公开(公告)号：US11990438B2

公开(公告)日：2024-05-21

申请号：US17984748

申请日：2022-11-10

Applicant: X Display Company Technology Limited

Inventor： Carl Prevatte ,  Christopher Bower ,  Ronald S. Cok ,  Matthew Meitl

IPC: H01L23/00 ,  H01L21/48 ,  H05K1/11 ,  H05K3/30 ,  H05K3/34

CPC classification number: H01L24/11 ,  H01L24/08 ,  H01L24/13 ,  H01L24/14 ,  H01L24/17 ,  H05K1/112 ,  H05K3/3436 ,  H01L21/4803 ,  H01L21/4846 ,  H01L2224/1144 ,  H01L2224/11466 ,  H01L2224/13017 ,  H01L2224/13023 ,  H01L2224/1357 ,  H01L2224/1403 ,  H01L2224/1412 ,  H01L2224/1418 ,  H01L2224/16227 ,  H01L2224/1624 ,  H01L2224/17107 ,  H01L2924/12041 ,  H01L2924/12043 ,  H01L2924/12044 ,  H01L2924/1304 ,  H05K3/305 ,  H05K2201/09409 ,  H05K2201/09472 ,  H05K2201/0979 ,  H05K2201/10143 ,  H01L2924/12041 ,  H01L2924/00012 ,  H01L2924/12044 ,  H01L2924/00012 ,  H01L2924/12043 ,  H01L2924/00012 ,  H01L2924/1304 ,  H01L2924/00012

Abstract: A component includes a plurality of electrical connections on a process side opposed to a back side of the component. Each electrical connection includes an electrically conductive multi-layer connection post protruding from the process side. A printed structure includes a destination substrate and one or more components. The destination substrate has two or more electrical contacts and each connection post is in contact with, extends into, or extends through an electrical contact of the destination substrate to electrically connect the electrical contacts to the connection posts. The connection posts or electrical contacts are deformed. Two or more connection posts can be electrically connected to a common electrical contact.

公开(公告)号：US11990435B2

公开(公告)日：2024-05-21

申请号：US17867287

申请日：2022-07-18

Applicant: Amkor Technology Singapore Holding Pte. Ltd.

