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公开(公告)号：US09851328B2
公开(公告)日：2017-12-26
申请号：US14462432
申请日：2014-08-18
Applicant: STMicroelectronics Pte Ltd
Inventor： Jerome Teysseyre , Yonggang Jin , Suman Cherian
IPC: G01N27/28 , G01N27/403 , G01N27/413 , G01N27/406 , G01N27/407 , H05K1/18
CPC classification number: G01N27/4065 , G01N27/4062 , G01N27/4071 , G01N27/4077 , H05K1/185 , H05K2201/09118 , H05K2201/10151
Abstract: A compact microelectronic gas sensor module includes electrical contacts formed in such a way that they do not consume real estate on an integrated circuit chip. Using such a design, the package can be miniaturized further. The gas sensor is packaged together with a custom-designed Application Specific Integrated Circuit (ASIC) that provides circuitry for processing sensor signals to identify gas species within a sample under test. In one example, the output signal strength of the sensor is enhanced by providing an additional metal surface area in the form of pillars exposed to an electrolytic gas sensing compound, while reducing the overall package size. In some examples, bottom side contacts are formed on the underside of the substrate on which the gas sensor is formed. Sensor electrodes may be electrically coupled to the ASIC directly, or indirectly by vias.
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公开(公告)号：US09435763B2
公开(公告)日：2016-09-06
申请号：US13929515
申请日：2013-06-27
Applicant: STMicroelectronics Pte Ltd.
Inventor： Olivier Le Neel , Suman Cherian
IPC: G01N27/327
CPC classification number: G01N27/3274 , G01N27/327
Abstract: A bio-fluid test strip includes a fluid receiving area and a contact pad area for interfacing with a fluid sensing device. The test strip includes a fluid sensing electrodes and a first temperature sensing resistor in the fluid receiving area. The test strip further includes a second temperature sensing resistor in the contact pad area. The first and second temperature sensing resistors together provide an indication of the temperature difference between the fluid sensing area and ambience.
Abstract translation: 生物流体测试条包括用于与流体感测装置接口的流体接收区域和接触焊盘区域。 测试条在流体接收区域中包括流体感测电极和第一温度感测电阻器。 测试条还包括接触焊盘区域中的第二温度感测电阻器。 第一和第二温度感测电阻器一起提供流体感测区域和环境之间的温度差的指示。
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公开(公告)号：US20140294046A1
公开(公告)日：2014-10-02
申请号：US13853801
申请日：2013-03-29
Applicant: STMICROELECTRONICS PTE LTD.
Inventor： Olivier Le Neel , Ravi Shankar , Suman Cherian
IPC: G01W1/02
Abstract: Sensors for air flow, temperature, pressure, and humidity are integrated onto a single semiconductor die within a miniaturized Venturi chamber to provide a microelectronic semiconductor-based environmental multi-sensor module that includes an air flow meter. One or more such multi-sensor modules can be used as building blocks in dedicated application-specific integrated circuits (ASICs) for use in environmental control appliances that rely on measurements of air flow. Furthermore, the sensor module can be built on top of existing circuitry that can be used to process signals from the sensors. By integrating the Venturi chamber with accompanying environmental sensors, correction factors can be obtained and applied to compensate for temporal humidity fluctuations and spatial temperature variation using the Venturi apparatus.
Abstract translation: 用于气流，温度，压力和湿度的传感器被集成到小型文丘里室内的单个半导体管芯上，以提供包括空气流量计的基于微电子半导体的环境多传感器模块。 一个或多个这样的多传感器模块可以用作专用于专用集成电路（ASIC）中的构件块，用于依赖于气流测量的环境控制设备。 此外，传感器模块可以建立在可用于处理来自传感器的信号的现有电路之上。 通过将文丘里腔室与随附的环境传感器集成，可以获得校正因子并应用于使用文丘里仪器来补偿时间湿度波动和空间温度变化。
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公开(公告)号：US20180067074A1
公开(公告)日：2018-03-08
申请号：US15812731
申请日：2017-11-14
Applicant: STMicroelectronics Pte Ltd
Inventor： Jerome Teysseyre , Yonggang Jin , Suman Cherian
IPC: G01N27/406 , G01N27/407 , H05K1/18
CPC classification number: G01N27/4065 , G01N27/4062 , G01N27/4071 , G01N27/4077 , H05K1/185 , H05K2201/09118 , H05K2201/10151
Abstract: A compact microelectronic gas sensor module includes electrical contacts formed in such a way that they do not consume real estate on an integrated circuit chip. Using such a design, the package can be miniaturized further. The gas sensor is packaged together with a custom-designed Application Specific Integrated Circuit (ASIC) that provides circuitry for processing sensor signals to identify gas species within a sample under test. In one example, the output signal strength of the sensor is enhanced by providing an additional metal surface area in the form of pillars exposed to an electrolytic gas sensing compound, while reducing the overall package size. In some examples, bottom side contacts are formed on the underside of the substrate on which the gas sensor is formed. Sensor electrodes may be electrically coupled to the ASIC directly, or indirectly by vias.
