-
公开(公告)号：US12022180B2
公开(公告)日：2024-06-25
申请号：US17488876
申请日：2021-09-29
发明人： Mingzhu Wang , Bojie Zhao , Zhenyu Chen , Nan Guo , Takehiko Tanaka
CPC分类号： H04N23/57 , G01N15/0656 , G03B17/02 , H04M1/0264 , H04N23/54 , H04N23/55
摘要： The present invention discloses an array camera module and application thereof, wherein the array camera module comprises at least one optical lens and at least one circuit board assembly. The circuit board assembly further comprises at least one photosensitive chip, at least one circuit board, and at least one electronic component, wherein the photosensitive chip and the circuit board are conductively connected, at least one of the electronic components is attached to a back face of the circuit board, and the optical lens is held in a photosensitive path of the photosensitive chip. In this way, at least one of the length and the width of the array camera module can be reduced, so as to be beneficial to the miniaturization of the array camera module, so that the array camera module can be conveniently applied to a light-weighted and thinned electronic device.
-
公开(公告)号：US11824071B2
公开(公告)日：2023-11-21
申请号：US17678347
申请日：2022-02-23
发明人： Mingzhu Wang , Zhenyu Chen , Nan Guo , Bojie Zhao , Takehiko Tanaka , Zhen Huang , Zhongyu Luan , Heng Jiang
IPC分类号： H01L27/146 , H04N23/00 , H04N23/54 , H04N23/57 , H01L23/00
CPC分类号： H01L27/14618 , H01L23/562 , H01L24/48 , H01L27/1469 , H01L27/14627 , H01L27/14634 , H01L27/14636 , H01L27/14685 , H04N23/00 , H04N23/54 , H04N23/57 , H01L24/45 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/48227 , H01L2224/45139 , H01L2924/00014 , H01L2224/45144 , H01L2924/00014 , H01L2224/45147 , H01L2924/00014
摘要： A molded photosensitive assembly of a camera module includes at least one supporting member formed by a first substance, at least one photosensitive element, at least one circuit board, at least one set of wires electrically connecting the photosensitive element to the circuit board, and at least one molded base. Two ends of each of the wires are respectively connected to a chip connector of the photosensitive element and a circuit connector of the circuit board. The molded base is formed by a second substance and comprises a molded body and has at least one light window, wherein the photosensitive element and the wires are protected by a supporting member which is provided for avoiding an upper mold of a molding-die pressing on the wires during the molding process.
-
公开(公告)号：US11785325B2
公开(公告)日：2023-10-10
申请号：US16633088
申请日：2018-08-03
发明人： Mingzhu Wang , Bojie Zhao , Zhewen Mei , Nan Guo , Lifeng Yao , Zhenyu Chen
CPC分类号： H04N23/57 , B29D11/0048 , G02B7/021 , B29L2011/0016 , H04N23/55 , H05K3/0014
摘要： A camera module and an electronic device having the same, and a method for manufacturing the camera module, wherein the fixed-focus camera module comprises a circuit board; a photosensitive element, which is conductively connected to the circuit board; a molded base, wherein the molded base is integrally molded on the circuit board and the photosensitive element, and the molded base forms a light window, so as to provide a light passage for the photosensitive chip through the light window; and an optical lens, wherein the optical lens is supported on the molded base and corresponds to the light window formed by the molded base, wherein the circuit board comprises a circuit board substrate and at least one electronic component, wherein the at least one electronic component is electrically connected to the circuit board substrate, wherein the circuit board substrate has a blank side, and wherein the blank side of the circuit board substrate is free of the at least one electronic component.
-
公开(公告)号：US11664397B2
公开(公告)日：2023-05-30
申请号：US17707051
申请日：2022-03-29
发明人： Takehiko Tanaka , Bojie Zhao , Zhewen Mei , Nan Guo
IPC分类号： H01L27/146 , H04N5/225
CPC分类号： H01L27/1461 , H01L27/14623 , H01L27/14625 , H04N5/2253 , H04N5/2254 , H04N5/2257
摘要： Provided is a camera module and a photosensitive component thereof and a manufacturing method thereof, said photosensitive component comprising: a circuit board, a photosensitive element, and a molding base; the molding base is integrally formed on the circuit board and photosensitive element to form a light window; a first end side corresponding to the molding base adjacent to the flexible region has a first side surface facing the light window; said first side surface comprises a first partial surface arranged adjacent to the photosensitive element and a second partial surface connected to said first portion surface; a first angle between said first partial surface and the optical axis of the camera module is greater than a second angle between the second partial surface and the optical axis; a second end side opposite to and away from the flexible region of the molding base has a second side surface facing the light window; said second side surface comprises a third partial surface arranged adjacent to the photosensitive element and a fourth partial surface connected to said third portion surface; a third angle between the third partial surface and the optical axis is greater than a fourth angle between the fourth partial surface and the optical axis.
