公开(公告)号：US20130256856A1

公开(公告)日：2013-10-03

申请号：US13431125

申请日：2012-03-27

申请人： Joachim Mahler ,  Thomas Bemmerl ,  Anton Prueckl

发明人： Joachim Mahler ,  Thomas Bemmerl ,  Anton Prueckl

IPC分类号： H01L23/495 ,  H01L21/50 ,  H01L23/48

CPC分类号： H01L21/76877 ,  H01L21/76816 ,  H01L23/13 ,  H01L23/3107 ,  H01L23/4334 ,  H01L23/49513 ,  H01L23/49517 ,  H01L23/49524 ,  H01L23/49562 ,  H01L23/49575 ,  H01L23/49833 ,  H01L24/05 ,  H01L24/24 ,  H01L24/29 ,  H01L24/32 ,  H01L24/35 ,  H01L24/37 ,  H01L24/40 ,  H01L24/41 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/82 ,  H01L24/92 ,  H01L25/072 ,  H01L25/50 ,  H01L2224/04026 ,  H01L2224/04034 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/05666 ,  H01L2224/05669 ,  H01L2224/05671 ,  H01L2224/224 ,  H01L2224/24011 ,  H01L2224/2402 ,  H01L2224/24105 ,  H01L2224/24155 ,  H01L2224/24175 ,  H01L2224/244 ,  H01L2224/291 ,  H01L2224/29111 ,  H01L2224/29139 ,  H01L2224/29144 ,  H01L2224/29147 ,  H01L2224/2919 ,  H01L2224/29294 ,  H01L2224/29311 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/35 ,  H01L2224/352 ,  H01L2224/3701 ,  H01L2224/37113 ,  H01L2224/37118 ,  H01L2224/37139 ,  H01L2224/37144 ,  H01L2224/37147 ,  H01L2224/37155 ,  H01L2224/3716 ,  H01L2224/37164 ,  H01L2224/37169 ,  H01L2224/40095 ,  H01L2224/40155 ,  H01L2224/40175 ,  H01L2224/40245 ,  H01L2224/40499 ,  H01L2224/41171 ,  H01L2224/48155 ,  H01L2224/48175 ,  H01L2224/49171 ,  H01L2224/73263 ,  H01L2224/73265 ,  H01L2224/73267 ,  H01L2224/82104 ,  H01L2224/82105 ,  H01L2224/82106 ,  H01L2224/83447 ,  H01L2224/83801 ,  H01L2224/8385 ,  H01L2224/83851 ,  H01L2224/84447 ,  H01L2224/92244 ,  H01L2224/92246 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13062 ,  H01L2924/13091 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/0105 ,  H01L2924/01049 ,  H01L2924/01014 ,  H01L2924/07811 ,  H01L2924/01028 ,  H01L2924/00012 ,  H01L2924/01023 ,  H01L2224/45099

摘要： An electronic device includes a first chip carrier and a second chip carrier isolated from the first chip carrier. A first power semiconductor chip is mounted on and electrically connected to the first chip carrier. A second power semiconductor chip is mounted on and electrically connected to the second chip carrier. An electrically insulating material is configured to at least partially surround the first power semiconductor chip and the second power semiconductor chip. An electrical interconnect is configured to electrically connect the first power semiconductor chip to the second power semiconductor chip, wherein the electrical interconnect has at least one of a contact clip and a galvanically deposited conductor.

公开(公告)号：US20130210181A1

公开(公告)日：2013-08-15

申请号：US13817596

申请日：2011-07-20

申请人： Stephan Preuss ,  Thomas Bemmerl

发明人： Stephan Preuss ,  Thomas Bemmerl

IPC分类号： B32B33/00 ,  H01L33/60

CPC分类号： B32B33/00 ,  B29C33/68 ,  B29C43/146 ,  B29C43/18 ,  B29C2043/147 ,  H01L33/60 ,  H01L2933/0041 ,  H01L2933/0091

摘要： A process of producing a layer composite includes a luminescence conversion layer and a scattering layer, wherein a press having a first pressing tool with a cavity and a second pressing tool is used including introducing a first polymer including a luminescence conversion substance into the cavity, inserting a film between the first and second tools, closing the press and carrying out a first pressing, hardening the first polymer to form a luminescence conversion layer in the press, opening the press, wherein the luminescence conversion layer adhering to the film remains in the press, introducing a second polymer including scattering particles into the cavity, closing the press and carrying out a second pressing, hardening the second polymer to form a scattering layer disposed on the luminescence conversion layer, opening the press, and removing the support film with the layer composite including the luminescence conversion layer and the scattering layer.