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公开(公告)号：US20160047774A1
公开(公告)日：2016-02-18
申请号：US14462432
申请日：2014-08-18
Applicant: STMicroelectronics Pte Ltd
Inventor： Jerome Teysseyre , Yonggang Jin , Suman Cherian
IPC: G01N27/406 , H05K3/42 , H05K13/04 , G01N27/407
CPC classification number: G01N27/4065 , G01N27/4062 , G01N27/4071 , G01N27/4077 , H05K1/185 , H05K2201/09118 , H05K2201/10151
Abstract: A compact microelectronic gas sensor module includes electrical contacts formed in such a way that they do not consume real estate on an integrated circuit chip. Using such a design, the package can be miniaturized further. The gas sensor is packaged together with a custom-designed Application Specific Integrated Circuit (ASIC) that provides circuitry for processing sensor signals to identify gas species within a sample under test. In one example, the output signal strength of the sensor is enhanced by providing an additional metal surface area in the form of pillars exposed to an electrolytic gas sensing compound, while reducing the overall package size. In some examples, bottom side contacts are formed on the underside of the substrate on which the gas sensor is formed. Sensor electrodes may be electrically coupled to the ASIC directly, or indirectly by vias.
Abstract translation: 紧凑的微电子气体传感器模块包括以这样的方式形成的电触头，使得它们不消耗集成电路芯片上的不动产。 使用这种设计，可以进一步小型化包装。 气体传感器与定制设计的专用集成电路（ASIC）封装在一起，该集成电路提供用于处理传感器信号以识别被测样品内的气体种类的电路。 在一个示例中，通过提供暴露于电解气体感测化合物的柱形式的附加金属表面积，同时减小整体封装尺寸，增强了传感器的输出信号强度。 在一些示例中，在形成有气体传感器的基板的下侧上形成底侧触点。 传感器电极可以直接或间接地通过通孔电耦合到ASIC。
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Patent Agency Ranking
公开(公告)号：US09176089B2
公开(公告)日：2015-11-03
申请号：US13853732
申请日：2013-03-29
Applicant: STMicroelectronics Pte Ltd.
Inventor： Olivier Le Neel , Ravi Shankar , Suman Cherian , Calvin Leung , Tien-Choy Loh , Shian-Yeu Kam
IPC: H01L31/058 , G01N27/22 , H01L25/065 , H01L25/00 , G01L9/12 , G01K7/01 , H01L27/02 , H01L29/78 , G01K7/18 , G01K7/20
CPC classification number: G01N27/223 , G01D21/02 , G01K7/01 , G01K7/16 , G01K7/186 , G01K7/20 , G01L9/12 , G01L19/0092 , H01L25/0652 , H01L25/50 , H01L27/0248 , H01L29/7804 , H01L2924/0002 , H01L2924/00
Abstract: A semiconductor-based multi-sensor module integrates miniature temperature, pressure, and humidity sensors onto a single substrate. Pressure and humidity sensors can be implemented as capacitive thin film sensors, while the temperature sensor is implemented as a precision miniature Wheatstone bridge. Such multi-sensor modules can be used as building blocks in application-specific integrated circuits (ASICs). Furthermore, the multi-sensor module can be built on top of existing circuitry that can be used to process signals from the sensors. An integrated multi-sensor module that uses differential sensors can measure a variety of localized ambient environmental conditions substantially simultaneously, and with a high level of precision. The multi-sensor module also features an integrated heater that can be used to calibrate or to adjust the sensors, either automatically or as needed. Such a miniature integrated multi-sensor module that features low power consumption can be used in medical monitoring and mobile computing, including smart phone applications.
Abstract translation: 基于半导体的多传感器模块将微型温度，压力和湿度传感器集成到单个基板上。 压力和湿度传感器可以实现为电容薄膜传感器，而温度传感器实现为精密微型惠斯通电桥。 这种多传感器模块可以用作专用集成电路（ASIC）中的构建块。 此外，多传感器模块可以构建在可用于处理来自传感器的信号的现有电路之上。 使用差分传感器的集成多传感器模块可以大量同时测量各种局部环境条件，并以高精度测量。 多传感器模块还具有集成加热器，可用于自动或根据需要校准或调整传感器。 这种具有低功耗的微型集成多传感器模块可用于医疗监控和移动计算，包括智能手机应用。
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公开(公告)号：US11231386B2
公开(公告)日：2022-01-25
申请号：US15812731
申请日：2017-11-14
Applicant: STMicroelectronics Pte Ltd
Inventor： Jerome Teysseyre , Yonggang Jin , Suman Cherian
IPC: G01N27/406 , G01N27/407 , H05K1/18
Abstract: A compact microelectronic gas sensor module includes electrical contacts formed in such a way that they do not consume real estate on an integrated circuit chip. Using such a design, the package can be miniaturized further. The gas sensor is packaged together with a custom-designed Application Specific Integrated Circuit (ASIC) that provides circuitry for processing sensor signals to identify gas species within a sample under test. In one example, the output signal strength of the sensor is enhanced by providing an additional metal surface area in the form of pillars exposed to an electrolytic gas sensing compound, while reducing the overall package size. In some examples, bottom side contacts are formed on the underside of the substrate on which the gas sensor is formed. Sensor electrodes may be electrically coupled to the ASIC directly, or indirectly by vias.
