公开(公告)号：US20160086911A1

公开(公告)日：2016-03-24

申请号：US14953390

申请日：2015-11-29

申请人： RENESAS ELECTRONICS CORPORATION

发明人： Shinya Suzuki

IPC分类号： H01L23/00 ,  G02F1/1345

CPC分类号： H01L24/14 ,  G02F1/13306 ,  G02F1/133345 ,  G02F1/134309 ,  G02F1/13439 ,  G02F1/1345 ,  G02F1/13458 ,  G02F1/136286 ,  G02F1/1368 ,  G02F2001/133302 ,  H01L21/02164 ,  H01L21/0217 ,  H01L21/31055 ,  H01L21/31111 ,  H01L21/768 ,  H01L21/76819 ,  H01L23/485 ,  H01L23/522 ,  H01L23/528 ,  H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/81 ,  H01L24/83 ,  H01L27/13 ,  H01L29/7833 ,  H01L2224/02122 ,  H01L2224/0345 ,  H01L2224/03912 ,  H01L2224/0401 ,  H01L2224/05073 ,  H01L2224/05075 ,  H01L2224/051 ,  H01L2224/05144 ,  H01L2224/05155 ,  H01L2224/05164 ,  H01L2224/05166 ,  H01L2224/05184 ,  H01L2224/05553 ,  H01L2224/056 ,  H01L2224/1146 ,  H01L2224/1147 ,  H01L2224/13005 ,  H01L2224/13006 ,  H01L2224/13009 ,  H01L2224/13013 ,  H01L2224/13022 ,  H01L2224/13027 ,  H01L2224/13144 ,  H01L2224/14153 ,  H01L2224/16225 ,  H01L2224/271 ,  H01L2224/2929 ,  H01L2224/29355 ,  H01L2224/29444 ,  H01L2224/32225 ,  H01L2224/81 ,  H01L2224/81191 ,  H01L2224/8185 ,  H01L2224/83101 ,  H01L2224/83203 ,  H01L2224/83851 ,  H01L2224/9211 ,  H01L2224/93 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01041 ,  H01L2924/01057 ,  H01L2924/01072 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/04941 ,  H01L2924/05042 ,  H01L2924/05442 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/1426 ,  H01L2924/15788 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2224/11 ,  H01L2224/83 ,  H01L2924/00

摘要： A technique which improves the reliability in coupling between a bump electrode of a semiconductor chip and wiring of a mounting substrate, more particularly a technique which guarantees the flatness of a bump electrode even when wiring lies in a top wiring layer under the bump electrode, thereby improving the reliability in coupling between the bump electrode and the wiring formed on a glass substrate. Wiring, comprised of a power line or signal line, and a dummy pattern are formed in a top wiring layer beneath a non-overlap region of a bump electrode. The dummy pattern is located to fill the space between wirings to reduce irregularities caused by the wirings and space in the top wiring layer. A surface protection film formed to cover the top wiring layer is flattened by CMP.

公开(公告)号：US09035437B2

公开(公告)日：2015-05-19

申请号：US13797763

申请日：2013-03-12

申请人： Infineon Technologies Austria AG

发明人： Ralf Otremba ,  Guenther Lohmann ,  Josef Hoeglauer ,  Teck Sim Lee ,  Matteo-Alessandro Kutschak ,  Wolfgang Peinhopf

IPC分类号： H01L23/495 ,  H01L23/00 ,  H01L21/56

CPC分类号： H01L23/49517 ,  H01L21/561 ,  H01L23/49541 ,  H01L23/49562 ,  H01L23/49575 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/37 ,  H01L24/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/81 ,  H01L24/83 ,  H01L24/85 ,  H01L24/96 ,  H01L2224/16245 ,  H01L2224/2732 ,  H01L2224/27334 ,  H01L2224/291 ,  H01L2224/29111 ,  H01L2224/29139 ,  H01L2224/29144 ,  H01L2224/29147 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29439 ,  H01L2224/29444 ,  H01L2224/32245 ,  H01L2224/37124 ,  H01L2224/37139 ,  H01L2224/37144 ,  H01L2224/37147 ,  H01L2224/40245 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48245 ,  H01L2224/48247 ,  H01L2224/83048 ,  H01L2224/83065 ,  H01L2224/83203 ,  H01L2224/83801 ,  H01L2224/83815 ,  H01L2224/8385 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2224/85207 ,  H01L2924/00014 ,  H01L2924/12044 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13062 ,  H01L2924/13091 ,  H01L2924/1461 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/014 ,  H01L2924/0105 ,  H01L2924/01014 ,  H01L2924/01049 ,  H01L2924/01082 ,  H01L2924/00012 ,  H01L2924/0665 ,  H01L2924/0635 ,  H01L2924/06 ,  H01L2924/07025

摘要： Packaged chips comprising non-integer lead pitches, systems and methods for manufacturing packaged chips are disclosed. In one embodiment a packaged device includes a first chip, a package encapsulating the first chip and a plurality of leads protruding from the package, wherein the plurality of leads comprises differing non-integer multiple lead pitches.