摘要翻译： 制造层复合体的方法包括发光转换层和散射层，其中使用具有带空腔的第一加压工具和第二压制工具的压力机，包括将包含发光转换物质的第一聚合物引入腔体， 在第一和第二工具之间的膜，闭合压机并进行第一次压制，硬化第一聚合物以在压机中形成发光转换层，打开压机，其中附着在膜上的发光转换层保留在压机中 将包括散射颗粒的第二聚合物引入空腔中，关闭压机并进行第二次挤压，硬化第二聚合物以形成设置在发光转换层上的散射层，打开压机，并用层除去支撑膜 复合材料包括发光转换层和散射层。

公开(公告)号：US07800241B2

公开(公告)日：2010-09-21

申请号：US11455949

申请日：2006-06-20

申请人： Michael Bauer ,  Thomas Bemmerl ,  Edward Fuergut

发明人： Michael Bauer ,  Thomas Bemmerl ,  Edward Fuergut

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L23/3142 ,  H01L23/49503 ,  H01L23/49582 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48464 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/01014 ,  H01L2924/01021 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01037 ,  H01L2924/01038 ,  H01L2924/0104 ,  H01L2924/01041 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01052 ,  H01L2924/01058 ,  H01L2924/01059 ,  H01L2924/0106 ,  H01L2924/0107 ,  H01L2924/01072 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12044 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2924/20751 ,  H01L2924/05442 ,  H01L2924/05432 ,  H01L2924/05042 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor device with semiconductor device components embedded in a plastics composition is disclosed. In one embodiment, organosilicon and organometallic compounds are used for producing an adhesion promoter layer. The adhesion promoter layer on the surfaces of the semiconductor device components of a semiconductor device has a microporous morphology and has an average thickness D of between 5 nm≦D≦300 nm. In this case, the adhesion promoter layer has nanoscale ceramic grains applied wet-chemically.

摘要翻译： 公开了一种具有嵌入塑料组合物中的半导体器件部件的半导体器件。 在一个实施方案中，有机硅和有机金属化合物用于生产粘附促进剂层。 半导体器件的半导体器件部件的表面上的粘合促进剂层具有微孔形态，并且其平均厚度D在5nm＆amp; NlE; D＆amp; NlE; 300nm之间。 在这种情况下，粘合促进剂层具有湿法化学涂覆的纳米级陶瓷颗粒。

公开(公告)号：US07420262B2

公开(公告)日：2008-09-02

申请号：US10789033

申请日：2004-02-27

申请人： Michael Bauer ,  Peter Strobel ,  Gerald Ofner ,  Edward Fürgut ,  Simon Jerebic ,  Thomas Bemmerl ,  Markus Fink ,  Hermann Vilsmeier

发明人： Michael Bauer ,  Peter Strobel ,  Gerald Ofner ,  Edward Fürgut ,  Simon Jerebic ,  Thomas Bemmerl ,  Markus Fink ,  Hermann Vilsmeier

IPC分类号： H01L21/66

CPC分类号： H01L24/16 ,  H01L21/78 ,  H01L23/3185 ,  H01L23/481 ,  H01L24/02 ,  H01L24/11 ,  H01L24/81 ,  H01L25/0657 ,  H01L2224/0401 ,  H01L2224/131 ,  H01L2224/16105 ,  H01L2224/16108 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06551 ,  H01L2924/01005 ,  H01L2924/01014 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01068 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/05042 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/3011 ,  H01L2924/00

摘要： The invention relates to an electronic component and a semiconductor wafer, and a method for producing them. The semiconductor wafer has strip-type separating regions. The separating regions are provided with through contacts in the direction of the rear side of the semiconductor wafer. The semiconductor chip separated from such a semiconductor wafer constitutes an electronic component with external contacts in the form of edge contacts. Such an electronic component of semiconductor chip size can be used in diverse ways.

