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公开(公告)号：US20240162184A1
公开(公告)日：2024-05-16
申请号：US18337113
申请日：2023-06-19
Applicant: Samsung Electronics Co., Ltd.
Inventor： Sang-Sick Park , Un-Byoung Kang , Min Soo Kim , Seon Gyo Kim
IPC: H01L23/00 , H01L25/065 , H10B80/00
CPC classification number: H01L24/33 , H01L24/05 , H01L24/06 , H01L24/13 , H01L24/16 , H01L24/17 , H01L24/29 , H01L24/30 , H01L24/32 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/92 , H01L25/0657 , H10B80/00 , H01L2224/05568 , H01L2224/0557 , H01L2224/06181 , H01L2224/13109 , H01L2224/13111 , H01L2224/13113 , H01L2224/13116 , H01L2224/13118 , H01L2224/1312 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/16145 , H01L2224/16227 , H01L2224/17181 , H01L2224/2919 , H01L2224/3003 , H01L2224/30505 , H01L2224/32145 , H01L2224/32225 , H01L2224/3303 , H01L2224/33181 , H01L2224/73104 , H01L2224/73253 , H01L2224/81191 , H01L2224/83193 , H01L2224/83201 , H01L2224/83856 , H01L2224/9211 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2225/06565 , H01L2225/06572 , H01L2924/0665 , H01L2924/067 , H01L2924/07025 , H01L2924/1432 , H01L2924/1433 , H01L2924/1436 , H01L2924/1437 , H01L2924/1441 , H01L2924/1443
Abstract: A semiconductor package includes a first structure, a first semiconductor chip on the first structure, a first conductive pad on the first structure between the first structure and the first semiconductor chip, a second conductive pad on a lower surface of the first semiconductor chip and vertically overlapping the first conductive pad, a bump connecting the first conductive pad and the second conductive pad, a first adhesive layer surrounding at least a part of side walls of the bump and side walls of the first conductive pad, and a second adhesive layer surrounding at least a part of the side walls of the bump and side walls of the second conductive pad, the second adhesive layer including a material different from the first adhesive layer, wherein a horizontal width of the first adhesive layer is smaller than a horizontal width of the second adhesive layer.
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公开(公告)号：US11901339B2
公开(公告)日：2024-02-13
申请号：US17664565
申请日：2022-05-23
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Sang-Sick Park , Min Soo Kim
IPC: H01L25/065
CPC classification number: H01L25/0657 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2225/06582
Abstract: A semiconductor package includes a base substrate having a first semiconductor substrate, and a first protective layer covering a top side thereof. A first semiconductor chip is on the first protective layer. A first fillet layer fills a space between the first protective layer and the first semiconductor chip. A first side surface of the base substrate extends in a first direction, and second and third side surfaces extend in a second direction. The base substrate includes two corner regions and a side region between the corner regions. A first protective layer in the side region includes a first side trench which overlaps the first semiconductor chip. A part of the first fillet layer fills the first side trench.
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公开(公告)号：US10760950B2
公开(公告)日：2020-09-01
申请号：US14168626
申请日：2014-01-30
Applicant: Samsung Electronics Co., Ltd.
Inventor： Min Soo Kim , Do Hyung Kim , Chang Yong Son , Kang Eun Lee , Shi Hwa Lee
Abstract: An apparatus for processing data including a data compressor configured to compress ultrasonic data, and store the compressed ultrasonic data in a memory; and a data decompressor configured to read the stored ultrasonic data from the memory, decompress the read ultrasonic data, and transfer the decompressed ultrasonic data to a processor configured to perform beamforming.
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公开(公告)号：US10598425B2
公开(公告)日：2020-03-24
申请号：US15917431
申请日：2018-03-09
Applicant: Samsung Electronics Co., Ltd.
Inventor： Jin Seung Choi , Min Soo Kim , Sung Jin Park
Abstract: Disclosed herein is a lifting apparatus and refrigerator having the same, by which a driving motor to generate driving force to vertically move a basket may be miniaturized and the load of the driving motor may be reduced. A refrigerator includes a main body, a storeroom formed inside the main body with an open front, a drawer slidingly coupled with the main body to open or close the storeroom and provided at a lower side thereof with a basket having storage space, and a lifting apparatus moving the basket vertically, wherein the lifting apparatus includes a driving motor, a driving shaft rotated by the driving motor, a lifting unit moving the basket vertically by means of rotational force of the driving shaft, and a coil spring coupled to the driving shaft and transferring energy in a direction in which the driving shaft is rotated to reduce a load of the driving motor, when the driving shaft is rotated to move the basket upward.
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公开(公告)号：US10256658B2
公开(公告)日：2019-04-09
申请号：US15187083
申请日：2016-06-20
Applicant: Samsung Electronics Co., Ltd.
Inventor： Hyang Soo Hyun , Joo Han Kim , Jin Man Kim , Joo Hoon Lee , Chan Hun Yun , Kyu Jin Kwak , Min Soo Kim , Chul Hyung Yang , Ji Woo Lee
Abstract: A method for operating an electronic device is provided. The method includes monitoring a noise level of a noise signal received via a panel while wireless power is transmitted and/or received at a first power level via at least a conductive pattern, and generating a signal for changing the first power level corresponding to at least a part of an input to at least a part of the panel.