摘要翻译： 公开了包括非整数引线间距的封装芯片，用于制造封装芯片的系统和方法。 在一个实施例中，封装器件包括第一芯片，封装第一芯片的封装以及从封装突出的多个引线，其中多个引线包括不同的非整数倍的引线间距。

公开(公告)号：US20140353540A1

公开(公告)日：2014-12-04

申请号：US14054529

申请日：2013-10-15

申请人： SUNRAY SCIENTIFIC, LLC

发明人： S. Kumar Khanna

IPC分类号： C09J9/02

CPC分类号： C09J9/02 ,  C08K9/08 ,  C09J11/00 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/75 ,  H01L24/83 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16505 ,  H01L2224/2929 ,  H01L2224/29355 ,  H01L2224/29357 ,  H01L2224/2936 ,  H01L2224/29387 ,  H01L2224/29393 ,  H01L2224/29395 ,  H01L2224/29439 ,  H01L2224/29444 ,  H01L2224/29488 ,  H01L2224/2949 ,  H01L2224/29493 ,  H01L2224/29499 ,  H01L2224/32058 ,  H01L2224/3213 ,  H01L2224/32225 ,  H01L2224/33181 ,  H01L2224/33183 ,  H01L2224/73204 ,  H01L2224/75101 ,  H01L2224/75264 ,  H01L2224/75272 ,  H01L2224/75804 ,  H01L2224/83007 ,  H01L2224/83055 ,  H01L2224/831 ,  H01L2224/83192 ,  H01L2224/8321 ,  H01L2224/83851 ,  H01L2224/83862 ,  H01L2224/83874 ,  H01L2224/83887 ,  H01L2224/83906 ,  H01L2224/83986 ,  H01L2924/00014 ,  H05K3/323 ,  H05K2203/104 ,  H01L2924/01006 ,  H01L2924/066 ,  H01L2924/00012 ,  H01L2224/83886 ,  H01L2924/00 ,  H01L2224/0401

摘要： Illustrative embodiments of an anisotropic conductive adhesive (ACA) configured to be cured after being subjected to a magnetic field are disclosed. In at least one illustrative embodiment, the ACA may comprise a binder and a plurality of particles suspended in the binder. Each of the plurality of particles may comprise a ferromagnetic material coated with a layer of electrically conductive material and with a moisture barrier, such that the electrically conducting material forms electrically conductive and isolated parallel paths when the ACA is cured after being subjected to the magnetic field.

摘要翻译： 公开了在经受磁场后被固化的各向异性导电粘合剂（ACA）的说明性实施例。 在至少一个说明性实施例中，ACA可以包括粘合剂和悬浮在粘合剂中的多个颗粒。 多个颗粒中的每一个可以包括涂覆有导电材料层和防潮层的铁磁材料，使得当ACA在受到磁场后固化时，导电材料形成导电和隔离的平行路径 。

公开(公告)号：US20140179065A1

公开(公告)日：2014-06-26

申请号：US14095000

申请日：2013-12-03

申请人： Kil Yong LEE ,  Jae Sun HAN ,  Jong Hyuk EUN

发明人： Kil Yong LEE ,  Jae Sun HAN ,  Jong Hyuk EUN

IPC分类号： H01L23/00

CPC分类号： H01L24/83 ,  G02F1/13452 ,  H01L24/27 ,  H01L24/29 ,  H01L2224/27003 ,  H01L2224/27436 ,  H01L2224/27848 ,  H01L2224/29019 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29316 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29363 ,  H01L2224/29387 ,  H01L2224/2939 ,  H01L2224/29416 ,  H01L2224/29439 ,  H01L2224/29444 ,  H01L2224/29447 ,  H01L2224/29455 ,  H01L2224/29486 ,  H01L2224/2949 ,  H01L2224/32227 ,  H01L2224/83193 ,  H01L2224/83203 ,  H01L2224/83862 ,  H01L2924/15788 ,  H05K3/323 ,  H05K3/361 ,  H01L2924/05442 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/00012 ,  H01L2924/00

摘要： A method of manufacturing a semiconductor device includes attaching a curable film to a first connection member including a first circuit terminal, attaching a conductive film to a second connection member including a second circuit terminal, and thermally compressing the first connection member to the second connection member, with the first connection member and the second connection member placed such that the curable film and the conductive film face each other.