Inventor： Sung Sun Park ,  Ji Young Chung ,  Christopher Berry

IPC: G06V40/13 ,  B81C3/00 ,  H01L23/00 ,  H01L23/053 ,  H01L23/31

CPC classification number: H01L24/05 ,  B81C3/00 ,  G06V40/13 ,  G06V40/1329 ,  H01L23/053 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L23/3128 ,  H01L24/03 ,  H01L24/11 ,  H01L24/13 ,  H01L24/27 ,  H01L24/29 ,  H01L24/33 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/0345 ,  H01L2224/03452 ,  H01L2224/03464 ,  H01L2224/0347 ,  H01L2224/0361 ,  H01L2224/03912 ,  H01L2224/0401 ,  H01L2224/05124 ,  H01L2224/05139 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05666 ,  H01L2224/05671 ,  H01L2224/05684 ,  H01L2224/1132 ,  H01L2224/11334 ,  H01L2224/1146 ,  H01L2224/1147 ,  H01L2224/11849 ,  H01L2224/119 ,  H01L2224/13013 ,  H01L2224/13014 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/13294 ,  H01L2224/133 ,  H01L2224/16227 ,  H01L2224/27312 ,  H01L2224/2732 ,  H01L2224/27622 ,  H01L2224/2784 ,  H01L2224/29006 ,  H01L2224/29007 ,  H01L2224/29011 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29294 ,  H01L2224/29299 ,  H01L2224/2939 ,  H01L2224/32225 ,  H01L2224/33181 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/81191 ,  H01L2224/81203 ,  H01L2224/81424 ,  H01L2224/81439 ,  H01L2224/81444 ,  H01L2224/81447 ,  H01L2224/81455 ,  H01L2224/8146 ,  H01L2224/81464 ,  H01L2224/81466 ,  H01L2224/81471 ,  H01L2224/81484 ,  H01L2224/81815 ,  H01L2224/8185 ,  H01L2224/83101 ,  H01L2224/83102 ,  H01L2224/83192 ,  H01L2224/9211 ,  H01L2224/92125 ,  H01L2224/92225 ,  H01L2924/014 ,  H01L2924/1815 ,  H01L2924/18161 ,  H01L2224/131 ,  H01L2924/014 ,  H01L2224/13147 ,  H01L2924/00014 ,  H01L2224/13111 ,  H01L2924/01082 ,  H01L2224/13111 ,  H01L2924/01082 ,  H01L2924/01047 ,  H01L2224/13111 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2224/13111 ,  H01L2924/01029 ,  H01L2224/13111 ,  H01L2924/01047 ,  H01L2224/13111 ,  H01L2924/01079 ,  H01L2224/13111 ,  H01L2924/01083 ,  H01L2224/13111 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2224/13111 ,  H01L2924/01047 ,  H01L2924/01083 ,  H01L2224/13111 ,  H01L2924/0103 ,  H01L2224/13111 ,  H01L2924/0103 ,  H01L2924/01083 ,  H01L2224/11334 ,  H01L2924/00014 ,  H01L2224/1146 ,  H01L2924/00014 ,  H01L2224/1132 ,  H01L2924/00014 ,  H01L2224/11849 ,  H01L2924/00014 ,  H01L2224/05647 ,  H01L2924/00014 ,  H01L2224/05624 ,  H01L2924/00014 ,  H01L2224/05639 ,  H01L2924/00014 ,  H01L2224/05644 ,  H01L2924/00014 ,  H01L2224/05655 ,  H01L2924/00014 ,  H01L2224/0345 ,  H01L2924/00014 ,  H01L2224/03464 ,  H01L2924/00014 ,  H01L2224/03452 ,  H01L2924/00014 ,  H01L2224/05147 ,  H01L2924/00014 ,  H01L2224/05124 ,  H01L2924/00014 ,  H01L2224/05139 ,  H01L2924/00014 ,  H01L2224/05144 ,  H01L2924/00014 ,  H01L2224/05155 ,  H01L2924/00014 ,  H01L2224/0347 ,  H01L2924/00014 ,  H01L2224/1147 ,  H01L2924/00014 ,  H01L2224/05666 ,  H01L2924/01074 ,  H01L2224/05671 ,  H01L2924/00014 ,  H01L2224/05666 ,  H01L2924/01028 ,  H01L2224/0361 ,  H01L2924/00014 ,  H01L2224/119 ,  H01L2224/034 ,  H01L2224/1147 ,  H01L2224/034 ,  H01L2224/114 ,  H01L2224/0361 ,  H01L2224/13294 ,  H01L2924/00014 ,  H01L2224/133 ,  H01L2924/014 ,  H01L2224/81203 ,  H01L2924/00014 ,  H01L2224/81815 ,  H01L2924/00014 ,  H01L2224/2919 ,  H01L2924/0665 ,  H01L2224/2929 ,  H01L2924/0665 ,  H01L2224/2919 ,  H01L2924/07025 ,  H01L2224/2929 ,  H01L2924/07025 ,  H01L2224/2919 ,  H01L2924/069 ,  H01L2224/2929 ,  H01L2924/069 ,  H01L2224/83102 ,  H01L2924/00014 ,  H01L2224/83101 ,  H01L2924/00014 ,  H01L2224/9211 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2224/29294 ,  H01L2924/00014 ,  H01L2224/2939 ,  H01L2924/00014 ,  H01L2224/29299 ,  H01L2924/00014 ,  H01L2224/27622 ,  H01L2924/00014 ,  H01L2224/2732 ,  H01L2924/00014 ,  H01L2224/27312 ,  H01L2924/00014 ,  H01L2224/81447 ,  H01L2924/00014 ,  H01L2224/81424 ,  H01L2924/00014 ,  H01L2224/81455 ,  H01L2924/00014 ,  H01L2224/8146 ,  H01L2924/00014 ,  H01L2224/81439 ,  H01L2924/00014 ,  H01L2224/81464 ,  H01L2924/00014 ,  H01L2224/81484 ,  H01L2924/00014 ,  H01L2224/81444 ,  H01L2924/00014 ,  H01L2224/81466 ,  H01L2924/00014 ,  H01L2224/81471 ,  H01L2924/00014 ,  H01L2224/8185 ,  H01L2924/00012 ,  H01L2224/05166 ,  H01L2924/00014 ,  H01L2224/05684 ,  H01L2924/00014

Abstract: A fingerprint sensor device and a method of making a fingerprint sensor device. As non-limiting examples, various aspects of this disclosure provide various fingerprint sensor devices, and methods of manufacturing thereof, that comprise a sensing area on a bottom side of a die without top side electrodes that senses fingerprints from the top side, and/or that comprise a sensor die directly electrically connected to conductive elements of a plate through which fingerprints are sensed.

