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    Method of making a flexible printed circuit board
    41.
    发明授权
    Method of making a flexible printed circuit board 有权
    制造柔性印刷电路板的方法

    公开(公告)号：US07992290B2

    公开(公告)日：2011-08-09

    申请号：US11940900

    申请日：2007-11-15

    Applicant: Ying-Lin Chen ,  Yung-Chou Chen

    Inventor： Ying-Lin Chen ,  Yung-Chou Chen

    IPC: H05K3/36 ,  B32B3/10

    CPC classification number: H05K3/427 ,  H05K1/0393 ,  H05K1/181 ,  H05K3/4652 ,  H05K2201/0166 ,  H05K2201/043 ,  H05K2201/09536 ,  H05K2203/0264 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49156 ,  Y10T29/49165 ,  Y10T156/1052 ,  Y10T428/24273

    Abstract: An exemplary method of making an FPC includes forming a substrate comprising metal foil layers interleaved with intervening layers by: (a) laminating intervening layers with metal foil layers; (b) adhering a covering film to outermost surfaces of the substrate; (c) defining a hole in one side of the substrate through the covering film and at least two metal foil layers and the intervening layer between the at least two metal foil layers by etching or laser technology; and (d) plating a portion of an inner wall of the hole with conductive material to form a via to electrically connect the at least two metal foil layers.

    Abstract translation: 制造FPC的示例性方法包括：通过以下步骤形成包含与中间层交错的金属箔层的基板：（a）将介入层与金属箔层层压; （b）将覆盖膜粘附到基板的最外表面; （c）通过蚀刻或激光技术通过覆盖膜和至少两个金属箔层和至少两个金属箔层之间的中间层来限定衬底的一侧中的孔; 以及（d）用导电材料电镀所述孔的内壁的一部分以形成通孔以电连接所述至少两个金属箔层。

    Power supply circuit with three-dimensionally arranged circuit carriers, and production method
    44.
    发明授权
    Power supply circuit with three-dimensionally arranged circuit carriers, and production method 有权
    电源电路采用三维排列电路载体，并制作方法

    公开(公告)号：US07688597B2

    公开(公告)日：2010-03-30

    申请号：US10840051

    申请日：2004-05-06

    Applicant: Michael Bothe ,  Stefan Morbe ,  Michael Becks ,  Peter Grad

    Inventor： Michael Bothe ,  Stefan Morbe ,  Michael Becks ,  Peter Grad

    IPC: H05K7/00

    CPC classification number: H05K1/144 ,  H01F27/2804 ,  H05K1/0306 ,  H05K1/142 ,  H05K1/162 ,  H05K1/167 ,  H05K1/181 ,  H05K2201/0187 ,  H05K2201/043 ,  H05K2201/1003 ,  H05K2201/10083

    Abstract: The present invention relates to a power supply circuit comprising at least one transformer which is connected to a primary side circuit and to a secondary side circuit. The present invention further relates to a method for producing such a power supply circuit. To provide an improved power supply circuit which has a reduced size and increased power density and offers more flexibility in the formation of the safety distances between primary side and secondary side, the primary side circuit and the secondary side circuit are each mounted on at least one separate circuit carrier, said circuit carriers being mechanically and electrically coupled to one another and arranged in at least two different planes. According to advantageous embodiments, said circuit carriers may be arranged in planes that are either parallel with or transverse to one another.

    Abstract translation: 本发明涉及一种电源电路，其包括连接到初级侧电路和次级侧电路的至少一个变压器。 本发明还涉及这种电源电路的制造方法。 为了提供一种改进的电源电路，其具有减小的尺寸和增加的功率密度，并且在形成初级侧和次级侧之间的安全距离方面提供更大的灵活性，初级侧电路和次级侧电路分别安装在至少一个 单独的电路载体，所述电路载体彼此机械地和电耦合并且布置在至少两个不同的平面中。 根据有利的实施例，所述电路载体可以布置在彼此平行或相互平行的平面中。

    Thin multi-chip flex module
    46.
    发明申请
    Thin multi-chip flex module 有权
    薄多芯片柔性模块

    公开(公告)号：US20090168363A1

    公开(公告)日：2009-07-02

    申请号：US12317892

    申请日：2008-12-30

    Applicant: James E. Clayton ,  Zakaryae Fathi

    Inventor： James E. Clayton ,  Zakaryae Fathi

    IPC: H05K7/20 ,  H05K3/34

    CPC classification number: H05K1/189 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/07811 ,  H01L2924/15311 ,  H05K1/147 ,  H05K3/0061 ,  H05K2201/043 ,  H05K2201/056 ,  H05K2201/09109 ,  H05K2201/10159 ,  H05K2201/1056 ,  Y10T29/49124 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49179 ,  H01L2924/00

