公开(公告)号：US20150237245A1

公开(公告)日：2015-08-20

申请号：US14183937

申请日：2014-02-19

Applicant: STMicroelectronics Pte Ltd.

Inventor： Loic Pierre Louis Renard ,  Wee Chin Judy Lim

IPC: H04N5/235 ,  H04N5/225

CPC classification number: H04N5/2254 ,  H04N5/217 ,  H04N5/2257 ,  H04N5/3572 ,  H04N17/002 ,  Y10T29/49128

Abstract: A low-cost resin lens is disclosed for use in miniature cameras. The resin lens features a low profile that is particularly well-suited to consumer products such as smart phones. The resin lens is mounted to an integrated circuit die that is attached to a standard four-layer substrate. The integrated circuit die includes electronic and/or optoelectronic circuits to support digital image capture, transfer, and processing. Image correction software adjusts the image to correct for distortion introduced by the resin lens.

Abstract translation: 公开了一种用于微型照相机的低成本树脂透镜。 树脂透镜具有低外形，特别适用于诸如智能手机的消费产品。 树脂透镜安装到附接到标准四层基板的集成电路管芯上。 集成电路管芯包括用于支持数字图像捕获，传输和处理的电子和/或光电子电路。 图像校正软件调整图像以校正由树脂透镜引入的失真。

公开(公告)号：US10347786B2

公开(公告)日：2019-07-09

申请号：US15880090

申请日：2018-01-25

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Loic Pierre Louis Renard ,  Cheng-Lay Ang

IPC: H01G9/20 ,  G01S17/08 ,  G01S7/481 ,  H01L31/12 ,  H01S5/022 ,  H01S5/183 ,  H01L31/042 ,  H01L31/046 ,  H01L31/047 ,  H01L31/173 ,  H01L31/0203 ,  H01L31/0236 ,  H01L31/0475

Abstract: One or more embodiments are directed to system in package (SiP) for optical devices, including proximity sensor packaging. One embodiment is directed to optical sensor that includes a substrate, an image sensor die and a light-emitting device. A first surface of the image sensor die is coupled to the substrate, and a recess is formed extending into the image sensor die from the first surface toward a second surface of the image sensor die. A light transmissive layer is formed in the image sensor die between the recess and the first surface. The optical sensor further includes a light-emitting device that is coupled to the substrate and positioned within the recess formed in the image sensor die.

公开(公告)号：US10749067B2

公开(公告)日：2020-08-18

申请号：US16430928

申请日：2019-06-04

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Loic Pierre Louis Renard ,  Cheng-Lay Ang

IPC: H01L31/173 ,  H01L31/0203 ,  H01L31/0236 ,  G01S17/08 ,  G01S7/481 ,  H01L31/046 ,  H01L31/047 ,  H01L31/0475 ,  H01G9/20 ,  H01L31/042 ,  H01L31/12 ,  H01S5/022 ,  H01S5/183

Abstract: One or more embodiments are directed to system in package (SiP) for optical devices, including proximity sensor packaging. One embodiment is directed to optical sensor that includes a substrate, an image sensor die and a light-emitting device. A first surface of the image sensor die is coupled to the substrate, and a recess is formed extending into the image sensor die from the first surface toward a second surface of the image sensor die. A light transmissive layer is formed in the image sensor die between the recess and the first surface. The optical sensor further includes a light-emitting device that is coupled to the substrate and positioned within the recess formed in the image sensor die.

公开(公告)号：US20160104805A1

公开(公告)日：2016-04-14

申请号：US14512619

申请日：2014-10-13

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Loic Pierre Louis Renard ,  Kok-Leong Cheng

IPC: H01L31/02 ,  H01L27/14 ,  H01L31/18

CPC classification number: H01L31/02002 ,  H01L24/05 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/85 ,  H01L27/14636 ,  H01L31/186 ,  H01L2224/05014 ,  H01L2224/05554 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/1204 ,  H01L2924/14 ,  H01L2924/00015 ,  H01L2224/05599

Abstract: A method for making an optical semiconductor device may include forming an integrated circuit (IC) including an optical sensing area and a bond pads outside the optical sensing area, and coupling proximal ends of respective bond wires to corresponding bond pads. The method may further include performing a blackening treatment on the bond wires.

Abstract translation: 制造光学半导体器件的方法可以包括形成包括光学感测区域和光学感测区域外的接合焊盘的集成电路（IC），以及将各个接合线的近端耦合到相应的接合焊盘。 该方法还可以包括对接合线进行黑化处理。

公开(公告)号：US09911890B2

公开(公告)日：2018-03-06

申请号：US15199390

申请日：2016-06-30

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Loic Pierre Louis Renard ,  Cheng-Lay Ang

IPC: H01L31/0232 ,  H01L21/00 ,  H01L31/173 ,  H01S5/183 ,  H01S5/022 ,  H01L31/12 ,  H01L31/042 ,  H01L31/047 ,  H01L31/0475 ,  H01G9/20 ,  H01L31/046

CPC classification number: H01L31/173 ,  G01S7/4813 ,  G01S17/08 ,  H01G9/20 ,  H01L31/0203 ,  H01L31/02366 ,  H01L31/042 ,  H01L31/046 ,  H01L31/047 ,  H01L31/0475 ,  H01L31/125 ,  H01S5/02252 ,  H01S5/183

Abstract: One or more embodiments are directed to system in package (SiP) for optical devices, including proximity sensor packaging. One embodiment is directed to optical sensor that includes a substrate, an image sensor die and a light-emitting device. A first surface of the image sensor die is coupled to the substrate, and a recess is formed extending into the image sensor die from the first surface toward a second surface of the image sensor die. A light transmissive layer is formed in the image sensor die between the recess and the first surface. The optical sensor further includes a light-emitting device that is coupled to the substrate and positioned within the recess formed in the image sensor die.

公开(公告)号：US09723186B2

公开(公告)日：2017-08-01

申请号：US14183937

申请日：2014-02-19

Applicant: STMicroelectronics Pte Ltd.

Inventor： Loic Pierre Louis Renard ,  Wee Chin Judy Lim

IPC: H04N5/225 ,  H04N17/00 ,  H04N5/217 ,  H04N5/357

CPC classification number: H04N5/2254 ,  H04N5/217 ,  H04N5/2257 ,  H04N5/3572 ,  H04N17/002 ,  Y10T29/49128

Abstract: A low-cost resin lens is disclosed for use in miniature cameras. The resin lens features a low profile that is particularly well-suited to consumer products such as smart phones. The resin lens is mounted to an integrated circuit die that is attached to a standard four-layer substrate. The integrated circuit die includes electronic and/or optoelectronic circuits to support digital image capture, transfer, and processing. Image correction software adjusts the image to correct for distortion introduced by the resin lens.