引线由导电材料薄片冲压。 为了增加可焊性和保护磁盘表面，磁盘可以镀锡或同等材料。 每个盘以特定取向与AGA芯片的表面相切。 每个盘的一个边缘电连接并且机械地固定到位于AGA芯片的表面上的对应的导电焊盘。 每个导电盘的相对边缘被定位成与印刷线路板（“PWB”）上的对应的导电表面焊盘对准。 每个相对边缘电连接并机械固定到PWB的表面，从而在AGA芯片和PWB之间建立顺应的电连接。

公开(公告)号：US07164208B2

公开(公告)日：2007-01-16

申请号：US11037262

申请日：2005-01-19

申请人： Kazuyuki Kainou ,  Masatoshi Yagoh ,  Kimihito Kuwabara ,  Katsumi Ohtani

发明人： Kazuyuki Kainou ,  Masatoshi Yagoh ,  Kimihito Kuwabara ,  Katsumi Ohtani

IPC分类号： H01L23/48 ,  H01L23/52

CPC分类号： H01L24/13 ,  H01L23/3114 ,  H01L23/49816 ,  H01L23/49838 ,  H01L24/06 ,  H01L24/14 ,  H01L2224/02122 ,  H01L2224/0401 ,  H01L2224/05017 ,  H01L2224/05552 ,  H01L2224/05557 ,  H01L2224/05558 ,  H01L2224/05571 ,  H01L2224/06051 ,  H01L2224/06131 ,  H01L2224/06135 ,  H01L2224/06136 ,  H01L2224/0614 ,  H01L2224/06141 ,  H01L2224/06177 ,  H01L2224/06179 ,  H01L2224/13006 ,  H01L2224/13012 ,  H01L2224/13014 ,  H01L2224/13015 ,  H01L2224/13018 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/14051 ,  H01L2224/14131 ,  H01L2224/14135 ,  H01L2224/14136 ,  H01L2224/1414 ,  H01L2224/14141 ,  H01L2224/14177 ,  H01L2224/14179 ,  H01L2924/00011 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/351 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/81805

摘要： There is provided a semiconductor device in which the junction strength of land portions and external terminals is increased, the disconnection of the external terminal is surely prevented, and the connection reliability is ensured over an extended period of time. An insulating resin layer which insulates metal wires from one another is formed on a semiconductor element, an end portion of the metal wire is connected to an electrode on the semiconductor element, the other end portion of the metal wire is connected to an external terminal to form a land, the entire surface of the semiconductor element except the connecting portions of the lands is covered with a surface-layer resin layer, and a projection is provided on the top surface of a land portion of at least one of the lands. Because of this, after their soldering, the external terminal holds the perimeter of the projection on the land portion, so that the external terminal can be surely connected to the land portion. As a result, the semiconductor device which ensures their connection reliability over an extended period of time can be obtained.

摘要翻译： 提供了一种半导体装置，其中陆部和外部端子的结合强度增加，可靠地防止外部端子的断开，并且在延长的时间段内确保连接可靠性。 在半导体元件上形成绝缘树脂层，金属线彼此连接，金属线的端部与半导体元件上的电极连接，金属线的另一端部与外部端子连接 形成一个焊盘，除了焊盘的连接部分之外的半导体元件的整个表面被表面层树脂层覆盖，并且在至少一个焊盘的焊盘部分的顶表面上设置突起。 因此，在焊接之后，外部端子将突起的周边保持在陆部上，使得外部端子可以可靠地连接到陆部。 结果，可以获得确保其在较长时间段内的连接可靠性的半导体器件。

公开(公告)号：US20060208357A1

公开(公告)日：2006-09-21

申请号：US11086922

申请日：2005-03-21

申请人： Thorsten Meyer ,  Harry Hedler ,  Stephan Dobritz

发明人： Thorsten Meyer ,  Harry Hedler ,  Stephan Dobritz

IPC分类号： H01L23/48

CPC分类号： H01L24/13 ,  H01L23/3114 ,  H01L24/14 ,  H01L24/81 ,  H01L2224/0554 ,  H01L2224/05548 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/13017 ,  H01L2224/131 ,  H01L2224/13191 ,  H01L2224/13541 ,  H01L2224/13551 ,  H01L2224/13566 ,  H01L2224/1357 ,  H01L2224/136 ,  H01L2224/14051 ,  H01L2224/14141 ,  H01L2224/14145 ,  H01L2224/14146 ,  H01L2224/14177 ,  H01L2224/14505 ,  H01L2224/17051 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H05K3/325 ,  H05K3/3436 ,  H05K2201/0314 ,  H05K2201/0367 ,  H05K2201/10659 ,  H05K2201/10734 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： The present invention relates to an integrated device comprising an electronic circuit chip, a solder contact structure to provide contact to the electronic circuit chip and an elastic contact structure to provide contact to the electronic circuit chip, wherein the solder contact structure and the elastic contact structure are arranged on a contacting surface of the integrated device.