    Abstract: A multichip module comprises a multilayer substrate circuit having conductive patterns on its surface(s) to which microelectronic device(s) are attached. The conductive patterns include a series of electrical contacts adjacent to one edge of the substrate. The substrate is bonded to two rigid frames, one on each opposite surface. Each substrate has a series of castellations on one edge that are aligned and electrically connected to the respective contacts on the substrate, preferably by soldering. The castellations can serve as a self-aligning mechanism when the module is brought into contact with a low-profile pin array, and the module may be held in place on a motherboard by guide rails in a socket that engages the edges perpendicular to the castellated edge of the module. The module may further be provided with protective heat spreading covers.

    Abstract translation: 多芯片模块包括在其表面上具有导电图案的多层衬底电路，微电子器件附接到多个衬底电路。 导电图案包括与衬底的一个边缘相邻的一系列电接触。 衬底被粘合到两个刚性框架上，每个相对表面上一个。 每个衬底在一个边缘上具有一系列在优选通过焊接的衬底上对准并电连接到衬底上的相应接触件的蓖耳。 当模块与低轮廓的针阵列接触时，这些哨座可以用作自对准机构，并且模块可以通过插座中的导轨固定在主板上的位置，该插座与垂直于雉鸡的边缘接合 模块的边缘。 模块还可以设置有保护性散热罩。

    Circuit board unit and method for production thereof
    47.
    发明申请
    Circuit board unit and method for production thereof 有权
    电路板单元及其制造方法

    公开(公告)号：US20080160246A1

    公开(公告)日：2008-07-03

    申请号：US11977725

    申请日：2007-10-25

    Applicant: Ernst Buhler ,  Rino D'Amario ,  Reto Knaak

    Inventor： Ernst Buhler ,  Rino D'Amario ,  Reto Knaak

    IPC: H05K3/46 ,  B32B3/06 ,  H05K3/00

    CPC classification number: H01L23/3735 ,  B23H1/02 ,  B23H11/00 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K1/0206 ,  H05K1/0272 ,  H05K1/144 ,  H05K3/0061 ,  H05K2201/0187 ,  H05K2201/043 ,  H05K2201/10166 ,  Y10T29/49139 ,  Y10T428/24008 ,  H01L2924/00

    Abstract: The invention relates to a circuit board unit and a method for production thereof. The circuit board unit comprises a circuit board topmost laminate with conductive tracks on the upper side for mounting surface-mountable devices. The circuit board topmost laminate features a thickness dimensioned such that the anticipated heat dissipated by the surface-mountable devices is transported from the upper side to the underside of the circuit board laminate to good effect. The circuit board unit further comprises an electrically insulating laminate arranged under the circuit board topmost laminate, inserts made of a material with good heat conductivity and electrical insulation embedded in the electrically insulating laminate at sites below surface-mountable devices with high heat dissipation, and a cooling plate arranged below the electrically insulating laminate and the inserts.

    Abstract translation: 本发明涉及电路板单元及其制造方法。 电路板单元包括在上侧具有导电轨道的电路板最顶层叠层，用于安装可表面安装的装置。 电路板最上层压板的厚度尺寸设计成使得由表面可安装装置散发的预期热量从电路板层压板的上侧输送到下侧，具有良好的效果。 电路板单元还包括布置在电路板最高层压板下面的电绝缘层压板，由具有良好导热性的材料制成的插入件和嵌入电绝缘层压板中的电绝缘体的嵌入在具有高散热性的表面可安装装置下方的位置， 布置在电绝缘层压板下面的冷却板和插入件。

    MODULE
    48.
    发明申请
    MODULE 审中-公开
    模块

    公开(公告)号：US20080158834A1

    公开(公告)日：2008-07-03

    申请号：US11952406

    申请日：2007-12-07

    Applicant: Tomohide Ogura ,  Motoyoshi Kitagawa

    Inventor： Tomohide Ogura ,  Motoyoshi Kitagawa

    IPC: H05K1/14

    CPC classification number: H05K1/141 ,  H05K1/181 ,  H05K1/182 ,  H05K3/3463 ,  H05K2201/043 ,  H05K2201/045 ,  H05K2201/049 ,  H05K2201/09072 ,  H05K2201/10371 ,  H05K2201/10477 ,  H05K2203/1572

    Abstract: A module includes a board having a through-hole provided therein, an auxiliary board provided on a lower surface of the board, a first electronic component mounted on an upper surface of the board, a conductive cover covering the first electronic component, and a second electronic component mounted on an upper surface of the auxiliary board. The auxiliary board includes a sealing portion sealing the through-hole. The second electronic component is positioned in the through-hole provided in the board and on the upper surface of the auxiliary board. The second electronic component is taller than the first electronic component. This module is thin.