公开(公告)号：US11990382B2

公开(公告)日：2024-05-21

申请号：US17865994

申请日：2022-07-15

Applicant: Adeia Semiconductor Technologies LLC

Inventor： Rajesh Katkar

IPC: H01L23/31 ,  H01L21/48 ,  H01L21/56 ,  H01L21/683 ,  H01L21/78 ,  H01L23/00 ,  H01L23/498 ,  H01L25/10

CPC classification number: H01L23/3107 ,  H01L21/4853 ,  H01L21/561 ,  H01L21/566 ,  H01L21/568 ,  H01L21/6835 ,  H01L21/78 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/94 ,  H01L24/97 ,  H01L25/10 ,  H01L21/4857 ,  H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L24/83 ,  H01L24/92 ,  H01L25/105 ,  H01L2221/68327 ,  H01L2221/68372 ,  H01L2224/12105 ,  H01L2224/13024 ,  H01L2224/13025 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73253 ,  H01L2224/83005 ,  H01L2224/92242 ,  H01L2224/97 ,  H01L2225/1035 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2224/97 ,  H01L2224/83 ,  H01L2224/131 ,  H01L2924/014 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/2919 ,  H01L2924/00014

Abstract: A microelectronic assembly having a first side and a second side opposite therefrom is disclosed. The microelectronic assembly may include a microelectronic element having a first face, a second face opposite the first face, a plurality of sidewalls each extending between the first and second faces, and a plurality of element contacts. The microelectronic assembly may also include an encapsulation adjacent the sidewalls of the microelectronic element. The microelectronic assembly may include electrically conductive connector elements each having a first end, a second end remote from the first end, and an edge surface extending between the first and second ends, wherein one of the first end or the second end of each connector element is adjacent the first side of the package. The microelectronic assembly may include a redistribution structure having terminals, the redistribution structure adjacent the second side of the package, the terminals being electrically coupled with the connector elements.

公开(公告)号：US20240162206A1

公开(公告)日：2024-05-16

申请号：US18503560

申请日：2023-11-07

Applicant: Micron Technology, Inc.

Inventor： Seng Kim YE ,  Hong Wan NG ,  Kelvin Aik Boo TAN ,  See Hiong LEOW ,  Ling PAN

IPC: H01L25/16 ,  H01L23/00 ,  H01L25/00 ,  H10B80/00

CPC classification number: H01L25/16 ,  H01L24/05 ,  H01L24/13 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/92 ,  H01L25/50 ,  H10B80/00 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/13147 ,  H01L2224/16227 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/92125 ,  H01L2224/92247 ,  H01L2924/0665

Abstract: Implementations described herein relate to various semiconductor device assemblies. In some implementations, a semiconductor device assembly may include a substrate and multiple first electrical contacts disposed on the substrate. The semiconductor device assembly may include a load switch coupled to the substrate and including a first outer surface facing the substrate and an opposing second outer surface facing away from the substrate. The load switch may include multiple second electrical contacts disposed on the second outer surface. The semiconductor device assembly may include multiple wire bonds electrically coupling the load switch to the substrate, wherein each wire bond electrically couples a corresponding first electrical contact, of the multiple first electrical contacts, to a corresponding second electrical contact, of the multiple second electrical contacts.

