公开(公告)号：US09455241B2

公开(公告)日：2016-09-27

申请号：US14754230

申请日：2015-06-29

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Yonggang Jin ,  Kiyoshi Kuwabara ,  Xavier Baraton

IPC: H01L23/00 ,  H01L21/48 ,  H01L21/683 ,  H01L23/498 ,  H01L23/538 ,  H01L21/311 ,  H01L21/56 ,  H01L21/768

CPC classification number: H01L24/83 ,  H01L21/311 ,  H01L21/4821 ,  H01L21/486 ,  H01L21/56 ,  H01L21/568 ,  H01L21/6835 ,  H01L21/768 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49894 ,  H01L23/5389 ,  H01L24/11 ,  H01L24/18 ,  H01L24/19 ,  H01L24/24 ,  H01L24/82 ,  H01L24/96 ,  H01L2221/68345 ,  H01L2221/68359 ,  H01L2221/68372 ,  H01L2221/68377 ,  H01L2221/68381 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/18 ,  H01L2224/2518 ,  H01L2224/8385 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/00

Abstract: Aspects of the invention are directed towards an integrated circuit package and method of forming the same, and more particularly to a redistributed chip packaging for an integrated circuit. The integrated circuit package includes an integrated circuit having a protective material on at least a portion of the integrated circuit. A lead frame is coupled to the integrated circuit and a conductive layer is also coupled to the interconnect. A solder ball is coupled to the conductive layer and a passivation layer is on the conductive layer. Active and passive components are electrically coupled to the integrated circuit.

Abstract translation: 本发明的方面涉及一种集成电路封装及其形成方法，更具体地涉及用于集成电路的重新分配的芯片封装。 集成电路封装包括在集成电路的至少一部分上具有保护材料的集成电路。 引线框架耦合到集成电路，并且导电层也耦合到互连。 焊球与导电层耦合，钝化层位于导电层上。 有源和无源部件电耦合到集成电路。

公开(公告)号：US09437798B2

公开(公告)日：2016-09-06

申请号：US13929525

申请日：2013-06-27

Applicant: STMicroelectronics Pte Ltd.

Inventor： Olivier Le Neel ,  Suman Cherian ,  Calvin Leung ,  Ravi Shankar ,  Tien Choy Loh ,  Shian Yeu Kam

IPC: G01N27/327 ,  H01L35/34

CPC classification number: H01L35/34 ,  G01N27/3274 ,  Y10T29/49117

Abstract: A bio-fluid sensor is formed by depositing polyimide on a glass substrate. Gold and platinum are deposited on the polyimide and patterned to form fluid sensing electrodes, signal traces, and a temperature sensor. The fluid sensor is then fixed to a flexible tape and peeled off of the glass substrate.

Abstract translation: 通过在玻璃基板上沉积聚酰亚胺形成生物流体传感器。 金和铂沉积在聚酰亚胺上并图案化以形成流体感测电极，信号迹线和温度传感器。 然后将流体传感器固定到柔性带并从玻璃基板上剥离。

公开(公告)号：US09418920B2

公开(公告)日：2016-08-16

申请号：US14589094

申请日：2015-01-05

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Wing Shenq Wong

IPC: H01L23/495 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L23/29 ,  H01L23/31 ,  H01L21/48 ,  H01L21/56 ,  H01L23/00

CPC classification number: H01L23/49568 ,  H01L21/4825 ,  H01L21/56 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/3135 ,  H01L23/49513 ,  H01L23/4952 ,  H01L23/49541 ,  H01L23/49551 ,  H01L23/49582 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L24/92 ,  H01L2224/32245 ,  H01L2224/48106 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/838 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01028 ,  H01L2924/01046 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/17738 ,  H01L2924/17763 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: An integrated circuit (IC) package includes a die pad and an IC die secured on the die pad. The IC die had outer edges aligned with outer edges of the die pad. An encapsulating material body surrounds the die pad and IC die. Leads extend outwardly from the encapsulating material body and are coupled to the IC die. Each lead has an upper surface coplanar with an upper surface of the IC die. The die pad has a lower surface exposed through the encapsulating material body, and has a thickness greater than a thickness of each of the plurality of leads.

Abstract translation: 集成电路（IC）封装包括芯片焊盘和固定在裸片焊盘上的IC芯片。 IC芯片具有与芯片焊盘的外边缘对准的外边缘。 封装材料体围绕芯片焊盘和IC芯片。 引线从封装材料体向外延伸并耦合到IC管芯。 每个引线具有与IC芯片的上表面共面的上表面。 管芯焊盘具有通过封装材料体暴露的下表面，并且其厚度大于多个引线中的每一个的厚度。

公开(公告)号：US20160190192A1

公开(公告)日：2016-06-30

申请号：US14582758

申请日：2014-12-24

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Jean-Michel GREBET ,  Wee Chin Judy LIM

IPC: H01L27/146 ,  G02B5/20 ,  H04N5/225

CPC classification number: H01L27/14625 ,  G02B5/208 ,  H01L27/14618 ,  H01L2224/16225 ,  H04N5/2253

Abstract: One or more embodiments disclosed herein are directed to a chip scale package camera module that includes a glass interposer between a lens and an image sensor. In some embodiments, the glass interposer is made from one or more layers of optical quality glass and includes an infrared filter coating. The glass interposer also includes electrically conductive paths to connect the image sensor, mounted on one side of the glass interposer, with other components such as capacitors, which may be mounted on a different side of the glass interposer, and the rest of the camera system. The conductive layers include traces and vias that are formed in the glass interposer in areas away from the path of light in the camera module, such that the traces and vias do not block the light between the lens and the image sensor.