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Patent Agency Ranking
公开(公告)号：US09964344B2
公开(公告)日：2018-05-08
申请号：US14312961
申请日：2014-06-24
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Jin Han Kim , Il Ju Mun , Woo Hyek Choi , Young Dae Ko , Keon Kuk , Min Soo Kim
IPC: F25B21/00
CPC classification number: F25B21/00 , F25B2321/002 , F25B2321/0021 , F25B2321/0023 , Y02B30/66
Abstract: A magnetic cooling apparatus including a plurality of magnetic regenerators including a plurality of magnetocaloric materials to emit heat when magnetized and to absorb heat when demagnetized. The magnetic regenerators are rotatably disposed on a circumference having a predetermined radius, at least one coil is disposed on the circumference and coupled to the magnetic regenerators, and a plurality of permanent magnets is provided inside and outside the circumference to generate a magnetic field to magnetize or demagnetize the magnetic regenerators. The at least one coil interacts with the magnetic field generated by the permanent magnets to rotate the magnetic regenerators. The coil interacting with the magnetic field to magnetize or demagnetize the magnetic regenerators is coupled to the magnetic regenerators such that the magnetic regenerators reciprocate or rotate, thereby minimizing a size of the magnetic cooling apparatus, relative to the use of a motor. In addition, a member to switch a channel of a heat transfer fluid directly performs heat transfer between the heat transfer fluid and an external fluid, thereby minimizing heat loss.
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公开(公告)号：US11362068B2
公开(公告)日：2022-06-14
申请号：US16877211
申请日：2020-05-18
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Sang-Sick Park , Min Soo Kim
IPC: H01L25/065
Abstract: A semiconductor package includes a base substrate having a first semiconductor substrate, and a first protective layer covering a top side thereof. A first semiconductor chip is on the first protective layer. A first fillet layer fills a space between the first protective layer and the first semiconductor chip. A first side surface of the base substrate extends in a first direction, and second and third side surfaces extend in a second direction. The base substrate includes two corner regions and a side region between the corner regions. A first protective layer in the side region includes a first side trench which overlaps the first semiconductor chip. A part of the first fillet layer fills the first side trench.
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公开(公告)号：US20210111159A1
公开(公告)日：2021-04-15
申请号：US16877211
申请日：2020-05-18
Applicant: Samsung Electronics Co., Ltd.
Inventor： SANG-SICK PARK , Min Soo Kim
IPC: H01L25/065
Abstract: A semiconductor package includes a base substrate having a first semiconductor substrate, and a first protective layer covering a top side thereof. A first semiconductor chip is on the first protective layer. A first fillet layer fills a space between the first protective layer and the first semiconductor chip. A first side surface of the base substrate extends in a first direction, and second and third side surfaces extend in a second direction. The base substrate includes two corner regions and a side region between the corner regions. A first protective layer in the side region includes a first side trench which overlaps the first semiconductor chip. A part of the first fillet layer fills the first side trench.
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公开(公告)号：US10542632B2
公开(公告)日：2020-01-21
申请号：US15401707
申请日：2017-01-09
Applicant: Samsung Electronics Co., Ltd.
Inventor： Min Soo Kim , Ki Man Kim , Chul Hyung Yang , Ji Woo Lee
Abstract: An electronic device is provided. The electronic device includes a housing, a first printed circuit board seated inside the housing, and a second printed circuit board seated inside the housing such that a height of the second printed circuit board from the second surface is different from that of the first printed circuit board, wherein the first printed circuit board includes a mounting part on which at least one component is mounted, a first connector which extends from a first part of the mounting part. A portion of the first connector being substantially perpendicular to the mounting part and configured to be connected to the second printed circuit board, and a second connector which extends from a second part of the mounting part and configured to be connected to the second printed circuit board.
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公开(公告)号：US09217588B2
公开(公告)日：2015-12-22
申请号：US13738405
申请日：2013-01-10
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Woo Hyek Choi , Min Soo Kim , Il Ju Mun
CPC classification number: F25B21/00 , F25B49/00 , F25B2321/0022 , F25B2321/0023 , Y02B30/66
Abstract: A magnetic cooling apparatus and a control method thereof are provided. The magnetic cooling apparatus provides a replacement having a simplified structure for motors providing driving force and power transmission systems of reciprocation type and rotation type cooling apparatuses. The magnetic cooling apparatus includes magnets forming a magnetic field, magnetic regeneration units formed of a magnetocaloric material that are provided with coils, and using electromagnetic force, generated when currents are supplied to the coils in the magnetic field, as kinetic energy, and a controller controlling the currents supplied to the coils of the magnetic regeneration units to control moving speeds and directions of the magnetic regeneration units.
Abstract translation: 提供一种磁性冷却装置及其控制方法。 磁性冷却装置为提供驱动力的马达的简化结构和往复式和旋转式冷却装置的动力传递系统提供了更换。 磁性冷却装置包括形成磁场的磁体，由设置有线圈的磁热材料形成的磁性再生单元，并且使用电流作为动能供给到磁场中的线圈产生的电磁力，以及控制器 控制提供给磁再生单元的线圈的电流，以控制磁再生单元的移动速度和方向。
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