摘要翻译： 本发明涉及电子元件和半导体晶片及其制造方法。 半导体晶片具有带状分离区域。 分离区域在半导体晶片的后侧的方向上设置有贯通触点。 与这种半导体晶片分离的半导体芯片构成具有边缘接触形式的外部触点的电子部件。 这种半导体芯片尺寸的电子部件可以以各种方式使用。

公开(公告)号：US09681566B2

公开(公告)日：2017-06-13

申请号：US13700414

申请日：2011-04-13

申请人： Thomas Bemmerl ,  Simon Jerebic ,  Markus Pindl

发明人： Thomas Bemmerl ,  Simon Jerebic ,  Markus Pindl

IPC分类号： H05K7/02 ,  H01L33/44 ,  H01L23/00

CPC分类号： H01L24/32 ,  H01L21/56 ,  H01L23/3142 ,  H01L24/83 ,  H01L25/167 ,  H01L33/06 ,  H01L33/32 ,  H01L33/44 ,  H01L33/507 ,  H01L33/54 ,  H01L33/56 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83951 ,  H01L2924/12041 ,  H01L2924/1434 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2933/005 ,  H01L2933/0066 ,  H01L2933/0091 ,  H05K7/02 ,  H01L2924/00

摘要： An electronic arrangement (1) comprising a carrier (2), on which at least one connecting area (6) is arranged. At least one electronic component (3a, 3b, 3c) is fixed on the connecting area (6) by means of a contact material (4). A covering area (5) surrounds the connecting area (6) on the carrier (2). At least one covered region (15, 16, 17, 18, 19) is covered by a covering material (10). The covering material (10) is designed in such a way that an optical contrast between the covering area (5) and the covered region (15, 16, 17, 18, 19) is minimized.

公开(公告)号：US08916968B2

公开(公告)日：2014-12-23

申请号：US13431125

申请日：2012-03-27

申请人： Joachim Mahler ,  Thomas Bemmerl ,  Anton Prueckl

发明人： Joachim Mahler ,  Thomas Bemmerl ,  Anton Prueckl

IPC分类号： H01L23/34

CPC分类号： H01L21/76877 ,  H01L21/76816 ,  H01L23/13 ,  H01L23/3107 ,  H01L23/4334 ,  H01L23/49513 ,  H01L23/49517 ,  H01L23/49524 ,  H01L23/49562 ,  H01L23/49575 ,  H01L23/49833 ,  H01L24/05 ,  H01L24/24 ,  H01L24/29 ,  H01L24/32 ,  H01L24/35 ,  H01L24/37 ,  H01L24/40 ,  H01L24/41 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/82 ,  H01L24/92 ,  H01L25/072 ,  H01L25/50 ,  H01L2224/04026 ,  H01L2224/04034 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/05666 ,  H01L2224/05669 ,  H01L2224/05671 ,  H01L2224/224 ,  H01L2224/24011 ,  H01L2224/2402 ,  H01L2224/24105 ,  H01L2224/24155 ,  H01L2224/24175 ,  H01L2224/244 ,  H01L2224/291 ,  H01L2224/29111 ,  H01L2224/29139 ,  H01L2224/29144 ,  H01L2224/29147 ,  H01L2224/2919 ,  H01L2224/29294 ,  H01L2224/29311 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/35 ,  H01L2224/352 ,  H01L2224/3701 ,  H01L2224/37113 ,  H01L2224/37118 ,  H01L2224/37139 ,  H01L2224/37144 ,  H01L2224/37147 ,  H01L2224/37155 ,  H01L2224/3716 ,  H01L2224/37164 ,  H01L2224/37169 ,  H01L2224/40095 ,  H01L2224/40155 ,  H01L2224/40175 ,  H01L2224/40245 ,  H01L2224/40499 ,  H01L2224/41171 ,  H01L2224/48155 ,  H01L2224/48175 ,  H01L2224/49171 ,  H01L2224/73263 ,  H01L2224/73265 ,  H01L2224/73267 ,  H01L2224/82104 ,  H01L2224/82105 ,  H01L2224/82106 ,  H01L2224/83447 ,  H01L2224/83801 ,  H01L2224/8385 ,  H01L2224/83851 ,  H01L2224/84447 ,  H01L2224/92244 ,  H01L2224/92246 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13062 ,  H01L2924/13091 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/0105 ,  H01L2924/01049 ,  H01L2924/01014 ,  H01L2924/07811 ,  H01L2924/01028 ,  H01L2924/00012 ,  H01L2924/01023 ,  H01L2224/45099

