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公开(公告)号：US12112957B2
公开(公告)日：2024-10-08
申请号：US17252136
申请日：2019-04-08
Applicant: KOBAYASHI & CO., LTD.
Inventor： Keisuke Sakai , Norifumi Iwawaki , Nanae Tanaka , Satoshi Hiramatsu , Akane Kawafuchi
CPC classification number: H01L21/566 , B29C33/68 , H01L23/293
Abstract: To provide a release film not to contaminate a mold or a molded article. The present invention provides a release film comprising a base layer formed of an easily moldable polyethylene terephthalate resin and surface layers laminated on two faces of the base layer and formed of a fluororesin. The present invention also provides a method of manufacturing a release film. The method comprises an applying step of applying a fluororesin composition onto two faces of a base layer formed of an easily moldable polyethylene terephthalate resin and, after the applying step, a curing step of curing the fluororesin composition. By molding with the release film, contamination of a mold or a molded article is prevented. The release film can be used in molding multiple times.
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公开(公告)号：US11993688B2
公开(公告)日：2024-05-28
申请号：US17435200
申请日：2020-03-25
Applicant: Toray Industries, Inc.
Inventor： Hideto Mitsuoka , Yuji Ozeki
IPC: C08J5/24 , B29C33/68 , B29C70/42 , B29C71/00 , B29K63/00 , B29K105/08 , B29K307/04 , B32B5/02 , B32B5/26 , B32B7/12 , B32B15/085 , B32B15/18 , B32B27/12 , B32B27/32 , C08J5/12
CPC classification number: C08J5/243 , B29C33/68 , B29C70/42 , B29C71/009 , B32B5/024 , B32B5/263 , B32B7/12 , B32B15/085 , B32B15/18 , B32B27/12 , B32B27/32 , C08J5/128 , B29K2063/00 , B29K2105/0881 , B29K2307/04 , B32B2260/021 , B32B2260/046 , B32B2262/106 , B32B2307/538 , B32B2307/542 , C08J2323/12 , C08J2323/20 , C08J2463/00
Abstract: A molded article of a carbon fiber composite material includes at least carbon fibers and a resin composition. The molded article of a carbon fiber composite material is characterized in that the surface roughness Ra thereof is 0.01-2 μm and in that the tensile shear adhesive strength (F0) thereof when a metal has been adhered to the surface thereof via an adhesive layer that contains an epoxy compound and is 0.1-3 mm thick is 10-40 MPa.
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公开(公告)号：US20240059005A1
公开(公告)日：2024-02-22
申请号：US18339466
申请日：2023-06-22
Applicant: BAY MATERIALS, LLC.
Inventor： Ray F. Stewart , John Lahlouh
CPC classification number: B29C51/445 , B29C33/68 , B29C51/002 , B29C51/14 , B29C51/32 , B29C51/428 , B29C2793/009
Abstract: The present invention relates to the field of printed circuit board technologies. A printed circuit board with good heat dissipation performance is provided in embodiments and includes a substrate serving as a board body of the printed circuit board, a heating component embedded in the substrate, and a cooling liquid channel disposed in the substrate. The cooling liquid channel is disposed in the printed circuit board, and passes around the heating component to exchange heat with the heating component, so that a heat dissipation path is shortened and heat dissipation efficiency is improved, thereby quickening heat dissipation of the printed circuit board, and prolonging a service life of the printed circuit board.
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公开(公告)号：US20240006198A1
公开(公告)日：2024-01-04
申请号：US18446900
申请日：2023-08-09
Applicant: Samsung Electronics Co., Ltd.
Inventor： Hwansoo LEE , Minsang PARK , Hoon CHANG , Byeonggon KIM , Sunghwa JUNG
CPC classification number: H01L21/67126 , B29C33/18 , B29C33/10 , B29C33/68 , B29L2031/3406
Abstract: A die device for molding a plurality of semiconductor chips is provided. The die device includes a lower die including a moving plate that has a plurality of V-groove structures for suctioning a release film coated with a resin, and an upper die which descends to the lower die or ascends from the lower die, thereby closing/opening the dies. The upper die includes at least a plurality of suction vent units for suctioning a substrate on which the semiconductor chips are arranged, and the lower die includes a device for manually adjusting the tension of a spring that supports the moving plate.
