Abstract:
A method of detachment of a connector which is provided with a housing having connector pins to be inserted into a board and with a first member which is arranged between the housing and the board and through which the connector pins are inserted, the method including a process of pulling out the connector pins from the board. This process utilizes the lever principle, which uses the first member as a fulcrum and which uses any point on the housing as a point of action, so as to pull out the connector pins from the board.
Abstract:
In the initial state, a part having a bottom electrode such as a BGA is attached to a substrate. A heat transfer material such as low melting point solder is allowed to fill a gap between the substrate and the part having the bottom electrode, and the heat transfer material and the BGA serving as the bottom electrode are heated. The heat transfer material and the BGA are melted by the heating so that the part having the bottom electrode is removed from the substrate.
Abstract:
A semiconductor device includes: a substrate; multiple first and second conductive type regions on the substrate for providing a super junction structure; a channel layer on the super junction structure; a first conductive type layer in the channel layer; a contact second conductive type region in the channel layer; a gate electrode on the channel layer via a gate insulation film; a surface electrode on the channel layer; a backside electrode on the substrate opposite to the super junction structure; and an embedded second conductive type region. The embedded second conductive type region is disposed in a corresponding second conductive type region, protrudes into the channel layer, and contacts the contact second conductive type region. The embedded second conductive type region has an impurity concentration higher than the channel layer, and has a maximum impurity concentration at a position in the corresponding second conductive type region.
Abstract:
In an apparatus for image processing realized by a computer executing an image processing program: an image generation unit generates, for a radiographic image of a structure constituted by a plurality of members being stacked and including an object to be examined, a density-correction image representing an influence of a transmission density of each of the plurality of members other than the object to be examined, on the basis of structure information on the plurality of members; and a removal unit removes the influence of the transmission density of each of the plurality of members other than the object to be examined, from at least a part of the radiographic image in which images of the plurality of members overlap, by using the density-correction image generated by the image generation unit.
Abstract:
An optical semiconductor device is disclosed including an active region including an active layer and a diffraction grating having a λ/4 phase shift; passive waveguide regions each including a passive waveguide and a diffraction grating, disposed on the side of an emission facet and on the side of a rear facet sandwiching the active region between the passive waveguide regions, respectively; and an anti-reflection coating applied on the emission facet, wherein the passive waveguide region on the side of the emission facet has a length shorter than a length of the passive waveguide region on the side of the rear facet side.
Abstract:
The present invention provides a neural activity measurement system for measuring the electrical response of a neuron itself to achieve an electrical measurement of the neural activity itself, by providing a stimulator for applying an electrical stimulus to the neuron, as well as a Kelvin probe including a cantilever for detecting the electrical signal propagated through the neuron.
Abstract:
A semiconductor light emitting device includes a lower cladding layer, an active layer, and an AlGaAs upper cladding layer mounted on a GaAs substrate. The semiconductor light emitting device has a ridge structure including the AlGaAs upper cladding layer. The semiconductor light emitting device further includes an InGaAs etching stop layer provided in contact with the lower side of the AlGaAs upper cladding layer. The InGaAs etching stop layer has a band gap greater than that of the active layer.
Abstract:
A photonic semiconductor device which includes a semiconductor layer having a ridge-form protruding part formed on a semiconductor substrate. A resin layer is formed on surface parts on both sides of the protruding part so that the protruding part is embedded, and a first insulating film includes an opening that is formed on the resin layer which exposes an upper surface of the protruding part and a portion of a upper surface of the resin layer on both sides of the protruding part. A first electrode is formed in the opening so as to cover the upper surface of the protruding part, and electrically couple to an upper part of the protruding part; and a second electrode, which electrically couples to the first electrode, is formed on the first electrode and the first insulation film.
Abstract:
A demodulator includes a splitter, a first dielectric substance, and a combiner. The splitter splits a differential phase shift keying optical signal into a first light beam and a second light beam and outputs the first light beam to a first optical path and the second light beam to a second optical path. The first dielectric substance is disposed in the first optical path and has a refractive index higher than the average refractive index of the second optical path. The combiner combines the first light beam and the second light beam and causes the beams to interfere with each other. The difference in length between the first and second optical paths and the refractive index of the first dielectric substance are set such that the first light beam is delayed by one bit with respect to the second light beam.
Abstract:
Disclosed is an upper structure of an engine having three or more cylinders arranged in a row. A first one of a pair of adjacent cylinders among at least three of the cylinders serially arranged in a cylinder row direction is provided with a second spark plug at a position on an opposite side of a second one of the pair of adjacent cylinders, and the second one of the pair of adjacent cylinders is provided with a second spark plug at a position on an opposite side of the first one of the pair of adjacent cylinders. The present invention can provide enhanced flexibility in design of a head cover of the engine.