摘要翻译： 本发明涉及一种集成装置，其包括电子电路芯片，提供与电子电路芯片的接触的焊接触点结构和用于提供与电子电路芯片的接触的弹性接触结构，其中焊料接触结构和弹性接触结构 布置在集成装置的接触表面上。

公开(公告)号：US11916033B2

公开(公告)日：2024-02-27

申请号：US17588525

申请日：2022-01-31

申请人： AMKOR TECHNOLOGY SINGAPORE HOLDING PTE.LTD.

发明人： Glenn Rinne ,  Daniel Richter

IPC分类号： H01L23/00 ,  H01L23/498

CPC分类号： H01L24/14 ,  H01L23/49838 ,  H01L24/06 ,  H01L24/11 ,  H01L24/13 ,  H01L23/49816 ,  H01L24/81 ,  H01L2224/06051 ,  H01L2224/06177 ,  H01L2224/119 ,  H01L2224/11849 ,  H01L2224/131 ,  H01L2224/13012 ,  H01L2224/13014 ,  H01L2224/13015 ,  H01L2224/13016 ,  H01L2224/13017 ,  H01L2224/14051 ,  H01L2224/14131 ,  H01L2224/14133 ,  H01L2224/14135 ,  H01L2224/14141 ,  H01L2224/14151 ,  H01L2224/14153 ,  H01L2224/14154 ,  H01L2224/14177 ,  H01L2224/81815 ,  H01L2924/10156 ,  H01L2924/15311 ,  H01L2224/119 ,  H01L21/78 ,  H01L2224/11849 ,  H01L2224/13012 ,  H01L2924/00012 ,  H01L2224/13016 ,  H01L2924/00012 ,  H01L2224/14177 ,  H01L2224/14131 ,  H01L2224/14135 ,  H01L2224/13014 ,  H01L2924/00012 ,  H01L2224/14154 ,  H01L2924/00012 ,  H01L2224/14177 ,  H01L2224/14154 ,  H01L2224/81815 ,  H01L2924/00014 ,  H01L2224/131 ,  H01L2924/014

摘要： Provided is a disclosure for optimizing the number of semiconductor devices on a wafer/substrate. The optimization comprises laying out, cutting, and packaging the devices efficiently.

公开(公告)号：US20180047692A1

公开(公告)日：2018-02-15

申请号：US15233271

申请日：2016-08-10

申请人： Amkor Technology, Inc.

发明人： Glenn Rinne ,  Daniel Richter

IPC分类号： H01L23/00

CPC分类号： H01L24/14 ,  H01L23/49816 ,  H01L23/49838 ,  H01L24/06 ,  H01L24/11 ,  H01L24/13 ,  H01L24/81 ,  H01L2224/06051 ,  H01L2224/06177 ,  H01L2224/11849 ,  H01L2224/119 ,  H01L2224/13012 ,  H01L2224/13014 ,  H01L2224/13015 ,  H01L2224/13016 ,  H01L2224/13017 ,  H01L2224/131 ,  H01L2224/14051 ,  H01L2224/14131 ,  H01L2224/14133 ,  H01L2224/14135 ,  H01L2224/14141 ,  H01L2224/14151 ,  H01L2224/14153 ,  H01L2224/14154 ,  H01L2224/14177 ,  H01L2224/81815 ,  H01L2924/10156 ,  H01L2924/15311 ,  H01L21/78 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/014

摘要： Provided is a disclosure for optimizing the number of semiconductor devices on a wafer/substrate. The optimization comprises laying out, cutting, and packaging the devices efficiently.

