公开(公告)号：US20130256856A1

公开(公告)日：2013-10-03

申请号：US13431125

申请日：2012-03-27

申请人： Joachim Mahler ,  Thomas Bemmerl ,  Anton Prueckl

发明人： Joachim Mahler ,  Thomas Bemmerl ,  Anton Prueckl

IPC分类号： H01L23/495 ,  H01L21/50 ,  H01L23/48

CPC分类号： H01L21/76877 ,  H01L21/76816 ,  H01L23/13 ,  H01L23/3107 ,  H01L23/4334 ,  H01L23/49513 ,  H01L23/49517 ,  H01L23/49524 ,  H01L23/49562 ,  H01L23/49575 ,  H01L23/49833 ,  H01L24/05 ,  H01L24/24 ,  H01L24/29 ,  H01L24/32 ,  H01L24/35 ,  H01L24/37 ,  H01L24/40 ,  H01L24/41 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/82 ,  H01L24/92 ,  H01L25/072 ,  H01L25/50 ,  H01L2224/04026 ,  H01L2224/04034 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/05666 ,  H01L2224/05669 ,  H01L2224/05671 ,  H01L2224/224 ,  H01L2224/24011 ,  H01L2224/2402 ,  H01L2224/24105 ,  H01L2224/24155 ,  H01L2224/24175 ,  H01L2224/244 ,  H01L2224/291 ,  H01L2224/29111 ,  H01L2224/29139 ,  H01L2224/29144 ,  H01L2224/29147 ,  H01L2224/2919 ,  H01L2224/29294 ,  H01L2224/29311 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/35 ,  H01L2224/352 ,  H01L2224/3701 ,  H01L2224/37113 ,  H01L2224/37118 ,  H01L2224/37139 ,  H01L2224/37144 ,  H01L2224/37147 ,  H01L2224/37155 ,  H01L2224/3716 ,  H01L2224/37164 ,  H01L2224/37169 ,  H01L2224/40095 ,  H01L2224/40155 ,  H01L2224/40175 ,  H01L2224/40245 ,  H01L2224/40499 ,  H01L2224/41171 ,  H01L2224/48155 ,  H01L2224/48175 ,  H01L2224/49171 ,  H01L2224/73263 ,  H01L2224/73265 ,  H01L2224/73267 ,  H01L2224/82104 ,  H01L2224/82105 ,  H01L2224/82106 ,  H01L2224/83447 ,  H01L2224/83801 ,  H01L2224/8385 ,  H01L2224/83851 ,  H01L2224/84447 ,  H01L2224/92244 ,  H01L2224/92246 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13062 ,  H01L2924/13091 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/0105 ,  H01L2924/01049 ,  H01L2924/01014 ,  H01L2924/07811 ,  H01L2924/01028 ,  H01L2924/00012 ,  H01L2924/01023 ,  H01L2224/45099

摘要： An electronic device includes a first chip carrier and a second chip carrier isolated from the first chip carrier. A first power semiconductor chip is mounted on and electrically connected to the first chip carrier. A second power semiconductor chip is mounted on and electrically connected to the second chip carrier. An electrically insulating material is configured to at least partially surround the first power semiconductor chip and the second power semiconductor chip. An electrical interconnect is configured to electrically connect the first power semiconductor chip to the second power semiconductor chip, wherein the electrical interconnect has at least one of a contact clip and a galvanically deposited conductor.