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公开(公告)号：US11724423B2
公开(公告)日：2023-08-15
申请号：US17718173
申请日：2022-04-11
Applicant: Mitsubishi Chemical Corporation
Inventor： Nobuaki Sasaki , Yoshihide Sato
Abstract: Provided is a mold release film capable of transferring a concave-convex structure to the surface of an adhesive film.
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Patent Agency Ranking
公开(公告)号：US11673295B2
公开(公告)日：2023-06-13
申请号：US16883302
申请日：2020-05-26
Applicant: Mitsubishi Chemical Corporation
Inventor： Nobuaki Sasaki , Yoshihide Sato
Abstract: Provided is a mold release film capable of transferring a concave-convex structure to the surface of an adhesive film.
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公开(公告)号：US10052845B2
公开(公告)日：2018-08-21
申请号：US14771664
申请日：2015-03-10
Applicant: SEKISUI PLASTICS CO., LTD.
Inventor： Kazutoshi Hitomi , Yusuke Kuwabara , Yoichiro Fukunaga
IPC: B32B5/18 , B32B5/24 , B32B5/28 , B29C43/18 , B29C51/14 , B29C44/20 , B29C47/00 , B32B27/36 , B32B27/06 , B32B27/38 , B29C70/46 , B29C43/20 , B29K67/00 , B29K105/04 , B29K63/00 , B29K105/08 , B29L31/30 , B29C47/02 , B32B5/02 , B32B5/14 , B32B5/16 , B32B5/30 , B32B7/12 , B32B27/12 , B32B27/32 , B32B1/00 , B32B3/06 , B29C33/68
CPC classification number: B32B5/18 , B29C33/68 , B29C43/203 , B29C44/1228 , B29C44/353 , B29C48/0022 , B29C48/15 , B29C51/14 , B29C70/46 , B29C70/86 , B29C2793/0036 , B29C2793/009 , B29K2025/06 , B29K2063/00 , B29K2067/003 , B29K2067/046 , B29K2069/00 , B29K2105/04 , B29K2105/08 , B29K2105/089 , B29K2703/00 , B29K2995/004 , B29K2995/0063 , B29K2995/0097 , B29L2031/30 , B29L2031/44 , B32B1/00 , B32B3/06 , B32B5/022 , B32B5/024 , B32B5/026 , B32B5/142 , B32B5/16 , B32B5/245 , B32B5/30 , B32B7/12 , B32B27/065 , B32B27/12 , B32B27/322 , B32B27/36 , B32B27/38 , B32B2250/03 , B32B2250/40 , B32B2260/021 , B32B2260/046 , B32B2262/0269 , B32B2262/101 , B32B2262/106 , B32B2264/0257 , B32B2264/102 , B32B2266/0228 , B32B2266/0242 , B32B2266/0264 , B32B2307/306 , B32B2307/54 , B32B2307/542 , B32B2307/558 , B32B2307/714 , B32B2307/72 , B32B2307/732 , B32B2307/738 , B32B2605/00 , B32B2605/08
Abstract: A resin composite in which the flatness ratio of cells in a corner section of a core material is 20% or more is provided.