公开(公告)号：US20070072405A1

公开(公告)日：2007-03-29

申请号：US11605397

申请日：2006-11-29

申请人： Kazuyuki Kainou ,  Masatoshi Yagoh ,  Kimihito Kuwabara ,  Katsumi Ohtani

发明人： Kazuyuki Kainou ,  Masatoshi Yagoh ,  Kimihito Kuwabara ,  Katsumi Ohtani

IPC分类号： H01L21/44

CPC分类号： H01L24/13 ,  H01L23/3114 ,  H01L23/49816 ,  H01L23/49838 ,  H01L24/06 ,  H01L24/14 ,  H01L2224/02122 ,  H01L2224/0401 ,  H01L2224/05017 ,  H01L2224/05552 ,  H01L2224/05557 ,  H01L2224/05558 ,  H01L2224/05571 ,  H01L2224/06051 ,  H01L2224/06131 ,  H01L2224/06135 ,  H01L2224/06136 ,  H01L2224/0614 ,  H01L2224/06141 ,  H01L2224/06177 ,  H01L2224/06179 ,  H01L2224/13006 ,  H01L2224/13012 ,  H01L2224/13014 ,  H01L2224/13015 ,  H01L2224/13018 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/14051 ,  H01L2224/14131 ,  H01L2224/14135 ,  H01L2224/14136 ,  H01L2224/1414 ,  H01L2224/14141 ,  H01L2224/14177 ,  H01L2224/14179 ,  H01L2924/00011 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/351 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/81805

摘要： There is provided a semiconductor device in which the junction strength of land portions and external terminals is increased, the disconnection of the external terminal is surely prevented, and the connection reliability is ensured over an extended period of time. An insulating resin layer which insulates metal wires from one another is formed on a semiconductor element, an end portion of the metal wire is connected to an electrode on the semiconductor element, the other end portion of the metal wire is connected to an external terminal to form a land, the entire surface of the semiconductor element except the connecting portions of the lands is covered with a surface-layer resin layer, and a projection is provided on the top surface of a land portion of at least one of the lands. Because of this, after their soldering, the external terminal holds the perimeter of the projection on the land portion, so that the external terminal can be surely connected to the land portion. As a result, the semiconductor device which ensures their connection reliability over an extended period of time can be obtained.

公开(公告)号：US20120199966A1

公开(公告)日：2012-08-09

申请号：US13023011

申请日：2011-02-08

申请人： Tin-Hao Kuo ,  Yu-Feng Chen ,  Chen-Shien Chen ,  Chen-Hua Yu ,  Sheng-Yu Wu ,  Chita Chuang

发明人： Tin-Hao Kuo ,  Yu-Feng Chen ,  Chen-Shien Chen ,  Chen-Hua Yu ,  Sheng-Yu Wu ,  Chita Chuang

IPC分类号： H01L23/48 ,  H01L21/44

CPC分类号： H01L24/13 ,  H01L23/3192 ,  H01L24/05 ,  H01L24/14 ,  H01L2224/0401 ,  H01L2224/05555 ,  H01L2224/05572 ,  H01L2224/05647 ,  H01L2224/05666 ,  H01L2224/05681 ,  H01L2224/05687 ,  H01L2224/1145 ,  H01L2224/11452 ,  H01L2224/13012 ,  H01L2224/13014 ,  H01L2224/13022 ,  H01L2224/13027 ,  H01L2224/13083 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13169 ,  H01L2224/14141 ,  H01L2224/81192 ,  H01L2924/00013 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01073 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2924/0105 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2924/00012 ,  H01L2924/00

摘要： An elongated bump structure for semiconductor devices is provided. An uppermost protective layer has an opening formed therethrough. A pillar is formed within the opening and extending over at least a portion of the uppermost protective layer. The portion extending over the uppermost protective layer exhibits a generally elongated shape. In an embodiment, the position of the opening relative to the portion of the bump structure extending over the uppermost protective layer is such that a ratio of a distance from an edge of the opening to an edge of the bump is greater than or equal to about 0.2. In another embodiment, the position of the opening is offset relative to center of the bump.

摘要翻译： 提供了用于半导体器件的细长凸块结构。 最上面的保护层具有通过其形成的开口。 在该开口内形成一个支柱，并延伸至最上层保护层的至少一部分。 在最上保护层上延伸的部分呈现大致细长的形状。 在一个实施例中，开口相对于在最上保护层上延伸的凸起结构的部分的位置使得从开口的边缘到凸起的边缘的距离的比例大于或等于约 0.2。 在另一个实施例中，开口的位置相对于凸块的中心偏移。