公开(公告)号：US08916968B2

公开(公告)日：2014-12-23

申请号：US13431125

申请日：2012-03-27

申请人： Joachim Mahler ,  Thomas Bemmerl ,  Anton Prueckl

发明人： Joachim Mahler ,  Thomas Bemmerl ,  Anton Prueckl

IPC分类号： H01L23/34

CPC分类号： H01L21/76877 ,  H01L21/76816 ,  H01L23/13 ,  H01L23/3107 ,  H01L23/4334 ,  H01L23/49513 ,  H01L23/49517 ,  H01L23/49524 ,  H01L23/49562 ,  H01L23/49575 ,  H01L23/49833 ,  H01L24/05 ,  H01L24/24 ,  H01L24/29 ,  H01L24/32 ,  H01L24/35 ,  H01L24/37 ,  H01L24/40 ,  H01L24/41 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/82 ,  H01L24/92 ,  H01L25/072 ,  H01L25/50 ,  H01L2224/04026 ,  H01L2224/04034 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/05666 ,  H01L2224/05669 ,  H01L2224/05671 ,  H01L2224/224 ,  H01L2224/24011 ,  H01L2224/2402 ,  H01L2224/24105 ,  H01L2224/24155 ,  H01L2224/24175 ,  H01L2224/244 ,  H01L2224/291 ,  H01L2224/29111 ,  H01L2224/29139 ,  H01L2224/29144 ,  H01L2224/29147 ,  H01L2224/2919 ,  H01L2224/29294 ,  H01L2224/29311 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/35 ,  H01L2224/352 ,  H01L2224/3701 ,  H01L2224/37113 ,  H01L2224/37118 ,  H01L2224/37139 ,  H01L2224/37144 ,  H01L2224/37147 ,  H01L2224/37155 ,  H01L2224/3716 ,  H01L2224/37164 ,  H01L2224/37169 ,  H01L2224/40095 ,  H01L2224/40155 ,  H01L2224/40175 ,  H01L2224/40245 ,  H01L2224/40499 ,  H01L2224/41171 ,  H01L2224/48155 ,  H01L2224/48175 ,  H01L2224/49171 ,  H01L2224/73263 ,  H01L2224/73265 ,  H01L2224/73267 ,  H01L2224/82104 ,  H01L2224/82105 ,  H01L2224/82106 ,  H01L2224/83447 ,  H01L2224/83801 ,  H01L2224/8385 ,  H01L2224/83851 ,  H01L2224/84447 ,  H01L2224/92244 ,  H01L2224/92246 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13062 ,  H01L2924/13091 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/0105 ,  H01L2924/01049 ,  H01L2924/01014 ,  H01L2924/07811 ,  H01L2924/01028 ,  H01L2924/00012 ,  H01L2924/01023 ,  H01L2224/45099

摘要： An electronic device includes a first chip carrier and a second chip carrier isolated from the first chip carrier. A first power semiconductor chip is mounted on and electrically connected to the first chip carrier. A second power semiconductor chip is mounted on and electrically connected to the second chip carrier. An electrically insulating material is configured to at least partially surround the first power semiconductor chip and the second power semiconductor chip. An electrical interconnect is configured to electrically connect the first power semiconductor chip to the second power semiconductor chip, wherein the electrical interconnect has at least one of a contact clip and a galvanically deposited conductor.

摘要翻译： 电子设备包括与第一芯片载体隔离的第一芯片载体和第二芯片载体。 第一功率半导体芯片安装在电连接到第一芯片载体上。 第二功率半导体芯片安装在第二芯片载体上并电连接到第二芯片载体。 电绝缘材料被配置为至少部分地围绕第一功率半导体芯片和第二功率半导体芯片。 电互连被配置为将第一功率半导体芯片电连接到第二功率半导体芯片，其中电互连具有接触夹和电沉积导体中的至少一个。

公开(公告)号：US07944061B2

公开(公告)日：2011-05-17

申请号：US11575851

申请日：2005-09-20

申请人： Michael Bauer ,  Thomas Bemmerl ,  Edward Fuergut ,  Simon Jerebic ,  Christian Stuempfl ,  Horst Theuss ,  Hermann Vilsmeier

发明人： Michael Bauer ,  Thomas Bemmerl ,  Edward Fuergut ,  Simon Jerebic ,  Christian Stuempfl ,  Horst Theuss ,  Hermann Vilsmeier

IPC分类号： H01L23/48 ,  H01L23/28

CPC分类号： H05K3/3442 ,  H01L21/4853 ,  H01L21/56 ,  H01L23/3128 ,  H01L23/49811 ,  H01L24/48 ,  H01L25/105 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/14 ,  H01L2924/15192 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/3011 ,  H05K1/185 ,  H05K3/4046 ,  H05K2201/10492 ,  H05K2201/10515 ,  H05K2201/10636 ,  H05K2201/10734 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/0555 ,  H01L2224/0556

摘要： The invention relates to a semiconductor device comprising through contacts through a plastic housing composition and a method for the production thereof. For this purpose, the wiring substrate has a solder deposit on which through contact elements are arranged vertically with respect to the wiring substrate and extend as far as the top side of the semiconductor device.