摘要： An electronic device includes a first chip carrier and a second chip carrier isolated from the first chip carrier. A first power semiconductor chip is mounted on and electrically connected to the first chip carrier. A second power semiconductor chip is mounted on and electrically connected to the second chip carrier. An electrically insulating material is configured to at least partially surround the first power semiconductor chip and the second power semiconductor chip. An electrical interconnect is configured to electrically connect the first power semiconductor chip to the second power semiconductor chip, wherein the electrical interconnect has at least one of a contact clip and a galvanically deposited conductor.

摘要翻译： 电子设备包括与第一芯片载体隔离的第一芯片载体和第二芯片载体。 第一功率半导体芯片安装在电连接到第一芯片载体上。 第二功率半导体芯片安装在第二芯片载体上并电连接到第二芯片载体。 电绝缘材料被配置为至少部分地围绕第一功率半导体芯片和第二功率半导体芯片。 电互连被配置为将第一功率半导体芯片电连接到第二功率半导体芯片，其中电互连具有接触夹和电沉积导体中的至少一个。

公开(公告)号：US08748201B2

公开(公告)日：2014-06-10

申请号：US13817596

申请日：2011-07-20

申请人： Stephan Preuss ,  Thomas Bemmerl

发明人： Stephan Preuss ,  Thomas Bemmerl

IPC分类号： H01L33/60

CPC分类号： B32B33/00 ,  B29C33/68 ,  B29C43/146 ,  B29C43/18 ,  B29C2043/147 ,  H01L33/60 ,  H01L2933/0041 ,  H01L2933/0091

摘要： A process of producing a layer composite includes a luminescence conversion layer and a scattering layer, wherein a press having a first pressing tool with a cavity and a second pressing tool is used including introducing a first polymer including a luminescence conversion substance into the cavity, inserting a film between the first and second tools, closing the press and carrying out a first pressing, hardening the first polymer to form a luminescence conversion layer in the press, opening the press, wherein the luminescence conversion layer adhering to the film remains in the press, introducing a second polymer including scattering particles into the cavity, closing the press and carrying out a second pressing, hardening the second polymer to form a scattering layer disposed on the luminescence conversion layer, opening the press, and removing the support film with the layer composite including the luminescence conversion layer and the scattering layer.

摘要翻译： 制造层复合体的方法包括发光转换层和散射层，其中使用具有带空腔的第一加压工具和第二压制工具的压力机，包括将包含发光转换物质的第一聚合物引入腔体， 在第一和第二工具之间的膜，闭合压机并进行第一次压制，硬化第一聚合物以在压机中形成发光转换层，打开压机，其中附着在膜上的发光转换层保留在压机中 将包括散射颗粒的第二聚合物引入空腔中，关闭压机并进行第二次挤压，硬化第二聚合物以形成设置在发光转换层上的散射层，打开压机，并用层除去支撑膜 复合材料包括发光转换层和散射层。

公开(公告)号：US20120162783A1

公开(公告)日：2012-06-28

申请号：US13263104

申请日：2010-03-05

申请人： Thomas Bemmerl ,  Ulrich Streppel ,  Bert Braune

发明人： Thomas Bemmerl ,  Ulrich Streppel ,  Bert Braune

IPC分类号： G02B13/20 ,  B29D11/00

CPC分类号： G02B3/00 ,  F21K9/64 ,  F21V5/04 ,  F21Y2115/10 ,  G02B3/04 ,  G02B5/02 ,  G02B5/0278 ,  G02B19/0014 ,  G02B19/0061 ,  H01L33/58 ,  H01L2924/0002 ,  H01L2933/0091 ,  Y10S362/80 ,  H01L2924/00

摘要： A lens includes a main body and a potting material. The main body includes a first major face, a second major face and at least one cavity arranged on the first major face. The potting material is arranged in the cavity and includes at least one diffuser which scatters radiation of at least one wavelength range.