公开(公告)号：US07183493B2

公开(公告)日：2007-02-27

申请号：US10883433

申请日：2004-06-30

申请人： Jason A. Garcia ,  John J. Beatty

发明人： Jason A. Garcia ,  John J. Beatty

IPC分类号： H05K1/09

CPC分类号： H05K3/3436 ,  H01L24/13 ,  H01L24/14 ,  H01L24/17 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/05554 ,  H01L2224/05647 ,  H01L2224/13013 ,  H01L2224/13014 ,  H01L2224/13015 ,  H01L2224/13078 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/14051 ,  H01L2224/14141 ,  H01L2224/14142 ,  H01L2224/14145 ,  H01L2224/14146 ,  H01L2224/14177 ,  H01L2224/14505 ,  H01L2224/16 ,  H01L2224/16227 ,  H01L2224/81801 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15312 ,  H01L2924/3511 ,  H05K3/3426 ,  H05K2201/068 ,  H05K2201/10242 ,  H05K2201/10909 ,  Y02P70/613 ,  Y10T29/49126 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49204 ,  Y10T29/49222 ,  H01L2924/00014

摘要： According to one aspect of the invention, an electronic assembly is provided. The electronic assembly includes a first substrate having an integrated circuit formed therein and a second substrate. The first and second substrates are interconnected by a plurality of bi-material interconnects that are electrically connected to the integrated circuit and have a first component comprising a conductive first material with a first coefficient of thermal expansion and a second component comprising a second material with a second coefficient of thermal expansion. The first and second components are connected and shaped such that when the temperature of the bi-material interconnects changes the interconnects each bend towards the first or second component. When the temperature of the second substrate increases, the second substrate expands away from a central portion thereof. The bi-material interconnects are arranged such that the bi-material interconnects bend away from the central portion of the second substrate.

摘要翻译： 根据本发明的一个方面，提供一种电子组件。 电子组件包括其中形成有集成电路的第一基板和第二基板。 第一和第二基板通过电连接到集成电路的多个双材料互连互连，并且具有第一部件，该第一部件包括具有第一热膨胀系数的导电第一材料，第二部件包括具有第二材料的第二部件， 第二热膨胀系数。 第一和第二部件被连接和成形，使得当双材料互连件的温度改变时，互连件每个朝着第一或第二部件弯曲。 当第二基板的温度升高时，第二基板从其中心部分扩展。 双材料互连布置成使得双材料互连件远离第二基板的中心部分弯曲。

公开(公告)号：US20060001159A1

公开(公告)日：2006-01-05

申请号：US10883433

申请日：2004-06-30

申请人： Jason Garcia ,  John Beatty

发明人： Jason Garcia ,  John Beatty

IPC分类号： H01L23/48 ,  H01L21/44

CPC分类号： H05K3/3436 ,  H01L24/13 ,  H01L24/14 ,  H01L24/17 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/05554 ,  H01L2224/05647 ,  H01L2224/13013 ,  H01L2224/13014 ,  H01L2224/13015 ,  H01L2224/13078 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/14051 ,  H01L2224/14141 ,  H01L2224/14142 ,  H01L2224/14145 ,  H01L2224/14146 ,  H01L2224/14177 ,  H01L2224/14505 ,  H01L2224/16 ,  H01L2224/16227 ,  H01L2224/81801 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15312 ,  H01L2924/3511 ,  H05K3/3426 ,  H05K2201/068 ,  H05K2201/10242 ,  H05K2201/10909 ,  Y02P70/613 ,  Y10T29/49126 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49204 ,  Y10T29/49222 ,  H01L2924/00014

摘要： According to one aspect of the invention, an electronic assembly is provided. The electronic assembly includes a first substrate having an integrated circuit formed therein and a second substrate. The first and second substrates are interconnected by a plurality of bi-material interconnects that are electrically connected to the integrated circuit and have a first component comprising a conductive first material with a first coefficient of thermal expansion and a second component comprising a second material with a second coefficient of thermal expansion. The first and second components are connected and shaped such that when the temperature of the bi-material interconnects changes the interconnects each bend towards the first or second component. When the temperature of the second substrate increases, the second substrate expands away from a central portion thereof. The bi-material interconnects are arranged such that the bi-material interconnects bend away from the central portion of the second substrate.

摘要翻译： 根据本发明的一个方面，提供一种电子组件。 电子组件包括其中形成有集成电路的第一基板和第二基板。 第一和第二基板通过电连接到集成电路的多个双材料互连互连，并且具有第一部件，该第一部件包括具有第一热膨胀系数的导电第一材料，第二部件包括具有第二材料的第二部件， 第二热膨胀系数。 第一和第二部件被连接和成形，使得当双材料互连件的温度改变时，互连件每个朝着第一或第二部件弯曲。 当第二基板的温度升高时，第二基板从其中心部分扩展。 双材料互连布置成使得双材料互连件远离第二基板的中心部分弯曲。