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公开(公告)号：US09530681B2
公开(公告)日：2016-12-27
申请号：US14986130
申请日：2015-12-31
Applicant: STMicroelectronics Pte Ltd
Inventor： Calvin Leung , Olivier Le Neel
IPC: H01L21/683 , H01L21/768 , H01L27/06 , H01L23/498 , H01L23/538 , H01L23/31 , H01L21/56 , H01L21/48 , H01L23/00 , H01L27/105 , H01L49/02 , H01L29/66
CPC classification number: H01L21/6835 , H01L21/4846 , H01L21/568 , H01L21/76895 , H01L23/3135 , H01L23/49822 , H01L23/4985 , H01L23/5389 , H01L24/20 , H01L27/0629 , H01L27/1052 , H01L28/60 , H01L29/6675 , H01L2221/68345 , H01L2221/68359 , H01L2224/18 , H01L2924/0002 , H01L2924/00
Abstract: An electronic device is formed by depositing polyimide on a glass substrate. A conductive material is deposited on the polyimide and patterned to form electrodes and signal traces. Remaining portions of the electronic device are formed on the polyimide. A second polyimide layer is then formed on the first polyimide layer. The glass substrate is then removed, exposing the electrodes and the top surface of the electronic device.
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2.发明授权Method to provide the thinnest and variable substrate thickness for reliable plastic and flexible electronic device 有权为可靠的塑料和柔性电子设备提供最薄和可变的基板厚度的方法公开(公告)号：US09257423B2
公开(公告)日：2016-02-09
申请号：US14090673
申请日：2013-11-26
Applicant: STMicroelectronics Pte. Ltd.
Inventor： Calvin Leung , Olivier Le Neel
IPC: H01L27/06 , H01L21/768 , H01L23/498 , H01L23/538 , H01L23/31 , H01L21/56
CPC classification number: H01L21/6835 , H01L21/4846 , H01L21/568 , H01L21/76895 , H01L23/3135 , H01L23/49822 , H01L23/4985 , H01L23/5389 , H01L24/20 , H01L27/0629 , H01L27/1052 , H01L28/60 , H01L29/6675 , H01L2221/68345 , H01L2221/68359 , H01L2224/18 , H01L2924/0002 , H01L2924/00
Abstract: An electronic device is formed by depositing polyimide on a glass substrate. A conductive material is deposited on the polyimide and patterned to form electrodes and signal traces. Remaining portions of the electronic device are formed on the polyimide. A second polyimide layer is then formed on the first polyimide layer. The glass substrate is then removed, exposing the electrodes and the top surface of the electronic device.
Abstract translation: 通过在玻璃基板上沉积聚酰亚胺形成电子器件。 导电材料沉积在聚酰亚胺上并图案化以形成电极和信号迹线。 电子器件的剩余部分形成在聚酰亚胺上。 然后在第一聚酰亚胺层上形成第二聚酰亚胺层。 然后去除玻璃基板，暴露电极和电子设备的顶表面。
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公开(公告)号：US10905362B2
公开(公告)日：2021-02-02
申请号：US16407054
申请日：2019-05-08
Applicant: STMICROELECTRONICS PTE LTD
Inventor： Olivier Le Neel , Suman Cherian , Calvin Leung
IPC: G01N27/327 , A61B5/1473 , A61B5/145 , A61B5/1468
Abstract: A universal electrochemical micro-sensor can be used either as a biosensor or an environmental sensor. Because of its small size and flexibility, the micro-sensor is suitable for continuous use to monitor fluids within a live subject, or as an environmental monitor. The micro-sensor can be formed on a reusable glass carrier substrate. A flexible polymer backing, together with a set of electrodes, forms a reservoir that contains an electrolytic fluid chemical reagent. During fabrication, the glass carrier substrate protects the fluid chemical reagent from degradation. A conductive micromesh further contains the reagent while allowing partial exposure to the ambient biological or atmospheric environment. The micromesh density can be altered to accommodate fluid reagents having different viscosities. Flexibility is achieved by attaching a thick polymer tape and peeling away the micro-sensor from the glass carrier substrate. The final structure is thereby transferred to the polymer tape, providing a flexible product.