摘要翻译： 本发明涉及一种半导体器件，其包括通过接触件通过塑料外壳组合物及其制造方法。 为此，布线基板具有通过接触元件相对于布线基板垂直布置的焊料沉积物，并且延伸到半导体器件的顶侧。

公开(公告)号：US07709379B2

公开(公告)日：2010-05-04

申请号：US10555632

申请日：2004-05-04

申请人： Michael Bauer ,  Thomas Bemmerl ,  Markus Fink ,  Edward Fuergut ,  Horst Groeninger ,  Hermann Vilsmeier

发明人： Michael Bauer ,  Thomas Bemmerl ,  Markus Fink ,  Edward Fuergut ,  Horst Groeninger ,  Hermann Vilsmeier

IPC分类号： H01L21/44

CPC分类号： H01L25/50 ,  H01L23/49883 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/82 ,  H01L25/0652 ,  H01L2224/24011 ,  H01L2224/82103 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01057 ,  H01L2924/01068 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/19041 ,  H05K1/185 ,  H05K3/105 ,  H05K2201/0257 ,  H05K2201/0323 ,  H05K2203/0285 ,  H05K2203/102 ,  H05K2203/107 ,  H05K2203/1136 ,  Y10S977/773

摘要： An electrical device having carbonized conductors and a method and a device for the production thereof is disclosed. The electrical device has electrical components having connections. Furthermore, there are situated between the electrical components regions made of plastic with conductors having carbonized plastic and/or agglomerated nanoparticles. The conductors are connected to the connections of the components and/or to external connections of the electronic device.

摘要翻译： 公开了一种具有碳化导体的电气装置及其制造方法和装置。 电气设备具有具有连接的电气部件。 此外，位于由塑料制成的电气部件区域之间，导体具有碳化塑料和/或附聚纳米颗粒。 导体连接到组件的连接和/或电子设备的外部连接。

公开(公告)号：US20130210181A1

公开(公告)日：2013-08-15

申请号：US13817596

申请日：2011-07-20

申请人： Stephan Preuss ,  Thomas Bemmerl

发明人： Stephan Preuss ,  Thomas Bemmerl

IPC分类号： B32B33/00 ,  H01L33/60

CPC分类号： B32B33/00 ,  B29C33/68 ,  B29C43/146 ,  B29C43/18 ,  B29C2043/147 ,  H01L33/60 ,  H01L2933/0041 ,  H01L2933/0091

摘要： A process of producing a layer composite includes a luminescence conversion layer and a scattering layer, wherein a press having a first pressing tool with a cavity and a second pressing tool is used including introducing a first polymer including a luminescence conversion substance into the cavity, inserting a film between the first and second tools, closing the press and carrying out a first pressing, hardening the first polymer to form a luminescence conversion layer in the press, opening the press, wherein the luminescence conversion layer adhering to the film remains in the press, introducing a second polymer including scattering particles into the cavity, closing the press and carrying out a second pressing, hardening the second polymer to form a scattering layer disposed on the luminescence conversion layer, opening the press, and removing the support film with the layer composite including the luminescence conversion layer and the scattering layer.

摘要翻译： 制造层复合体的方法包括发光转换层和散射层，其中使用具有带空腔的第一加压工具和第二压制工具的压力机，包括将包含发光转换物质的第一聚合物引入腔体， 在第一和第二工具之间的膜，闭合压机并进行第一次压制，硬化第一聚合物以在压机中形成发光转换层，打开压机，其中附着在膜上的发光转换层保留在压机中 将包括散射颗粒的第二聚合物引入空腔中，关闭压机并进行第二次挤压，硬化第二聚合物以形成设置在发光转换层上的散射层，打开压机，并用层除去支撑膜 复合材料包括发光转换层和散射层。