Abstract translation: 本文公开的一个或多个实施例涉及一种芯片级封装相机模块，其包括在透镜和图像传感器之间的玻璃插入器。 在一些实施例中，玻璃插入件由一层或多层光学质量玻璃制成并且包括红外滤光器涂层。 玻璃插入件还包括用于将安装在玻璃插入件的一侧上的图像传感器与可以安装在玻璃插入件的不同侧上的诸如电容器的其它部件连接的导电路径，以及相机系统的其余部分 。 导电层包括在相机模块中远离光路的区域中形成在玻璃插入件中的迹线和通孔，使得迹线和通孔不会阻挡透镜和图像传感器之间的光。

公开(公告)号：US20160190097A1

公开(公告)日：2016-06-30

申请号：US14817502

申请日：2015-08-04

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Jing-En LUAN

IPC: H01L25/065 ,  H01L23/31 ,  H01L25/00 ,  H01L21/56 ,  H01L21/78 ,  H01L23/00 ,  H01L23/498 ,  H01L21/48

CPC classification number: H01L24/92 ,  H01L21/4853 ,  H01L21/561 ,  H01L21/565 ,  H01L21/78 ,  H01L23/29 ,  H01L23/293 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/3121 ,  H01L23/3171 ,  H01L23/49513 ,  H01L23/49575 ,  H01L23/49838 ,  H01L23/49861 ,  H01L24/05 ,  H01L24/27 ,  H01L24/29 ,  H01L24/30 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L24/94 ,  H01L24/96 ,  H01L25/0655 ,  H01L25/50 ,  H01L2224/04026 ,  H01L2224/04042 ,  H01L2224/0569 ,  H01L2224/2741 ,  H01L2224/27416 ,  H01L2224/29082 ,  H01L2224/2919 ,  H01L2224/32013 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83101 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/8385 ,  H01L2224/85207 ,  H01L2224/92247 ,  H01L2224/94 ,  H01L2924/00014 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/181 ,  H01L2224/27 ,  H01L2224/03 ,  H01L2924/00012 ,  H01L2224/43 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/05599 ,  H01L2924/00 ,  H01L2224/85399

Abstract: Embodiments of the present disclosure provide a semiconductor device, a semiconductor package, and a method for manufacturing a semiconductor device. The semiconductor device comprises: a semiconductor die; an electrical isolation layer formed on a surface of the semiconductor die; a substrate; and a non-conductive adhesive layer disposed between the electrical isolation layer and the substrate, so as to adhere the electrical isolation layer to the substrate.

Abstract translation: 本公开的实施例提供半导体器件，半导体封装以及半导体器件的制造方法。 半导体器件包括：半导体管芯; 形成在所述半导体管芯的表面上的电隔离层; 底物; 以及设置在电隔离层和基板之间的非导电粘合剂层，以将电隔离层粘附到基板上。

公开(公告)号：US09379034B1

公开(公告)日：2016-06-28

申请号：US14585566

申请日：2014-12-30

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Kim-Yong Goh ,  Yiyi Ma ,  Xueren Zhang

IPC: H01L23/10 ,  H01L23/31 ,  H01L23/498 ,  H01L23/367 ,  H01L23/00 ,  H01L21/56

CPC classification number: H01L23/3135 ,  H01L21/565 ,  H01L23/3128 ,  H01L23/367 ,  H01L23/49816 ,  H01L24/48 ,  H01L24/49 ,  H01L24/85 ,  H01L2224/48106 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A method of making an electronic device may include positioning an integrated circuit (IC) die on an upper surface of a grid array substrate having connections on a lower surface thereof and coupling respective bond pads of the IC die to the grid array with bond wires. The method may also include forming a first encapsulating layer over the IC die and bond wires and positioning a heat spreader on the substrate above the first encapsulating layer after forming the first encapsulating layer. The method may further include forming a second encapsulating layer over the first encapsulating layer and embedding the heat spreader in the second encapsulating layer.

Abstract translation: 制造电子设备的方法可以包括将集成电路（IC）管芯定位在具有在其下表面上的连接的栅格阵列衬底的上表面上，并且将IC芯片的各个接合焊盘与接合线耦合到栅极阵列。 该方法还可以包括在IC芯片上方形成第一封装层，并且在形成第一封装层之后，将第一封装层上的基板上的散热器定位在第一封装层上方的基板上。 该方法还可以包括在第一封装层上形成第二封装层，并将散热器嵌入第二封装层中。

公开(公告)号：US09377678B2

公开(公告)日：2016-06-28

申请号：US14084773

申请日：2013-11-20

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Alan Lee ,  Xi Ge

IPC: G03F7/20 ,  G03F1/00 ,  G03F1/42

CPC classification number: G03F1/00 ,  G03F1/42 ,  G03F1/50 ,  G03F7/70283 ,  G03F7/70425

Abstract: A method of processing a semiconductor wafer may include providing a rotatably alignable photolithography mask that includes different mask images. Each mask image may be in a corresponding different mask sector. The method may also include performing a series of exposures with the rotatably alignable photolithography mask at different rotational alignments with respect to the semiconductor wafer so that the different mask images produce at least one working semiconductor wafer sector, and at least one non-working semiconductor wafer sector.

