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公开(公告)号：US09443760B2
公开(公告)日：2016-09-13
申请号：US14543557
申请日：2014-11-17
发明人： Joachim Mahler , Thomas Bemmerl , Anton Prueckl
IPC分类号： H01L21/00 , H01L21/768 , H01L23/13 , H01L23/433 , H01L23/495 , H01L23/00 , H01L23/498 , H01L25/07 , H01L25/00 , H01L23/31
CPC分类号： H01L21/76877 , H01L21/76816 , H01L23/13 , H01L23/3107 , H01L23/4334 , H01L23/49513 , H01L23/49517 , H01L23/49524 , H01L23/49562 , H01L23/49575 , H01L23/49833 , H01L24/05 , H01L24/24 , H01L24/29 , H01L24/32 , H01L24/35 , H01L24/37 , H01L24/40 , H01L24/41 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/82 , H01L24/92 , H01L25/072 , H01L25/50 , H01L2224/04026 , H01L2224/04034 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05664 , H01L2224/05666 , H01L2224/05669 , H01L2224/05671 , H01L2224/224 , H01L2224/24011 , H01L2224/2402 , H01L2224/24105 , H01L2224/24155 , H01L2224/24175 , H01L2224/244 , H01L2224/291 , H01L2224/29111 , H01L2224/29139 , H01L2224/29144 , H01L2224/29147 , H01L2224/2919 , H01L2224/29294 , H01L2224/29311 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/32225 , H01L2224/32245 , H01L2224/35 , H01L2224/352 , H01L2224/3701 , H01L2224/37113 , H01L2224/37118 , H01L2224/37139 , H01L2224/37144 , H01L2224/37147 , H01L2224/37155 , H01L2224/3716 , H01L2224/37164 , H01L2224/37169 , H01L2224/40095 , H01L2224/40155 , H01L2224/40175 , H01L2224/40245 , H01L2224/40499 , H01L2224/41171 , H01L2224/48155 , H01L2224/48175 , H01L2224/49171 , H01L2224/73263 , H01L2224/73265 , H01L2224/73267 , H01L2224/82104 , H01L2224/82105 , H01L2224/82106 , H01L2224/83447 , H01L2224/83801 , H01L2224/8385 , H01L2224/83851 , H01L2224/84447 , H01L2224/92244 , H01L2224/92246 , H01L2224/92247 , H01L2924/00014 , H01L2924/014 , H01L2924/12042 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13062 , H01L2924/13091 , H01L2924/15787 , H01L2924/181 , H01L2924/00 , H01L2924/0105 , H01L2924/01049 , H01L2924/01014 , H01L2924/07811 , H01L2924/01028 , H01L2924/00012 , H01L2924/01023 , H01L2224/45099
摘要： An electronic device includes a first chip carrier and a second chip carrier isolated from the first chip carrier. A first power semiconductor chip is mounted on and electrically connected to the first chip carrier. A second power semiconductor chip is mounted on and electrically connected to the second chip carrier. An electrically insulating material is configured to at least partially surround the first power semiconductor chip and the second power semiconductor chip. An electrical interconnect is configured to electrically connect the first power semiconductor chip to the second power semiconductor chip, wherein the electrical interconnect has at least one of a contact clip and a galvanically deposited conductor.
摘要翻译： 电子设备包括与第一芯片载体隔离的第一芯片载体和第二芯片载体。 第一功率半导体芯片安装在电连接到第一芯片载体上。 第二功率半导体芯片安装在第二芯片载体上并电连接到第二芯片载体。 电绝缘材料被配置为至少部分地围绕第一功率半导体芯片和第二功率半导体芯片。 电互连被配置为将第一功率半导体芯片电连接到第二功率半导体芯片，其中电互连具有接触夹和电沉积导体中的至少一个。
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公开(公告)号：US20130256856A1
公开(公告)日：2013-10-03
申请号：US13431125
申请日：2012-03-27
申请人： Joachim Mahler , Thomas Bemmerl , Anton Prueckl
发明人： Joachim Mahler , Thomas Bemmerl , Anton Prueckl
IPC分类号： H01L23/495 , H01L21/50 , H01L23/48
CPC分类号： H01L21/76877 , H01L21/76816 , H01L23/13 , H01L23/3107 , H01L23/4334 , H01L23/49513 , H01L23/49517 , H01L23/49524 , H01L23/49562 , H01L23/49575 , H01L23/49833 , H01L24/05 , H01L24/24 , H01L24/29 , H01L24/32 , H01L24/35 , H01L24/37 , H01L24/40 , H01L24/41 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/82 , H01L24/92 , H01L25/072 , H01L25/50 , H01L2224/04026 , H01L2224/04034 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05664 , H01L2224/05666 , H01L2224/05669 , H01L2224/05671 , H01L2224/224 , H01L2224/24011 , H01L2224/2402 , H01L2224/24105 , H01L2224/24155 , H01L2224/24175 , H01L2224/244 , H01L2224/291 , H01L2224/29111 , H01L2224/29139 , H01L2224/29144 , H01L2224/29147 , H01L2224/2919 , H01L2224/29294 , H01L2224/29311 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/32225 , H01L2224/32245 , H01L2224/35 , H01L2224/352 , H01L2224/3701 , H01L2224/37113 , H01L2224/37118 , H01L2224/37139 , H01L2224/37144 , H01L2224/37147 , H01L2224/37155 , H01L2224/3716 , H01L2224/37164 , H01L2224/37169 , H01L2224/40095 , H01L2224/40155 , H01L2224/40175 , H01L2224/40245 , H01L2224/40499 , H01L2224/41171 , H01L2224/48155 , H01L2224/48175 , H01L2224/49171 , H01L2224/73263 , H01L2224/73265 , H01L2224/73267 , H01L2224/82104 , H01L2224/82105 , H01L2224/82106 , H01L2224/83447 , H01L2224/83801 , H01L2224/8385 , H01L2224/83851 , H01L2224/84447 , H01L2224/92244 , H01L2224/92246 , H01L2224/92247 , H01L2924/00014 , H01L2924/014 , H01L2924/12042 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13062 , H01L2924/13091 , H01L2924/15787 , H01L2924/181 , H01L2924/00 , H01L2924/0105 , H01L2924/01049 , H01L2924/01014 , H01L2924/07811 , H01L2924/01028 , H01L2924/00012 , H01L2924/01023 , H01L2224/45099
摘要： An electronic device includes a first chip carrier and a second chip carrier isolated from the first chip carrier. A first power semiconductor chip is mounted on and electrically connected to the first chip carrier. A second power semiconductor chip is mounted on and electrically connected to the second chip carrier. An electrically insulating material is configured to at least partially surround the first power semiconductor chip and the second power semiconductor chip. An electrical interconnect is configured to electrically connect the first power semiconductor chip to the second power semiconductor chip, wherein the electrical interconnect has at least one of a contact clip and a galvanically deposited conductor.
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公开(公告)号：US20150064844A1
公开(公告)日：2015-03-05
申请号：US14543557
申请日：2014-11-17
发明人： Joachim Mahler , Thomas Bemmerl , Anton Prueckl
IPC分类号： H01L21/768 , H01L25/00
CPC分类号： H01L21/76877 , H01L21/76816 , H01L23/13 , H01L23/3107 , H01L23/4334 , H01L23/49513 , H01L23/49517 , H01L23/49524 , H01L23/49562 , H01L23/49575 , H01L23/49833 , H01L24/05 , H01L24/24 , H01L24/29 , H01L24/32 , H01L24/35 , H01L24/37 , H01L24/40 , H01L24/41 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/82 , H01L24/92 , H01L25/072 , H01L25/50 , H01L2224/04026 , H01L2224/04034 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05664 , H01L2224/05666 , H01L2224/05669 , H01L2224/05671 , H01L2224/224 , H01L2224/24011 , H01L2224/2402 , H01L2224/24105 , H01L2224/24155 , H01L2224/24175 , H01L2224/244 , H01L2224/291 , H01L2224/29111 , H01L2224/29139 , H01L2224/29144 , H01L2224/29147 , H01L2224/2919 , H01L2224/29294 , H01L2224/29311 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/32225 , H01L2224/32245 , H01L2224/35 , H01L2224/352 , H01L2224/3701 , H01L2224/37113 , H01L2224/37118 , H01L2224/37139 , H01L2224/37144 , H01L2224/37147 , H01L2224/37155 , H01L2224/3716 , H01L2224/37164 , H01L2224/37169 , H01L2224/40095 , H01L2224/40155 , H01L2224/40175 , H01L2224/40245 , H01L2224/40499 , H01L2224/41171 , H01L2224/48155 , H01L2224/48175 , H01L2224/49171 , H01L2224/73263 , H01L2224/73265 , H01L2224/73267 , H01L2224/82104 , H01L2224/82105 , H01L2224/82106 , H01L2224/83447 , H01L2224/83801 , H01L2224/8385 , H01L2224/83851 , H01L2224/84447 , H01L2224/92244 , H01L2224/92246 , H01L2224/92247 , H01L2924/00014 , H01L2924/014 , H01L2924/12042 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13062 , H01L2924/13091 , H01L2924/15787 , H01L2924/181 , H01L2924/00 , H01L2924/0105 , H01L2924/01049 , H01L2924/01014 , H01L2924/07811 , H01L2924/01028 , H01L2924/00012 , H01L2924/01023 , H01L2224/45099
摘要： An electronic device includes a first chip carrier and a second chip carrier isolated from the first chip carrier. A first power semiconductor chip is mounted on and electrically connected to the first chip carrier. A second power semiconductor chip is mounted on and electrically connected to the second chip carrier. An electrically insulating material is configured to at least partially surround the first power semiconductor chip and the second power semiconductor chip. An electrical interconnect is configured to electrically connect the first power semiconductor chip to the second power semiconductor chip, wherein the electrical interconnect has at least one of a contact clip and a galvanically deposited conductor.