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公开(公告)号：US09859133B2
公开(公告)日：2018-01-02
申请号：US15061044
申请日：2016-03-04
Applicant: Asahi Glass Company, Limited
Inventor： Wataru Kasai , Masami Suzuki
CPC classification number: H01L21/566 , B29C33/68 , B29L2031/3406 , C08F214/265 , C08J5/18 , H01L23/3121 , H01L24/97 , H01L2224/48091 , H01L2224/48227 , H01L2924/181 , H01L2924/00014 , H01L2924/00012
Abstract: A mold release film, which is excellent in releasability and capable of suppressing contamination of a mold or a resin-encapsulation portion by the mold release film and forming a resin-encapsulation portion excellent in adhesion to an ink layer, is provided. The mold release film is disposed on a cavity surface of a mold, in which a semiconductor element is disposed and encapsulated with a curable resin to form a resin-encapsulation portion. The mold release film has a first surface in contact with the curable resin when the resin-encapsulation portion is formed, and a second surface in contact with the cavity surface. At least the first surface is made of a fluororesin. The mold release film has an F/Al ratio of from 0.2 to 4, or an F/(C+F+O) ratio of from 0.1 to 0.3. A process for producing a semiconductor package using the mold release film is also provided.
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公开(公告)号：US20170157803A1
公开(公告)日：2017-06-08
申请号：US15320822
申请日：2015-07-06
Applicant: Toray Industries, Inc.
Inventor： Takuya Kuma , Kazuma Okada , Yasuyuki Imanishi , Masatoshi Ohkura
CPC classification number: B29C33/68 , B29K2823/12 , B29K2995/0072 , B29K2995/0077 , B32B7/04 , B32B27/00 , B32B27/08 , B32B27/20 , B32B27/281 , B32B27/32 , B32B27/34 , B32B27/36 , B32B2250/02 , B32B2250/03 , B32B2250/242 , B32B2250/40 , B32B2264/0214 , B32B2264/0235 , B32B2264/025 , B32B2264/0278 , B32B2264/0292 , B32B2264/10 , B32B2264/102 , B32B2264/104 , B32B2307/30 , B32B2307/538 , B32B2307/54 , B32B2307/748
Abstract: A polypropylene film includes a surface layer (I) with polypropylene as a main component at least on one face of a base layer. Surface free energy of the surface layer (I) is 15 mN/m or more and less than 28 mN/m. A mold release film includes a polypropylene film including a surface layer (I) with polypropylene as a main component at least on one face of a base layer, wherein surface free energy of the surface layer (I) is 15 mN/m or more and less than 28 mN/M.
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公开(公告)号：US20160361893A1
公开(公告)日：2016-12-15
申请号：US14771664
申请日：2015-03-10
Applicant: SEKISUI PLASTICS CO. , LTD.
Inventor： Kazutoshi HITOMI , Yusuke KUWABARA , Yoichiro FUKUNAGA
CPC classification number: B32B5/18 , B29C33/68 , B29C43/203 , B29C44/1228 , B29C44/353 , B29C47/0066 , B29C47/02 , B29C51/14 , B29C70/46 , B29C70/86 , B29C2793/0036 , B29C2793/009 , B29K2025/06 , B29K2063/00 , B29K2067/003 , B29K2067/046 , B29K2069/00 , B29K2105/04 , B29K2105/08 , B29K2105/089 , B29K2703/00 , B29K2995/004 , B29K2995/0063 , B29K2995/0097 , B29L2031/30 , B29L2031/44 , B32B1/00 , B32B3/06 , B32B5/022 , B32B5/024 , B32B5/026 , B32B5/142 , B32B5/16 , B32B5/245 , B32B5/30 , B32B7/12 , B32B27/065 , B32B27/12 , B32B27/322 , B32B27/36 , B32B27/38 , B32B2250/03 , B32B2250/40 , B32B2260/021 , B32B2260/046 , B32B2262/0269 , B32B2262/101 , B32B2262/106 , B32B2264/0257 , B32B2264/102 , B32B2266/0228 , B32B2266/0242 , B32B2266/0264 , B32B2307/306 , B32B2307/54 , B32B2307/542 , B32B2307/558 , B32B2307/714 , B32B2307/72 , B32B2307/732 , B32B2307/738 , B32B2605/00 , B32B2605/08
Abstract: A resin composite in which the flatness ratio of cells in a corner section of a core material is 20% or more is provided.
Abstract translation: 提供了芯材的角部的细胞的平坦度比为20％以上的树脂复合体。
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