公开(公告)号：US20120083151A1

公开(公告)日：2012-04-05

申请号：US13185970

申请日：2011-07-19

Applicant: Rie TAKADA ,  Tsuyoshi YAMAMOTO ,  Naoaki NAKAMURA ,  Harumi YAGI

Inventor： Rie TAKADA ,  Tsuyoshi YAMAMOTO ,  Naoaki NAKAMURA ,  Harumi YAGI

IPC: H01R4/26 ,  H01R43/20 ,  B23P11/00

CPC classification number: H01R13/635 ,  H01R43/26 ,  Y10T29/49821 ,  Y10T29/49822

Abstract: A method of detachment of a connector which is provided with a housing having connector pins to be inserted into a board and with a first member which is arranged between the housing and the board and through which the connector pins are inserted, the method including a process of pulling out the connector pins from the board. This process utilizes the lever principle, which uses the first member as a fulcrum and which uses any point on the housing as a point of action, so as to pull out the connector pins from the board.

Abstract translation: 一种连接器的拆卸方法，该连接器设置有具有插入板中的连接器针脚的壳体和布置在壳体和板之间的第一构件，并且连接器插脚穿过该第一构件插入，该方法包括： 从板上拉出连接器针脚。 该方法利用杠杆原理，其使用第一构件作为支点，并且将壳体上的任何点用作作用点，以便从板上拉出连接器销。

公开(公告)号：US20110240719A1

公开(公告)日：2011-10-06

申请号：US13025398

申请日：2011-02-11

Applicant: Rie TAKADA ,  Tsuyoshi YAMAMOTO

Inventor： Rie TAKADA ,  Tsuyoshi YAMAMOTO

IPC: B23K1/018

CPC classification number: H05K13/0486 ,  H01L24/799 ,  H01L24/98 ,  H01L2224/16225 ,  H01L2924/01322 ,  H01L2924/00

Abstract: In the initial state, a part having a bottom electrode such as a BGA is attached to a substrate. A heat transfer material such as low melting point solder is allowed to fill a gap between the substrate and the part having the bottom electrode, and the heat transfer material and the BGA serving as the bottom electrode are heated. The heat transfer material and the BGA are melted by the heating so that the part having the bottom electrode is removed from the substrate.

Abstract translation: 在初始状态下，将具有诸如BGA的底部电极的部分附接到基板。 允许诸如低熔点焊料的传热材料填充基底和具有底部电极的部分之间的间隙，并且传热材料和用作底部电极的BGA被加热。 通过加热使传热材料和BGA熔融，使得具有底部电极的部分从基板去除。

公开(公告)号：US20110031628A1

公开(公告)日：2011-02-10

申请号：US12841495

申请日：2010-07-22

Applicant: Rie TAKADA

Inventor： Rie TAKADA

IPC: H01L23/52 ,  H01L21/50

CPC classification number: H05K1/189 ,  G11C5/04 ,  H01L23/5385 ,  H01L23/5387 ,  H01L25/105 ,  H01L2224/16 ,  H01L2225/06572 ,  H01L2225/06579 ,  H01L2225/1005 ,  H01L2225/1041 ,  H01L2225/107 ,  H01L2924/3511 ,  H05K1/0293 ,  H05K1/0295 ,  H05K1/141 ,  H05K1/144 ,  H05K1/147 ,  H05K3/0052 ,  H05K3/007 ,  H05K3/225 ,  H05K2201/043 ,  H05K2201/055 ,  H05K2201/09127 ,  H05K2201/10159 ,  H05K2201/10545 ,  H05K2201/10734 ,  H05K2203/1572 ,  H05K2203/176

Abstract: A semiconductor device module includes a first substrate layer on which a first semiconductor device is surface-mounted, a second substrate layer that is a layer laminated on a side of the first substrate layer on which the first semiconductor device is not surface-mounted, a second semiconductor device being surface-mounted on a surface of the second substrate layer and not on a side of the first substrate layer, and a hollow section that is a space sandwiched between the first substrate layer and the second substrate layer and formed on back sides of areas on which the first semiconductor device and the second semiconductor device are surface-mounted.

Abstract translation: 半导体器件模块包括第一衬底层，其上表面安装有第一半导体器件，第二衬底层，层叠在第一衬底层的不具有第一半导体器件的表面安装的一侧上的层， 第二半导体器件被表面安装在第二衬底层的表面上而不是在第一衬底层的一侧上，中空部分是夹在第一衬底层和第二衬底层之间并形成在第二衬底层的背面上的空间 的第一半导体器件和第二半导体器件表面安装的区域。