公开(公告)号：US07800241B2

公开(公告)日：2010-09-21

申请号：US11455949

申请日：2006-06-20

申请人： Michael Bauer ,  Thomas Bemmerl ,  Edward Fuergut

发明人： Michael Bauer ,  Thomas Bemmerl ,  Edward Fuergut

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L23/3142 ,  H01L23/49503 ,  H01L23/49582 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48464 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/01014 ,  H01L2924/01021 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01037 ,  H01L2924/01038 ,  H01L2924/0104 ,  H01L2924/01041 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01052 ,  H01L2924/01058 ,  H01L2924/01059 ,  H01L2924/0106 ,  H01L2924/0107 ,  H01L2924/01072 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12044 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2924/20751 ,  H01L2924/05442 ,  H01L2924/05432 ,  H01L2924/05042 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor device with semiconductor device components embedded in a plastics composition is disclosed. In one embodiment, organosilicon and organometallic compounds are used for producing an adhesion promoter layer. The adhesion promoter layer on the surfaces of the semiconductor device components of a semiconductor device has a microporous morphology and has an average thickness D of between 5 nm≦D≦300 nm. In this case, the adhesion promoter layer has nanoscale ceramic grains applied wet-chemically.

摘要翻译： 公开了一种具有嵌入塑料组合物中的半导体器件部件的半导体器件。 在一个实施方案中，有机硅和有机金属化合物用于生产粘附促进剂层。 半导体器件的半导体器件部件的表面上的粘合促进剂层具有微孔形态，并且其平均厚度D在5nm＆amp; NlE; D＆amp; NlE; 300nm之间。 在这种情况下，粘合促进剂层具有湿法化学涂覆的纳米级陶瓷颗粒。

公开(公告)号：US07420262B2

公开(公告)日：2008-09-02

申请号：US10789033

申请日：2004-02-27

申请人： Michael Bauer ,  Peter Strobel ,  Gerald Ofner ,  Edward Fürgut ,  Simon Jerebic ,  Thomas Bemmerl ,  Markus Fink ,  Hermann Vilsmeier

发明人： Michael Bauer ,  Peter Strobel ,  Gerald Ofner ,  Edward Fürgut ,  Simon Jerebic ,  Thomas Bemmerl ,  Markus Fink ,  Hermann Vilsmeier

IPC分类号： H01L21/66

CPC分类号： H01L24/16 ,  H01L21/78 ,  H01L23/3185 ,  H01L23/481 ,  H01L24/02 ,  H01L24/11 ,  H01L24/81 ,  H01L25/0657 ,  H01L2224/0401 ,  H01L2224/131 ,  H01L2224/16105 ,  H01L2224/16108 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06551 ,  H01L2924/01005 ,  H01L2924/01014 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01068 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/05042 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/3011 ,  H01L2924/00

摘要： The invention relates to an electronic component and a semiconductor wafer, and a method for producing them. The semiconductor wafer has strip-type separating regions. The separating regions are provided with through contacts in the direction of the rear side of the semiconductor wafer. The semiconductor chip separated from such a semiconductor wafer constitutes an electronic component with external contacts in the form of edge contacts. Such an electronic component of semiconductor chip size can be used in diverse ways.

摘要翻译： 本发明涉及电子元件和半导体晶片及其制造方法。 半导体晶片具有带状分离区域。 分离区域在半导体晶片的后侧的方向上设置有贯通触点。 与这种半导体晶片分离的半导体芯片构成具有边缘接触形式的外部触点的电子部件。 这种半导体芯片尺寸的电子部件可以以各种方式使用。

公开(公告)号：US20130077280A1

公开(公告)日：2013-03-28

申请号：US13700414

申请日：2011-04-13

申请人： Thomas Bemmerl ,  Simon Jerebic ,  Markus Pindl

发明人： Thomas Bemmerl ,  Simon Jerebic ,  Markus Pindl

IPC分类号： H05K7/02

CPC分类号： H01L24/32 ,  H01L21/56 ,  H01L23/3142 ,  H01L24/83 ,  H01L25/167 ,  H01L33/06 ,  H01L33/32 ,  H01L33/44 ,  H01L33/507 ,  H01L33/54 ,  H01L33/56 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83951 ,  H01L2924/12041 ,  H01L2924/1434 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2933/005 ,  H01L2933/0066 ,  H01L2933/0091 ,  H05K7/02 ,  H01L2924/00

摘要： An electronic arrangement (1) comprising a carrier (2), on which at least one connecting area (6) is arranged. At least one electronic component (3a, 3b, 3c) is fixed on the connecting area (6) by means of a contact material (4). A covering area (5) surrounds the connecting area (6) on the carrier (2). At least one covered region (15, 16, 17, 18, 19) is covered by a covering material (10). The covering material (10) is designed in such a way that an optical contrast between the covering area (5) and the covered region (15, 16, 17, 18, 19) is minimized.