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公开(公告)号：US10905362B2
公开(公告)日：2021-02-02
申请号：US16407054
申请日：2019-05-08
Applicant: STMICROELECTRONICS PTE LTD
Inventor： Olivier Le Neel , Suman Cherian , Calvin Leung
IPC: G01N27/327 , A61B5/1473 , A61B5/145 , A61B5/1468
Abstract: A universal electrochemical micro-sensor can be used either as a biosensor or an environmental sensor. Because of its small size and flexibility, the micro-sensor is suitable for continuous use to monitor fluids within a live subject, or as an environmental monitor. The micro-sensor can be formed on a reusable glass carrier substrate. A flexible polymer backing, together with a set of electrodes, forms a reservoir that contains an electrolytic fluid chemical reagent. During fabrication, the glass carrier substrate protects the fluid chemical reagent from degradation. A conductive micromesh further contains the reagent while allowing partial exposure to the ambient biological or atmospheric environment. The micromesh density can be altered to accommodate fluid reagents having different viscosities. Flexibility is achieved by attaching a thick polymer tape and peeling away the micro-sensor from the glass carrier substrate. The final structure is thereby transferred to the polymer tape, providing a flexible product.
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公开(公告)号：US20170261458A1
公开(公告)日：2017-09-14
申请号：US15605825
申请日：2017-05-25
Applicant: STMicroelectronics Pte Ltd.
Inventor： Olivier Le Neel , Ravi Shankar , Suman Cherian , Calvin Leung , Tien-Choy Loh , Shian-Yeu Kam
CPC classification number: G01N27/223 , G01D21/02 , G01K7/01 , G01K7/16 , G01K7/186 , G01K7/20 , G01L9/12 , G01L19/0092 , H01L25/0652 , H01L25/50 , H01L27/0248 , H01L29/7804 , H01L2924/0002 , H01L2924/00
Abstract: A semiconductor-based multi-sensor module integrates miniature temperature, pressure, and humidity sensors onto a single substrate. Pressure and humidity sensors can be implemented as capacitive thin film sensors, while the temperature sensor is implemented as a precision miniature Wheatstone bridge. Such multi-sensor modules can be used as building blocks in application-specific integrated circuits (ASICs). Furthermore, the multi-sensor module can be built on top of existing circuitry that can be used to process signals from the sensors. An integrated multi-sensor module that uses differential sensors can measure a variety of localized ambient environmental conditions substantially simultaneously, and with a high level of precision. The multi-sensor module also features an integrated heater that can be used to calibrate or to adjust the sensors, either automatically or as needed. Such a miniature integrated multi-sensor module that features low power consumption can be used in medical monitoring and mobile computing, including smart phone applications.
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公开(公告)号：US20160041114A1
公开(公告)日：2016-02-11
申请号：US14887145
申请日：2015-10-19
Applicant: STMicroelectronics Pte Ltd.
Inventor： Olivier Le Neel , Ravi Shankar , Suman Cherian , Calvin Leung , Tien-Choy Loh , Shian-Yeu Kam
CPC classification number: G01N27/223 , G01D21/02 , G01K7/01 , G01K7/16 , G01K7/186 , G01K7/20 , G01L9/12 , G01L19/0092 , H01L25/0652 , H01L25/50 , H01L27/0248 , H01L29/7804 , H01L2924/0002 , H01L2924/00
Abstract: A semiconductor-based multi-sensor module integrates miniature temperature, pressure, and humidity sensors onto a single substrate. Pressure and humidity sensors can be implemented as capacitive thin film sensors, while the temperature sensor is implemented as a precision miniature Wheatstone bridge. Such multi-sensor modules can be used as building blocks in application-specific integrated circuits (ASICs). Furthermore, the multi-sensor module can be built on top of existing circuitry that can be used to process signals from the sensors. An integrated multi-sensor module that uses differential sensors can measure a variety of localized ambient environmental conditions substantially simultaneously, and with a high level of precision. The multi-sensor module also features an integrated heater that can be used to calibrate or to adjust the sensors, either automatically or as needed. Such a miniature integrated multi-sensor module that features low power consumption can be used in medical monitoring and mobile computing, including smart phone applications.
Abstract translation: 基于半导体的多传感器模块将微型温度，压力和湿度传感器集成到单个基板上。 压力和湿度传感器可以实现为电容薄膜传感器，而温度传感器实现为精密微型惠斯通电桥。 这种多传感器模块可以用作专用集成电路（ASIC）中的构建块。 此外，多传感器模块可以构建在可用于处理来自传感器的信号的现有电路之上。 使用差分传感器的集成多传感器模块可以大量同时测量各种局部环境条件，并以高精度测量。 多传感器模块还具有集成加热器，可用于自动或根据需要校准或调整传感器。 这种具有低功耗的微型集成多传感器模块可用于医疗监控和移动计算，包括智能手机应用。
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