摘要翻译： 一种制造半导体器件的方法，包括将固化膜附着到包括第一电路端子的第一连接构件，将导电膜附接到包括第二电路端子的第二连接构件，以及将第一连接构件热压到第二连接构件 其中第一连接件和第二连接件放置成使得可固化膜和导电膜彼此面对。

公开(公告)号：US20140084468A1

公开(公告)日：2014-03-27

申请号：US14030127

申请日：2013-09-18

申请人： Young Woo PARK ,  Joon Mo SEO ,  Hyun Min CHOI ,  Ji Yeon KIM ,  Kyoung Soo PARK ,  Arum YU ,  Jong Hyuk EUN

发明人： Young Woo PARK ,  Joon Mo SEO ,  Hyun Min CHOI ,  Ji Yeon KIM ,  Kyoung Soo PARK ,  Arum YU ,  Jong Hyuk EUN

IPC分类号： H01L23/00

CPC分类号： H01L24/29 ,  C09J2201/602 ,  H01L24/27 ,  H01L24/83 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29388 ,  H01L2224/2939 ,  H01L2224/29439 ,  H01L2224/29444 ,  H01L2224/29455 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/83203 ,  H01L2224/83862 ,  H01L2924/07802 ,  H01L2924/0665 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/00

摘要： A semiconductor device includes a first connecting member having a first electrode, a second connecting member having a second electrode, and an anisotropic conductive film between the first connecting member and the second connecting member, the anisotropic conductive film electrically connecting the first and second electrodes to each other. The anisotropic conductive film includes a polymer binder resin, an epoxy resin, conductive particles, and a curing agent. The epoxy resin includes a naphthalene ring-containing epoxy resin and a dicyclopentadiene ring-containing epoxy resin. The naphthalene ring-containing epoxy resin is included in an amount of 100 parts by weight to 500 parts by weight based on 100 parts by weight of the dicyclopentadiene ring-containing epoxy resin.

摘要翻译： 一种半导体器件，包括具有第一电极的第一连接部件，具有第二电极的第二连接部件和在第一连接部件和第二连接部件之间的各向异性导电膜，将各第一电极和第二电极电连接的各向异性导电膜 彼此。 各向异性导电膜包括聚合物粘合剂树脂，环氧树脂，导电颗粒和固化剂。 环氧树脂包括含萘环的环氧树脂和含双环戊二烯环的环氧树脂。 相对于含有二环戊二烯环的环氧树脂100重量份，含萘环的环氧树脂的含量为100重量份〜500重量份。

公开(公告)号：US08629563B2

公开(公告)日：2014-01-14

申请号：US13368999

申请日：2012-02-08

申请人： Chao-Yuan Su

发明人： Chao-Yuan Su

IPC分类号： H01L23/52 ,  H01L23/48 ,  H01L29/40

CPC分类号： H01L23/52 ,  H01L21/6836 ,  H01L23/481 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/94 ,  H01L2221/68327 ,  H01L2224/05573 ,  H01L2224/13009 ,  H01L2224/13025 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/27003 ,  H01L2224/27436 ,  H01L2224/29082 ,  H01L2224/2929 ,  H01L2224/2939 ,  H01L2224/29444 ,  H01L2224/29455 ,  H01L2224/29499 ,  H01L2224/32225 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48221 ,  H01L2224/48227 ,  H01L2224/73257 ,  H01L2224/83191 ,  H01L2224/838 ,  H01L2224/83851 ,  H01L2224/94 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15788 ,  H01L2924/181 ,  Y10T428/26 ,  Y10T428/28 ,  H01L2224/03 ,  H01L2924/00 ,  H01L2224/29299 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/05599 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： Integrated circuit structures and methods are provided. According to an embodiment, a circuit structure includes a die and an anisotropic conducting film (ACF). The die comprises a through via, and the through via protrudes from a surface of the die. A cross-sectional area of the through via in the surface of the die is equal to a cross-sectional area of a protruding portion of the through via in a plane parallel to the surface of the die. The ACF adjoins the surface of the die, and the protruding portion of the through via penetrates the ACF.