摘要翻译： 透镜包括主体和灌封材料。 主体包括第一主面，第二主面和布置在第一主面上的至少一个腔。 灌封材料布置在空腔中并且包括散射至少一个波长范围的辐射的至少一个扩散器。

公开(公告)号：US20090152694A1

公开(公告)日：2009-06-18

申请号：US11954590

申请日：2007-12-12

申请人： Thomas Bemmerl ,  Thomas Mende ,  Bernd Rakow

发明人： Thomas Bemmerl ,  Thomas Mende ,  Bernd Rakow

IPC分类号： H01L23/495 ,  H01L21/60

CPC分类号： H01L23/49541 ,  H01L23/49531 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48253 ,  H01L2224/484 ,  H01L2224/48599 ,  H01L2224/4911 ,  H01L2224/49175 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/85399 ,  H01L2224/05599

摘要： Embodiments provide an electronic device. The electronic device includes a leadframe having a first face that defines an island and multiple leads configured to communicate with a chip attached to the island, a first structure element separate from and coupled to a first face of the leadframe, at least one electrical connector coupled between the chip and the first structure element, and at least one electrical connector coupled between the first structure element and one of the multiple leads.

摘要翻译： 实施例提供电子设备。 电子设备包括引线框架，其具有限定岛的第一面和被配置为与附接到岛的芯片通信的多个引线，与引线框架的第一面分离并耦合到引线框的第一面的第一结构元件，至少一个电连接器 在所述芯片和所述第一结构元件之间，以及耦合在所述第一结构元件和所述多个引线中的一个之间的至少一个电连接器。

公开(公告)号：US20070052112A1

公开(公告)日：2007-03-08

申请号：US10565259

申请日：2005-05-17

申请人： Michael Bauer ,  Thomas Bemmerl ,  Edward Fuergut ,  Simon Jerebic ,  Herman Vilsmeier

发明人： Michael Bauer ,  Thomas Bemmerl ,  Edward Fuergut ,  Simon Jerebic ,  Herman Vilsmeier

IPC分类号： H01L23/48

CPC分类号： H05K3/3478 ,  B23K3/0623 ,  B23K2101/40 ,  H01L21/4853 ,  H01L21/6835 ,  H01L23/3128 ,  H01L23/49805 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L25/105 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/11003 ,  H01L2224/11334 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01052 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H05K2201/0108 ,  H05K2203/0338 ,  H05K2203/041 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599

摘要： The invention relates to a support (4) with solder ball elements (1) for loading substrates (2) with ball contacts. Furthermore, the invention relates to a system for loading substrates (2) with ball contacts and to a method for loading substrates (2) with ball contacts. For this purpose, the support (4) has a layer of adhesive (5) applied on one side, the layer of adhesive (5) losing its adhesive force to the greatest extent when irradiated. Furthermore, the support (4) has solder ball elements (1), which are arranged closely packed in rows (6) and columns (7) on the layer of adhesive (5) in a prescribed pitch (w) for a semiconductor chip or a semiconductor component.

摘要翻译： 本发明涉及一种具有用于加载具有球接触件的基板（2）的焊球元件（1）的支撑件（4）。 此外，本发明涉及一种用于装载具有球接触件的基板（2）的系统以及用于将基板（2）与球接触件一起加载的方法。 为此，支撑体（4）具有一侧施加的粘合剂层（5），当照射时，粘合剂层（5）最大程度地失去其粘合力。 此外，支撑件（4）具有焊料球元件（1），其以规定的用于半导体芯片的间距（w）紧密地排列在粘合剂层（5）上的行（6）和列（7）中，或 半导体元件。