Abstract translation: 一种处理半导体晶片的方法可以包括提供包括不同掩模图像的可旋转对准的光刻掩模。 每个掩模图像可以在相应的不同的掩模扇区中。 该方法还可以包括使用相对于半导体晶片的不同旋转对准的可旋转对准的光刻掩模执行一系列曝光，使得不同的掩模图像产生至少一个工作半导体晶片扇区，以及至少一个非工作半导体晶片 部门。

公开(公告)号：US20160111635A1

公开(公告)日：2016-04-21

申请号：US14982600

申请日：2015-12-29

Applicant: STMicroelectronics Pte Ltd

Inventor： Olivier Le Neel ,  Ravi Shankar

IPC: H01L43/14 ,  H01L21/8234 ,  H01L43/04 ,  H01L43/10 ,  H01L43/06

CPC classification number: H01L43/14 ,  G01N27/74 ,  H01L21/8234 ,  H01L43/04 ,  H01L43/065 ,  H01L43/10 ,  Y10T29/4913

Abstract: A miniature oxygen sensor makes use of paramagnetic properties of oxygen gas to provide a fast response time, low power consumption, improved accuracy and sensitivity, and superior durability. The miniature oxygen sensor disclosed maintains a sample of ambient air within a micro-channel formed in a semiconductor substrate. O2 molecules segregate in response to an applied magnetic field, thereby establishing a measurable Hall voltage. Oxygen present in the sample of ambient air can be deduced from a change in Hall voltage with variation in the applied magnetic field. The magnetic field can be applied either by an external magnet or by a thin film magnet integrated into a gas sensing cavity within the micro-channel. A differential sensor further includes a reference element containing an unmagnetized control sample. The miniature oxygen sensor is suitable for use as a real-time air quality monitor in consumer products such as smart phones.

Abstract translation: 微型氧传感器利用氧气的顺磁特性提供快速的响应时间，低功耗，提高的精度和灵敏度以及优异的耐久性。 所公开的微型氧传感器在半导体衬底中形成的微通道内保持环境空气样品。 O2分子响应于施加的磁场而分离，由此建立可测量的霍尔电压。 环境空气样品中存在的氧气可以从施加磁场变化的霍尔电压变化推导出来。 磁场可以由外部磁体或集成到微通道内的气体感测腔中的薄膜磁体施加。 差分传感器还包括含有非磁化控制样品的参考元件。 微型氧传感器适用于智能手机等消费类产品中的实时空气质量监控。

公开(公告)号：US20160104805A1

公开(公告)日：2016-04-14

申请号：US14512619

申请日：2014-10-13

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Loic Pierre Louis Renard ,  Kok-Leong Cheng

IPC: H01L31/02 ,  H01L27/14 ,  H01L31/18

CPC classification number: H01L31/02002 ,  H01L24/05 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/85 ,  H01L27/14636 ,  H01L31/186 ,  H01L2224/05014 ,  H01L2224/05554 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/1204 ,  H01L2924/14 ,  H01L2924/00015 ,  H01L2224/05599

Abstract: A method for making an optical semiconductor device may include forming an integrated circuit (IC) including an optical sensing area and a bond pads outside the optical sensing area, and coupling proximal ends of respective bond wires to corresponding bond pads. The method may further include performing a blackening treatment on the bond wires.

Abstract translation: 制造光学半导体器件的方法可以包括形成包括光学感测区域和光学感测区域外的接合焊盘的集成电路（IC），以及将各个接合线的近端耦合到相应的接合焊盘。 该方法还可以包括对接合线进行黑化处理。

公开(公告)号：US20160104663A1

公开(公告)日：2016-04-14

申请号：US14512208

申请日：2014-10-10

Applicant: STMicroelectronics Pte Ltd

Inventor： Wing Shenq WONG

IPC: H01L23/495

CPC classification number: H01L23/49503 ,  H01L23/49541 ,  H01L23/49551 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A lead frame having a plurality of concentric lead frame rings configured to receive and support a variety of integrated circuit die having a variety of sizes. The rings are separated from each other by gaps and coupled together by a plurality of tie bars. The concentric rings may be circular or rectangular. The tie bars may extend diagonally from the rings or perpendicularly to the rings.

Abstract translation: 具有多个同心引线框架环的引线框架，其被配置为接收和支撑具有各种尺寸的各种集成电路管芯。 环通过间隙彼此分开，并通过多个连接杆联接在一起。 同心环可以是圆形或矩形。 连接杆可以从环或者垂直于环对角地延伸。