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公开(公告)号：US20170261458A1
公开(公告)日：2017-09-14
申请号：US15605825
申请日：2017-05-25
Applicant: STMicroelectronics Pte Ltd.
Inventor： Olivier Le Neel , Ravi Shankar , Suman Cherian , Calvin Leung , Tien-Choy Loh , Shian-Yeu Kam
CPC classification number: G01N27/223 , G01D21/02 , G01K7/01 , G01K7/16 , G01K7/186 , G01K7/20 , G01L9/12 , G01L19/0092 , H01L25/0652 , H01L25/50 , H01L27/0248 , H01L29/7804 , H01L2924/0002 , H01L2924/00
Abstract: A semiconductor-based multi-sensor module integrates miniature temperature, pressure, and humidity sensors onto a single substrate. Pressure and humidity sensors can be implemented as capacitive thin film sensors, while the temperature sensor is implemented as a precision miniature Wheatstone bridge. Such multi-sensor modules can be used as building blocks in application-specific integrated circuits (ASICs). Furthermore, the multi-sensor module can be built on top of existing circuitry that can be used to process signals from the sensors. An integrated multi-sensor module that uses differential sensors can measure a variety of localized ambient environmental conditions substantially simultaneously, and with a high level of precision. The multi-sensor module also features an integrated heater that can be used to calibrate or to adjust the sensors, either automatically or as needed. Such a miniature integrated multi-sensor module that features low power consumption can be used in medical monitoring and mobile computing, including smart phone applications.
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公开(公告)号：US20160041114A1
公开(公告)日：2016-02-11
申请号：US14887145
申请日：2015-10-19
Applicant: STMicroelectronics Pte Ltd.
Inventor： Olivier Le Neel , Ravi Shankar , Suman Cherian , Calvin Leung , Tien-Choy Loh , Shian-Yeu Kam
CPC classification number: G01N27/223 , G01D21/02 , G01K7/01 , G01K7/16 , G01K7/186 , G01K7/20 , G01L9/12 , G01L19/0092 , H01L25/0652 , H01L25/50 , H01L27/0248 , H01L29/7804 , H01L2924/0002 , H01L2924/00
Abstract: A semiconductor-based multi-sensor module integrates miniature temperature, pressure, and humidity sensors onto a single substrate. Pressure and humidity sensors can be implemented as capacitive thin film sensors, while the temperature sensor is implemented as a precision miniature Wheatstone bridge. Such multi-sensor modules can be used as building blocks in application-specific integrated circuits (ASICs). Furthermore, the multi-sensor module can be built on top of existing circuitry that can be used to process signals from the sensors. An integrated multi-sensor module that uses differential sensors can measure a variety of localized ambient environmental conditions substantially simultaneously, and with a high level of precision. The multi-sensor module also features an integrated heater that can be used to calibrate or to adjust the sensors, either automatically or as needed. Such a miniature integrated multi-sensor module that features low power consumption can be used in medical monitoring and mobile computing, including smart phone applications.
Abstract translation: 基于半导体的多传感器模块将微型温度，压力和湿度传感器集成到单个基板上。 压力和湿度传感器可以实现为电容薄膜传感器，而温度传感器实现为精密微型惠斯通电桥。 这种多传感器模块可以用作专用集成电路（ASIC）中的构建块。 此外，多传感器模块可以构建在可用于处理来自传感器的信号的现有电路之上。 使用差分传感器的集成多传感器模块可以大量同时测量各种局部环境条件，并以高精度测量。 多传感器模块还具有集成加热器，可用于自动或根据需要校准或调整传感器。 这种具有低功耗的微型集成多传感器模块可用于医疗监控和移动计算，包括智能手机应用。
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Patent Agency Ranking
公开(公告)号：US20150001075A1
公开(公告)日：2015-01-01
申请号：US13929525
申请日：2013-06-27
Applicant: STMicroelectronics Pte Ltd.