公开(公告)号：US20240162184A1

公开(公告)日：2024-05-16

申请号：US18337113

申请日：2023-06-19

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sang-Sick Park ,  Un-Byoung Kang ,  Min Soo Kim ,  Seon Gyo Kim

IPC: H01L23/00 ,  H01L25/065 ,  H10B80/00

CPC classification number: H01L24/33 ,  H01L24/05 ,  H01L24/06 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/29 ,  H01L24/30 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L25/0657 ,  H10B80/00 ,  H01L2224/05568 ,  H01L2224/0557 ,  H01L2224/06181 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13116 ,  H01L2224/13118 ,  H01L2224/1312 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2224/17181 ,  H01L2224/2919 ,  H01L2224/3003 ,  H01L2224/30505 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/3303 ,  H01L2224/33181 ,  H01L2224/73104 ,  H01L2224/73253 ,  H01L2224/81191 ,  H01L2224/83193 ,  H01L2224/83201 ,  H01L2224/83856 ,  H01L2224/9211 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06565 ,  H01L2225/06572 ,  H01L2924/0665 ,  H01L2924/067 ,  H01L2924/07025 ,  H01L2924/1432 ,  H01L2924/1433 ,  H01L2924/1436 ,  H01L2924/1437 ,  H01L2924/1441 ,  H01L2924/1443

Abstract: A semiconductor package includes a first structure, a first semiconductor chip on the first structure, a first conductive pad on the first structure between the first structure and the first semiconductor chip, a second conductive pad on a lower surface of the first semiconductor chip and vertically overlapping the first conductive pad, a bump connecting the first conductive pad and the second conductive pad, a first adhesive layer surrounding at least a part of side walls of the bump and side walls of the first conductive pad, and a second adhesive layer surrounding at least a part of the side walls of the bump and side walls of the second conductive pad, the second adhesive layer including a material different from the first adhesive layer, wherein a horizontal width of the first adhesive layer is smaller than a horizontal width of the second adhesive layer.

公开(公告)号：US11984405B2

公开(公告)日：2024-05-14

申请号：US17813102

申请日：2022-07-18

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chen-Hua Yu ,  Shin-Puu Jeng ,  Der-Chyang Yeh ,  Hsien-Wei Chen

IPC: H01L23/538 ,  H01L23/00 ,  H01L23/31 ,  H01L23/498 ,  H01L25/10

CPC classification number: H01L23/5386 ,  H01L23/3114 ,  H01L23/49811 ,  H01L23/49838 ,  H01L23/5383 ,  H01L23/5384 ,  H01L23/5389 ,  H01L24/17 ,  H01L25/105 ,  H01L24/13 ,  H01L24/16 ,  H01L24/48 ,  H01L2224/0401 ,  H01L2224/05552 ,  H01L2224/05555 ,  H01L2224/06051 ,  H01L2224/06135 ,  H01L2224/06136 ,  H01L2224/06179 ,  H01L2224/13147 ,  H01L2224/16052 ,  H01L2224/16055 ,  H01L2224/16227 ,  H01L2224/17051 ,  H01L2224/17135 ,  H01L2224/17136 ,  H01L2224/17179 ,  H01L2224/48227 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/10162 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2224/05552 ,  H01L2924/00012 ,  H01L2224/16052 ,  H01L2924/00012 ,  H01L2224/13147 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2224/45099 ,  H01L2924/00014 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A package includes a corner, a device die, a plurality of redistribution lines underlying the device die, and a plurality of non-solder electrical connectors underlying and electrically coupled to the plurality of redistribution lines. The plurality of non-solder electrical connectors includes a corner electrical connector. The corner electrical connector is elongated. An electrical connector is farther away from the corner than the corner electrical connector, wherein the electrical connector is non-elongated.

公开(公告)号：US20240154639A1

公开(公告)日：2024-05-09

申请号：US18508159

申请日：2023-11-13

Applicant: SKYWORKS SOLUTIONS, INC.

Inventor： James Phillip YOUNG

IPC: H04B1/40 ,  H01L23/00 ,  H01L23/498 ,  H01L23/66 ,  H01L25/065

CPC classification number: H04B1/40 ,  H01L23/49827 ,  H01L23/66 ,  H01L24/92 ,  H01L25/0655 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L2223/6616 ,  H01L2223/6655 ,  H01L2223/6677 ,  H01L2224/13025 ,  H01L2224/131 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/1329 ,  H01L2224/133 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2224/16227 ,  H01L2224/17181 ,  H01L2224/92222 ,  H01L2924/15311

Abstract: Devices and methods related to radio-frequency (RF) filters on silicon-on-insulator (SOI) substrate. In some embodiments, an RF device can include a silicon die such as an SOI die including a first side and a second side. The silicon die can further include a plurality of vias, with each via configured to provide an electrical connection between the first side and the second side of the silicon die. The RF device can further include at least one RF flip chip mounted on the first side of the silicon die. The silicon die can include, for example, an RF circuit such as a switch circuit, and the RF flip chip can include, for example, a filter such as a surface acoustic wave (SAW) filter.