    Abstract translation: 模块包括：具有设置在其中的通孔的板，设置在板的下表面上的辅助板，安装在板的上表面上的第一电子部件，覆盖第一电子部件的导电盖， 电子部件安装在辅助板的上表面上。 辅助板包括密封通孔的密封部分。 第二电子部件定位在设置在板中的通孔中和辅助板的上表面上。 第二电子部件比第一电子部件高。 这个模块很薄。

    CIRCUIT BOARD WITH MICROELECTRONIC ELEMENTS ASSEMBLED THEREON AND METHOD FOR PRODUCING SUCH CIRCUIT BOARD
    49.
    发明申请
    CIRCUIT BOARD WITH MICROELECTRONIC ELEMENTS ASSEMBLED THEREON AND METHOD FOR PRODUCING SUCH CIRCUIT BOARD 审中-公开
    组装有微电子元件的电路板及其制造方法

    公开(公告)号：US20070120618A1

    公开(公告)日：2007-05-31

    申请号：US11556900

    申请日：2006-11-06

    Applicant: Nicolas PEULEVEY ,  Jerome Aucourt

    Inventor： Nicolas PEULEVEY ,  Jerome Aucourt

    IPC: H01P5/107

    CPC classification number: H05K1/0237 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H05K1/0272 ,  H05K3/429 ,  H05K3/4611 ,  H05K3/4697 ,  H05K2201/037 ,  H05K2201/043 ,  H05K2201/09981 ,  H05K2203/061 ,  H05K2203/063 ,  H01L2924/00014

    Abstract: Circuit board (1) and method of producing thereof, the circuit board having a cavity for microstrip to waveguide transition means (2) defined by a hollow space on the walls of which a protection layer (21) is provided. A microelectronic substrate (33) is placed upon an adhesive film (31) adhered onto a surface of the circuit board (1), the adhesive film being pre-cut in selected areas (32) thereof providing openings therethrough. A metal layer (5) is disposed on the resulting structure, wherein a selected part (51) of the metal layer (5) present on a surface of microelectronics substrate 33, facing the hollow space defined by the cavity for microstrip to waveguide transition means (2) is removed.

    Abstract translation: 电路板（1）及其制造方法，所述电路板具有用于微波至腔室的波导过渡装置（2），所述空腔由设置有保护层（21）的壁上的中空空间限定。 将微电子基板（33）放置在附着在电路板（1）的表面上的粘合膜（31）上，在其选定的区域（32）中预先切割粘合膜，从而提供穿过其中的开口。 金属层（5）设置在所得结构上，其中存在于微电子基板33的表面上的金属层（5）的选定部分（51）面向由用于微带的空腔限定的中空空间至波导过渡装置 （2）被移除。

    Temperature controlled hybrid assembly
    50.
    发明授权
    Temperature controlled hybrid assembly 失效
    温控混合组合

    公开(公告)号：US4841170A

    公开(公告)日：1989-06-20

    申请号：US939522

    申请日：1986-12-08

    Applicant: Larry E. Eccleston

    Inventor： Larry E. Eccleston

    IPC: G05D23/24 ,  H01L23/34 ,  H01L25/00 ,  H05K1/02 ,  H05K1/03 ,  H05K1/14 ,  H05K1/16

    CPC classification number: H01L23/345 ,  G05D23/1919 ,  G05D23/24 ,  H01L23/34 ,  H05K1/0212 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K1/144 ,  H05K1/167 ,  H05K2201/043 ,  H05K2201/10151 ,  H05K2203/1115 ,  H05K2203/1581 ,  H05K2203/165

    Abstract: A hybrid circuit structure includes an electrical circuit and a heating circuit therefor, both mounted on a single substrate. Valuable substrate space is saved by mounting the electrical circuit components on one surface of the substrate and the heating circuit elements on the opposite surface. A temperature control circuit is included, preferably mounted on the same surface as the electrical circuit components. Precision resistors for gain control and other functions may be provided on a separate substrate which may be mounted directly to the single substrate or to a separator therebetween. The precision resistors are in thermal contact with the temperature controlled heating circuit, thereby further increasing the stability of the circuit.

    Abstract translation: 混合电路结构包括安装在单个基板上的电路及其加热电路。 通过将电路元件安装在基板的一个表面和相对表面上的加热电路元件来节省宝贵的基板空间。 包括温度控制电路，优选地安装在与电路部件相同的表面上。 用于增益控制和其他功能的精密电阻器可以设置在可以直接安装到单个基板或其间的隔板的单独基板上。 精密电阻与温度控制加热电路热接触，从而进一步提高电路的稳定性。

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