摘要翻译： 一种包括载体（2）的电子装置（1），其上布置有至少一个连接区域（6）。 至少一个电子部件（3a，3b，3c）借助接触材料（4）固定在连接区域（6）上。 覆盖区域（5）围绕载体（2）上的连接区域（6）。 至少一个覆盖区域（15,16,17,18,19）被覆盖材料（10）覆盖。 覆盖材料（10）被设计成使覆盖区域（5）和覆盖区域（15,16,17,18,19）之间的光学对比度最小化。

公开(公告)号：US08030741B2

公开(公告)日：2011-10-04

申请号：US12774320

申请日：2010-05-05

申请人： Thomas Bemmerl ,  Thomas Mende ,  Bernd Rakow

发明人： Thomas Bemmerl ,  Thomas Mende ,  Bernd Rakow

IPC分类号： H01L23/495 ,  H01L21/60

CPC分类号： H01L23/49541 ,  H01L23/49531 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48253 ,  H01L2224/484 ,  H01L2224/48599 ,  H01L2224/4911 ,  H01L2224/49175 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/85399 ,  H01L2224/05599

摘要： One embodiment provides a semiconductor assembly including a printed circuit board and a semiconductor package. The semiconductor package includes a lead frame having a die pad and a plurality of leads spaced from the die pad, a chip attached to the die pad on a front face of the lead frame, at least one electrically conductive structure element mechanically coupled to but electrically isolated from the front face of the lead frame, at least one connector electrically connecting the chip to the structure element, at least one connector electrically connecting the structure element to at least one of the leads, and a mold material encasing the semiconductor package except for an end portion of the leads which are electrically connected to the printed circuit board.

摘要翻译： 一个实施例提供了包括印刷电路板和半导体封装的半导体组件。 所述半导体封装包括具有管芯焊盘和与所述管芯焊盘间隔开的多个引线的引线框架，在所述引线框架的前表面上附接到所述管芯焊盘的芯片，至少一个机械地耦合到所述引线框架的导电结构元件 与引线框架的前表面隔离开，将芯片与结构元件电连接的至少一个连接器，将结构元件电连接到至少一个引线的至少一个连接器以及封装半导体封装的模具材料，除了 引线的端部电连接到印刷电路板。

公开(公告)号：US20100213587A1

公开(公告)日：2010-08-26

申请号：US12774320

申请日：2010-05-05

申请人： Thomas Bemmerl ,  Thomas Mende ,  Bernd Rakow

发明人： Thomas Bemmerl ,  Thomas Mende ,  Bernd Rakow

IPC分类号： H01L23/495 ,  H01L23/498

CPC分类号： H01L23/49541 ,  H01L23/49531 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48253 ,  H01L2224/484 ,  H01L2224/48599 ,  H01L2224/4911 ,  H01L2224/49175 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/85399 ,  H01L2224/05599

摘要： One embodiment provides a semiconductor assembly including a printed circuit board and a semiconductor package. The semiconductor package includes a lead frame having a die pad and a plurality of leads spaced from the die pad, a chip attached to the die pad on a front face of the lead frame, at least one electrically conductive structure element mechanically coupled to but electrically isolated from the front face of the lead frame, at least one connector electrically connecting the chip to the structure element, at least one connector electrically connecting the structure element to at least one of the leads, and a mold material encasing the semiconductor package except for an end portion of the leads which are electrically connected to the printed circuit board.

摘要翻译： 一个实施例提供了包括印刷电路板和半导体封装的半导体组件。 所述半导体封装包括具有管芯焊盘和与所述管芯焊盘间隔开的多个引线的引线框架，在所述引线框架的前表面上附接到所述管芯焊盘的芯片，至少一个机械地耦合到所述引线框架的导电结构元件 与引线框架的前表面隔离开，将芯片与结构元件电连接的至少一个连接器，将结构元件电连接到至少一个引线的至少一个连接器以及封装半导体封装的模具材料，除了 引线的端部电连接到印刷电路板。