摘要翻译： 提供集成电路结构和方法。 根据实施例，电路结构包括管芯和各向异性导电膜（ACF）。 模具包括通孔，并且通孔从模具的表面突出。 在模具表面中的通孔的横截面面积与平行于模具表面的平面中的通孔的突出部分的横截面面积相等。 ACF与模具的表面相邻，通孔的突出部穿透ACF。

公开(公告)号：US08552552B2

公开(公告)日：2013-10-08

申请号：US12239810

申请日：2008-09-28

申请人： Shinya Suzuki

发明人： Shinya Suzuki

IPC分类号： H01L23/485 ,  H01L23/528

CPC分类号： H01L24/14 ,  G02F1/13306 ,  G02F1/133345 ,  G02F1/134309 ,  G02F1/13439 ,  G02F1/1345 ,  G02F1/13458 ,  G02F1/136286 ,  G02F1/1368 ,  G02F2001/133302 ,  H01L21/02164 ,  H01L21/0217 ,  H01L21/31055 ,  H01L21/31111 ,  H01L21/768 ,  H01L21/76819 ,  H01L23/485 ,  H01L23/522 ,  H01L23/528 ,  H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/81 ,  H01L24/83 ,  H01L27/13 ,  H01L29/7833 ,  H01L2224/02122 ,  H01L2224/0345 ,  H01L2224/03912 ,  H01L2224/0401 ,  H01L2224/05073 ,  H01L2224/05075 ,  H01L2224/051 ,  H01L2224/05144 ,  H01L2224/05155 ,  H01L2224/05164 ,  H01L2224/05166 ,  H01L2224/05184 ,  H01L2224/05553 ,  H01L2224/056 ,  H01L2224/1146 ,  H01L2224/1147 ,  H01L2224/13005 ,  H01L2224/13006 ,  H01L2224/13009 ,  H01L2224/13013 ,  H01L2224/13022 ,  H01L2224/13027 ,  H01L2224/13144 ,  H01L2224/14153 ,  H01L2224/16225 ,  H01L2224/271 ,  H01L2224/2929 ,  H01L2224/29355 ,  H01L2224/29444 ,  H01L2224/32225 ,  H01L2224/81 ,  H01L2224/81191 ,  H01L2224/8185 ,  H01L2224/83101 ,  H01L2224/83203 ,  H01L2224/83851 ,  H01L2224/9211 ,  H01L2224/93 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01041 ,  H01L2924/01057 ,  H01L2924/01072 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/04941 ,  H01L2924/05042 ,  H01L2924/05442 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/1426 ,  H01L2924/15788 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2224/11 ,  H01L2224/83 ,  H01L2924/00

摘要： A technique which improves the reliability in coupling between a bump electrode of a semiconductor chip and wiring of a mounting substrate, more particularly a technique which guarantees the flatness of a bump electrode even when wiring lies in a top wiring layer under the bump electrode, thereby improving the reliability in coupling between the bump electrode and the wiring formed on a glass substrate. Wiring, comprised of a power line or signal line, and a dummy pattern are formed in a top wiring layer beneath a non-overlap region of a bump electrode. The dummy pattern is located to fill the space between wirings to reduce irregularities caused by the wirings and space in the top wiring layer. A surface protection film formed to cover the top wiring layer is flattened by CMP.

摘要翻译： 一种提高半导体芯片的凸块电极与安装基板的配线之间的耦合可靠性的技术，更具体地说，即使在布线位于突起电极下方的顶部布线层中时也能保证凸块电极的平坦度的技术，由此 提高凸起电极和形成在玻璃基板上的布线之间的耦合的可靠性。 在突起电极的非重叠区域下方的顶部布线层中形成由电力线或信号线构成的布线和虚设图案。 虚拟图案位于填充布线之间的空间以减少由布线引起的不规则和顶部布线层中的空间。 形成为覆盖顶部布线层的表面保护膜被CMP平坦化。

公开(公告)号：US20130168847A1

公开(公告)日：2013-07-04

申请号：US13728215

申请日：2012-12-27

申请人： Young Woo PARK ,  Nam Ju KIM ,  Kyoung Soo PARK ,  Joon Mo SEO ,  Kyung ll SUL ,  Dong Seon UH ,  Arum YU ,  Hyun Min CHOI

发明人： Young Woo PARK ,  Nam Ju KIM ,  Kyoung Soo PARK ,  Joon Mo SEO ,  Kyung ll SUL ,  Dong Seon UH ,  Arum YU ,  Hyun Min CHOI

IPC分类号： H01L23/538

CPC分类号： H01L23/538 ,  C08G59/226 ,  C08G59/245 ,  C08K2201/001 ,  C08K2201/011 ,  C09J9/02 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L2224/16225 ,  H01L2224/2929 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29364 ,  H01L2224/29366 ,  H01L2224/29371 ,  H01L2224/29386 ,  H01L2224/2939 ,  H01L2224/29393 ,  H01L2224/29439 ,  H01L2224/29444 ,  H01L2224/29447 ,  H01L2224/29455 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/07802 ,  H01L2924/07811 ,  H01L2924/15788 ,  H01L2924/00 ,  C08L63/00 ,  C08K3/36 ,  C08K3/10

摘要： An electronic device includes an anisotropic conductive film as a connection material, the anisotropic conductive film being formed from an anisotropic conductive film-forming composition. The anisotropic conductive film-forming composition includes a polycyclic aromatic ring-containing epoxy resin, a fluorene epoxy resin, nano silica and conductive particles.