公开(公告)号：US20240153908A1

公开(公告)日：2024-05-09

申请号：US18204965

申请日：2023-06-02

Applicant: HKC CORPORATION LIMITED

Inventor： Yang PU ,  Haoxuan Zheng

IPC: H01L23/00 ,  H01L25/16 ,  H01L33/38 ,  H01L33/62

CPC classification number: H01L24/81 ,  H01L24/02 ,  H01L24/05 ,  H01L24/10 ,  H01L24/13 ,  H01L24/16 ,  H01L25/167 ,  H01L33/38 ,  H01L33/62 ,  H01L2224/0217 ,  H01L2224/0224 ,  H01L2224/05555 ,  H01L2224/05573 ,  H01L2224/05609 ,  H01L2224/05611 ,  H01L2224/10135 ,  H01L2224/10165 ,  H01L2224/13016 ,  H01L2224/16145 ,  H01L2224/81002 ,  H01L2224/81005 ,  H01L2224/81139 ,  H01L2224/8114 ,  H01L2224/81141 ,  H01L2224/818 ,  H01L2924/12041 ,  H01L2924/13069 ,  H01L2924/13091

Abstract: A driving substrate, a micro LED transfer device and a micro LED transfer method are provided. A side surface of the driving substrate is arranged with a binding metal layer, a positioning layer is arranged around the binding metal layer, and a width of the positioning layer at a position away from the driving substrate is less than that a width at a position close to the driving substrate.

公开(公告)号：US20240145428A1

公开(公告)日：2024-05-02

申请号：US18549372

申请日：2022-03-10

Applicant: SONY SEMICONDUCTOR SOLUTIONS CORPORATION

Inventor： KAZUHIDE TERAHATA ,  YUSUKE ANDO ,  SATORU TANIMOTO

IPC: H01L23/00 ,  H01L23/14 ,  H10K59/131

CPC classification number: H01L24/81 ,  H01L23/14 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H10K59/131 ,  H01L2224/05124 ,  H01L2224/1134 ,  H01L2224/13124 ,  H01L2224/16225 ,  H01L2224/81095 ,  H01L2224/81205 ,  H01L2924/15165

Abstract: Provided are a flip connection structure, a room-temperature flip connection structure, and a connection method therefor, in which there is no risk of deterioration of a substrate or a semiconductor chip due to heat. Provided is a flip-chip connection structure in which semiconductors are connected using a flip chip structure of chip on chip. Each of terminals that connects the semiconductors is formed by aluminum (Al), and the terminals constitute a joined body integrally joined to each other by ultrasonic vibration involving pressurization.

公开(公告)号：US20240145404A1

公开(公告)日：2024-05-02

申请号：US18243672

申请日：2023-09-08

Applicant: WALTON ADVANCED ENGINEERING, INC.

Inventor： HONG-CHI YU ,  CHUN-JUNG LIN ,  RUEI-TING GU

IPC: H01L23/552 ,  H01L21/56 ,  H01L23/00

CPC classification number: H01L23/552 ,  H01L21/56 ,  H01L24/02 ,  H01L24/03 ,  H01L24/05 ,  H01L24/13 ,  H01L24/94 ,  H01L2224/02313 ,  H01L2224/02331 ,  H01L2224/0384 ,  H01L2224/05008 ,  H01L2224/05139 ,  H01L2224/05548 ,  H01L2224/05562 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2224/13021 ,  H01L2224/94

Abstract: A chip package with electromagnetic interference (EMI) shielding layer and a method of manufacturing the same are provided. The chip package includes a chip, a redistribution layer (RDL), an insulating layer, and an electromagnetic interference (EMI) shielding layer. A peripheral wall is formed around at least one first opening of the insulating layer for enclosing the first opening and a flat portion is disposed around the peripheral wall while a level of the flat portion is lower than a level of the peripheral wall. The flat portion of the insulating layer is covered with the EMI shielding layer which is isolated and electrically insulated from a pad in the first opening by the peripheral wall of the insulating layer. Thereby problems of the chip including fast increase in temperature and electromagnetic interference can be solved effectively.