System, method, and computer-readable medium for autofocusing a videophone camera

    公开(公告)号:US11726392B2

    公开(公告)日:2023-08-15

    申请号:US17009567

    申请日:2020-09-01

    摘要: Systems, methods, and computer-readable mediums for autofocusing cameras in a videophone are disclosed. A videophone system may include a camera having a lens, a lens actuator configured to move the lens, and an image sensor configured to capture images received through the lens. The videophone system may also include a distance sensor configured to determine an object of focus distance between the camera lens and the object of focus. The system includes memory for storing instructions that when executed by a processor cause the camera lens to automatically focus on the object of focus. The processor includes a lookup table configured to correlate an object of focus distance determined by the distance sensor with a digital number that can be converted by a digital to analog converter to a power value sufficient to power lens actuator to move the lens to a predetermined focus position. The lookup table is configured to correlate an object of focus distance returned by the distance sensor with a digital number representing a lens position, such that the object of focus falls within a depth of field about a focal plane corresponding to the lens position.

    ELECTRONIC DEVICE CONVINIENT FOR REPLACEMENT OF CAMERA MODULE THEREOF

    公开(公告)号:US20230171478A1

    公开(公告)日:2023-06-01

    申请号:US17577776

    申请日:2022-01-18

    IPC分类号: H04N5/225 H05K1/18

    摘要: An electronic device includes a camera module comprising a circuit board, a lens, a first IC chip, and at least one metal column. The lens is mounted on the circuit board. The first IC chip and the metal column are arranged on a surface of the circuit board away from the lens. An attachment includes a body and a second IC chip. The first IC chip and the second IC chip can communicate with each other. The circuit board includes a first surface closed to the attachment. The metal column is arranged on the first surface, and the body includes a second surface close to the camera module. The body further includes at least a connecting channel. The metal column is located in the connecting channel to realize the electrical connection between the camera module and the attachment.

    Camera module, photosensitive component, photosensitive-component joined panel, and forming die thereof and manufacturing method thereof

    公开(公告)号:US11664397B2

    公开(公告)日:2023-05-30

    申请号:US17707051

    申请日:2022-03-29

    IPC分类号: H01L27/146 H04N5/225

    摘要: Provided is a camera module and a photosensitive component thereof and a manufacturing method thereof, said photosensitive component comprising: a circuit board, a photosensitive element, and a molding base; the molding base is integrally formed on the circuit board and photosensitive element to form a light window; a first end side corresponding to the molding base adjacent to the flexible region has a first side surface facing the light window; said first side surface comprises a first partial surface arranged adjacent to the photosensitive element and a second partial surface connected to said first portion surface; a first angle between said first partial surface and the optical axis of the camera module is greater than a second angle between the second partial surface and the optical axis; a second end side opposite to and away from the flexible region of the molding base has a second side surface facing the light window; said second side surface comprises a third partial surface arranged adjacent to the photosensitive element and a fourth partial surface connected to said third portion surface; a third angle between the third partial surface and the optical axis is greater than a fourth angle between the fourth partial surface and the optical axis.