摘要翻译： 电子器件包括各向异性导电膜作为连接材料，各向异性导电膜由各向异性导电膜形成组合物形成。 各向异性导电膜形成组合物包括多环芳族环的环氧树脂，芴环氧树脂，纳米二氧化硅和导电颗粒。

公开(公告)号：US20130161838A1

公开(公告)日：2013-06-27

申请号：US13721407

申请日：2012-12-20

申请人： Jae Sun HAN ,  Hyun Wook KIM ,  Hyun Hee NAMKUNG ,  Jin Young SEO ,  Kwang Jin JUNG ,  Dong Seon UH

发明人： Jae Sun HAN ,  Hyun Wook KIM ,  Hyun Hee NAMKUNG ,  Jin Young SEO ,  Kwang Jin JUNG ,  Dong Seon UH

IPC分类号： H01L23/482

CPC分类号： H01L23/4828 ,  C09J7/00 ,  C09J7/10 ,  C09J9/02 ,  C09J2201/602 ,  C09J2201/61 ,  C09J2433/00 ,  C09J2463/00 ,  H01L24/29 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/2939 ,  H01L2224/29393 ,  H01L2224/29439 ,  H01L2224/29444 ,  H01L2224/29455 ,  H01L2224/32225 ,  H01L2924/07811 ,  H01L2924/15788 ,  H01L2924/00014 ,  H01L2924/0665 ,  H01L2924/00

摘要： A semiconductor device bonded by an anisotropic conductive film, the anisotropic conductive film including a phenoxy resin including a fluorene-substituted phenoxy resin; and a radically polymerizable resin including a fluorene-substituted acrylate.

摘要翻译： 通过各向异性导电膜结合的半导体器件，各向异性导电膜包括含有芴取代的苯氧基树脂的苯氧基树脂; 和包含芴取代的丙烯酸酯的自由基聚合性树脂。

公开(公告)号：US20130105841A1

公开(公告)日：2013-05-02

申请号：US13575786

申请日：2011-04-20

申请人： Hidetsugu Namiki ,  Shiyuki Kanisawa ,  Hideaki Umakoshi

发明人： Hidetsugu Namiki ,  Shiyuki Kanisawa ,  Hideaki Umakoshi

IPC分类号： H01B1/02 ,  H01L33/46 ,  H01B1/22

CPC分类号： H01B1/02 ,  C08G59/42 ,  C08K9/02 ,  C09J9/02 ,  C09J11/04 ,  C09J163/00 ,  H01B1/22 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/83 ,  H01L33/46 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/2929 ,  H01L2224/2939 ,  H01L2224/29393 ,  H01L2224/29444 ,  H01L2224/29447 ,  H01L2224/29455 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/81903 ,  H01L2224/83851 ,  H01L2224/9211 ,  H01L2924/00014 ,  H01L2924/07811 ,  H01L2924/12041 ,  H01L2924/181 ,  Y10T428/2991 ,  Y10T428/2993 ,  Y10T428/2998 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/05432 ,  H01L2924/05341 ,  H01L2924/05342 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2224/05599

摘要： A light-reflective conductive particle for an anisotropic conductive adhesive used for connecting a light-emitting element to a wiring board by anisotropic conductive connection includes a core particle covered with a metal material and a light reflecting layer formed of a light-reflective inorganic particle having a refractive index of 1.52 or greater on the surface of the core particle. Examples of the light-reflective inorganic particles having a refractive index of 1.52 or greater include a titanium oxide particle, a zinc oxide particle, and an aluminum oxide particle. The coverage of the light reflecting layer on the surface of the core particle is 70% or more.

摘要翻译： 用于通过各向异性导电连接将发光元件连接到布线板的用于各向异性导电粘合剂的光反射导电颗粒包括被金属材料覆盖的芯颗粒和由反光无机颗粒形成的光反射层，所述光反射层具有 核心颗粒表面的折射率为1.52或更大。 折射率为1.52以上的光反射性无机粒子的实例包括氧化钛颗粒，氧化锌颗粒和氧化铝颗粒。 芯粒子表面的光反射层的覆盖率为70％以上。