摘要翻译： 电子设备包括与第一芯片载体隔离的第一芯片载体和第二芯片载体。 第一功率半导体芯片安装在电连接到第一芯片载体上。 第二功率半导体芯片安装在第二芯片载体上并电连接到第二芯片载体。 电绝缘材料被配置为至少部分地围绕第一功率半导体芯片和第二功率半导体芯片。 电互连被配置为将第一功率半导体芯片电连接到第二功率半导体芯片，其中电互连具有接触夹和电沉积导体中的至少一个。
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公开(公告)号：US08916968B2
公开(公告)日：2014-12-23
申请号：US13431125
申请日：2012-03-27
申请人： Joachim Mahler , Thomas Bemmerl , Anton Prueckl
发明人： Joachim Mahler , Thomas Bemmerl , Anton Prueckl
IPC分类号： H01L23/34
CPC分类号： H01L21/76877 , H01L21/76816 , H01L23/13 , H01L23/3107 , H01L23/4334 , H01L23/49513 , H01L23/49517 , H01L23/49524 , H01L23/49562 , H01L23/49575 , H01L23/49833 , H01L24/05 , H01L24/24 , H01L24/29 , H01L24/32 , H01L24/35 , H01L24/37 , H01L24/40 , H01L24/41 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/82 , H01L24/92 , H01L25/072 , H01L25/50 , H01L2224/04026 , H01L2224/04034 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05664 , H01L2224/05666 , H01L2224/05669 , H01L2224/05671 , H01L2224/224 , H01L2224/24011 , H01L2224/2402 , H01L2224/24105 , H01L2224/24155 , H01L2224/24175 , H01L2224/244 , H01L2224/291 , H01L2224/29111 , H01L2224/29139 , H01L2224/29144 , H01L2224/29147 , H01L2224/2919 , H01L2224/29294 , H01L2224/29311 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/32225 , H01L2224/32245 , H01L2224/35 , H01L2224/352 , H01L2224/3701 , H01L2224/37113 , H01L2224/37118 , H01L2224/37139 , H01L2224/37144 , H01L2224/37147 , H01L2224/37155 , H01L2224/3716 , H01L2224/37164 , H01L2224/37169 , H01L2224/40095 , H01L2224/40155 , H01L2224/40175 , H01L2224/40245 , H01L2224/40499 , H01L2224/41171 , H01L2224/48155 , H01L2224/48175 , H01L2224/49171 , H01L2224/73263 , H01L2224/73265 , H01L2224/73267 , H01L2224/82104 , H01L2224/82105 , H01L2224/82106 , H01L2224/83447 , H01L2224/83801 , H01L2224/8385 , H01L2224/83851 , H01L2224/84447 , H01L2224/92244 , H01L2224/92246 , H01L2224/92247 , H01L2924/00014 , H01L2924/014 , H01L2924/12042 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13062 , H01L2924/13091 , H01L2924/15787 , H01L2924/181 , H01L2924/00 , H01L2924/0105 , H01L2924/01049 , H01L2924/01014 , H01L2924/07811 , H01L2924/01028 , H01L2924/00012 , H01L2924/01023 , H01L2224/45099
摘要： An electronic device includes a first chip carrier and a second chip carrier isolated from the first chip carrier. A first power semiconductor chip is mounted on and electrically connected to the first chip carrier. A second power semiconductor chip is mounted on and electrically connected to the second chip carrier. An electrically insulating material is configured to at least partially surround the first power semiconductor chip and the second power semiconductor chip. An electrical interconnect is configured to electrically connect the first power semiconductor chip to the second power semiconductor chip, wherein the electrical interconnect has at least one of a contact clip and a galvanically deposited conductor.
摘要翻译： 电子设备包括与第一芯片载体隔离的第一芯片载体和第二芯片载体。 第一功率半导体芯片安装在电连接到第一芯片载体上。 第二功率半导体芯片安装在第二芯片载体上并电连接到第二芯片载体。 电绝缘材料被配置为至少部分地围绕第一功率半导体芯片和第二功率半导体芯片。 电互连被配置为将第一功率半导体芯片电连接到第二功率半导体芯片，其中电互连具有接触夹和电沉积导体中的至少一个。
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