-
公开(公告)号：US11570336B2
公开(公告)日：2023-01-31
申请号：US17242211
申请日：2021-04-27
发明人： Mingzhu Wang , Bojie Zhao , Feifan Chen , Liang Ding , Nan Guo , Ye Wu , Heng Jiang
IPC分类号： H04N5/225 , H01L27/146
摘要： A camera module includes an optical lens, a light-sensitive chip and an electrical support. The electrical support includes a circuit module embedded in a support body to form an integral structure, a connecting member provided on the support body to electrically connect with the circuit module, and a camera component coupled at the support body and electrically connected to the connecting member. Therefore, the electrical support not only forms a circuit board to electrically connect with the camera component but only serves as a base to support the camera component.
-
公开(公告)号：US11363184B2
公开(公告)日：2022-06-14
申请号：US17203673
申请日：2021-03-16
发明人： Mingzhu Wang , Zhenyu Chen , Nan Guo , Takehiko Tanaka , Bojie Zhao , Zilong Deng
IPC分类号： H04N5/225 , B29C45/14 , B29C33/44 , G02B19/00 , G02B7/10 , B29C70/72 , B29C70/88 , G02B13/00 , H05K1/02 , H05K1/18 , H05K3/28 , B29C43/18 , B29C43/36 , B29C43/52 , G02B7/02 , B29L31/34 , B29C45/40 , B29C45/00 , B29D11/00 , B29L31/00 , B29K101/12
摘要： A camera module, a molded circuit board assembly, a molded photosensitive assembly and manufacturing method thereof are disclosed. The camera module includes a molded base which is integrally formed with a circuit board through a molding process, wherein a photosensitive element may be electrically connected on the circuit board and at least a portion of a non-photosensitive area portion of the photosensitive element is also connected by the molded base through the molding process. A light window is formed in a central portion of the molded base to provide a light path for the photosensitive element, wherein a cross section of the light window is configured to have a trapezoidal or multi-step trapezoidal shape which has a size increasing from bottom to top to facilitate demoulding and avoiding stray lights.
-
公开(公告)号：US11315967B2
公开(公告)日：2022-04-26
申请号：US16651455
申请日：2018-09-19
发明人： Takehiko Tanaka , Bojie Zhao , Zhewen Mei , Nan Guo
IPC分类号： H01L27/146 , H04N5/225
摘要： Provided is a camera module and a photosensitive component thereof and a manufacturing method thereof.
-
公开(公告)号：US11223751B2
公开(公告)日：2022-01-11
申请号：US16747455
申请日：2020-01-20
发明人： Mingzhu Wang , Zhenyu Chen , Takehiko Tanaka , Zhongyu Luan , Bojie Zhao , Zhen Huang , Nan Guo , Fengsheng Xi , Heng Jiang , Zilong Deng
IPC分类号： H04N5/225
摘要： A camera module and its photosensitive assembly and manufacturing method thereof are provided. The photosensitive assembly includes a photosensitive element, a window circuit board and a packaging body integrally packaged the photosensitive element and the window circuit board to form an integrated body, wherein the window circuit board has at least one window for receiving the photosensitive element therein.
-
公开(公告)号：US11128787B2
公开(公告)日：2021-09-21
申请号：US16471114
申请日：2017-12-20
发明人： Mingzhu Wang , Takehiko Tanaka , Zhenyu Chen , Nan Guo , Bojie Zhao , Zhewen Mei
摘要： An array camera module having a height difference, a circuit board assembly and a manufacturing method therefor, and an electronic device. The array camera module comprises a first camera module unit and a second camera module unit, wherein the first camera module unit comprises at least one first photosensitive assembly and at least one first lens; the first lens is located on a photosensitive path of the first photosensitive assembly; the first photosensitive assembly comprises at least one extension portion; the extension portion at least partially extends towards the direction away from the first photosensitive assembly; and the second camera module unit is fixedly connected to a second extension portion, so that the ends of the two camera module units are consistent.
-
10.发明授权公开(公告)号：US11094727B2
公开(公告)日：2021-08-17
申请号：US16604715
申请日：2018-04-12
发明人： Mingzhu Wang , Takehiko Tanaka , Nan Guo , Zhenyu Chen , Bojie Zhao
摘要： Provided are a camera module, a molding photosensitive assembly and manufacturing method thereof, and an electronic device. The molding photosensitive assembly comprises a molding portion, at least one photosensitive chip and at least one circuit board, wherein the photosensitive chip is provided on the circuit board, the molding portion comprises a molding portion main body, the molding portion main body is made of a transparent material, and the molding portion main body, the photosensitive chip and the circuit board form an integral structure by means of a molding technique, so as to facilitate production.
-
-
-
-
-
-
-
-
-
搜索结果
122 条记录 (耗时 0.027 秒)