Inventor： Olivier Le Neel , Suman Cherian , Calvin Leung , Ravi Shankar , Tien Choy Loh , Shian Yeu Kam
IPC: G01N27/416 , H01L35/34
CPC classification number: H01L35/34 , G01N27/3274 , Y10T29/49117
Abstract: A bio-fluid sensor is formed by depositing polyimide on a glass substrate. Gold and platinum are deposited on the polyimide and patterned to form fluid sensing electrodes, signal traces, and a temperature sensor. The fluid sensor is then fixed to a flexible tape and peeled off of the glass substrate.
Abstract translation: 通过在玻璃基板上沉积聚酰亚胺形成生物流体传感器。 金和铂沉积在聚酰亚胺上并图案化以形成流体感测电极，信号迹线和温度传感器。 然后将流体传感器固定到柔性带并从玻璃基板上剥离。
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公开(公告)号：US09176089B2
公开(公告)日：2015-11-03
申请号：US13853732
申请日：2013-03-29
Applicant: STMicroelectronics Pte Ltd.
Inventor： Olivier Le Neel , Ravi Shankar , Suman Cherian , Calvin Leung , Tien-Choy Loh , Shian-Yeu Kam
IPC: H01L31/058 , G01N27/22 , H01L25/065 , H01L25/00 , G01L9/12 , G01K7/01 , H01L27/02 , H01L29/78 , G01K7/18 , G01K7/20
CPC classification number: G01N27/223 , G01D21/02 , G01K7/01 , G01K7/16 , G01K7/186 , G01K7/20 , G01L9/12 , G01L19/0092 , H01L25/0652 , H01L25/50 , H01L27/0248 , H01L29/7804 , H01L2924/0002 , H01L2924/00
Abstract: A semiconductor-based multi-sensor module integrates miniature temperature, pressure, and humidity sensors onto a single substrate. Pressure and humidity sensors can be implemented as capacitive thin film sensors, while the temperature sensor is implemented as a precision miniature Wheatstone bridge. Such multi-sensor modules can be used as building blocks in application-specific integrated circuits (ASICs). Furthermore, the multi-sensor module can be built on top of existing circuitry that can be used to process signals from the sensors. An integrated multi-sensor module that uses differential sensors can measure a variety of localized ambient environmental conditions substantially simultaneously, and with a high level of precision. The multi-sensor module also features an integrated heater that can be used to calibrate or to adjust the sensors, either automatically or as needed. Such a miniature integrated multi-sensor module that features low power consumption can be used in medical monitoring and mobile computing, including smart phone applications.
Abstract translation: 基于半导体的多传感器模块将微型温度，压力和湿度传感器集成到单个基板上。 压力和湿度传感器可以实现为电容薄膜传感器，而温度传感器实现为精密微型惠斯通电桥。 这种多传感器模块可以用作专用集成电路（ASIC）中的构建块。 此外，多传感器模块可以构建在可用于处理来自传感器的信号的现有电路之上。 使用差分传感器的集成多传感器模块可以大量同时测量各种局部环境条件，并以高精度测量。 多传感器模块还具有集成加热器，可用于自动或根据需要校准或调整传感器。 这种具有低功耗的微型集成多传感器模块可用于医疗监控和移动计算，包括智能手机应用。
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8.发明申请METHOD TO PROVIDE THE THINNEST AND VARIABLE SUBSTRATE THICKNESS FOR RELIABLE PLASTIC AND FLEXIBLE ELECTRONIC DEVICE 有权提供可靠的塑料和柔性电子器件的最小和可变的衬底厚度的方法公开(公告)号：US20150145137A1
公开(公告)日：2015-05-28
申请号：US14090673
申请日：2013-11-26
Applicant: STMicroelectronics Pte. Ltd
Inventor： Calvin Leung , Olivier Le Neel
IPC: H01L23/31 , H01L27/06 , H01L23/528 , H01L21/768 , H01L21/56
CPC classification number: H01L21/6835 , H01L21/4846 , H01L21/568 , H01L21/76895 , H01L23/3135 , H01L23/49822 , H01L23/4985 , H01L23/5389 , H01L24/20 , H01L27/0629 , H01L27/1052 , H01L28/60 , H01L29/6675 , H01L2221/68345 , H01L2221/68359 , H01L2224/18 , H01L2924/0002 , H01L2924/00
Abstract: An electronic device is formed by depositing polyimide on a glass substrate. A conductive material is deposited on the polyimide and patterned to form electrodes and signal traces. Remaining portions of the electronic device are formed on the polyimide. A second polyimide layer is then formed on the first polyimide layer. The glass substrate is then removed, exposing the electrodes and the top surface of the electronic device.
Abstract translation: 通过在玻璃基板上沉积聚酰亚胺形成电子器件。 导电材料沉积在聚酰亚胺上并图案化以形成电极和信号迹线。 电子器件的剩余部分形成在聚酰亚胺上。 然后在第一聚酰亚胺层上形成第二聚酰亚胺层。 然后去除玻璃基板，暴露电极和电子设备的顶表面。
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公开(公告)号：US10317357B2
公开(公告)日：2019-06-11
申请号：US16128076
申请日：2018-09-11
Applicant: STMicroelectronics Pte Ltd.
Inventor： Olivier Le Neel , Ravi Shankar , Suman Cherian , Calvin Leung , Tien-Choy Loh , Shian-Yeu Kam
IPC: G01K7/18 , G01N27/22 , H01L25/00 , H01L25/065 , H01L29/78 , H01L27/02 , G01L19/00 , G01L9/12 , G01K7/20 , G01K7/16 , G01K7/01 , G01D21/02
Abstract: A semiconductor-based multi-sensor module integrates miniature temperature, pressure, and humidity sensors onto a single substrate. Pressure and humidity sensors can be implemented as capacitive thin film sensors, while the temperature sensor is implemented as a precision miniature Wheatstone bridge. Such multi-sensor modules can be used as building blocks in application-specific integrated circuits (ASICs). Furthermore, the multi-sensor module can be built on top of existing circuitry that can be used to process signals from the sensors. An integrated multi-sensor module that uses differential sensors can measure a variety of localized ambient environmental conditions substantially simultaneously, and with a high level of precision. The multi-sensor module also features an integrated heater that can be used to calibrate or to adjust the sensors, either automatically or as needed. Such a miniature integrated multi-sensor module that features low power consumption can be used in medical monitoring and mobile computing, including smart phone applications.
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公开(公告)号：US10299711B2
公开(公告)日：2019-05-28
申请号：US15873557
申请日：2018-01-17
Applicant: STMICROELECTRONICS PTE LTD
Inventor： Olivier Le Neel , Suman Cherian , Calvin Leung
IPC: G01N27/327 , A61B5/1473 , A61B5/145 , A61B5/1468
Abstract: A universal electrochemical micro-sensor can be used either as a biosensor or an environmental sensor. Because of its small size and flexibility, the micro-sensor is suitable for continuous use to monitor fluids within a live subject, or as an environmental monitor. The micro-sensor can be formed on a reusable glass carrier substrate. A flexible polymer backing, together with a set of electrodes, forms a reservoir that contains an electrolytic fluid chemical reagent. During fabrication, the glass carrier substrate protects the fluid chemical reagent from degradation. A conductive micromesh further contains the reagent while allowing partial exposure to the ambient biological or atmospheric environment. The micromesh density can be altered to accommodate fluid reagents having different viscosities. Flexibility is achieved by attaching a thick polymer tape and peeling away the micro-sensor from the glass carrier substrate. The final structure is thereby transferred to the polymer tape, providing a flexible product.
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