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    Laser machining method
    1.
    发明授权
    Laser machining method 失效
    激光加工方法

    公开(公告)号：US5939010A

    公开(公告)日：1999-08-17

    申请号：US996817

    申请日：1997-12-23

    申请人： Takayuki Yuyama ,  Masaru Kanaoka

    发明人： Takayuki Yuyama ,  Masaru Kanaoka

    IPC分类号： B23K26/00 ,  B23K26/06 ,  B23K26/38 ,  H05K3/00

    CPC分类号： B23K26/0622 ,  B23K26/382 ,  B23K26/386 ,  B23K26/40 ,  B23K26/402 ,  H05K3/0026 ,  B23K2203/16 ,  B23K2203/42 ,  B23K2203/50

    摘要： In the present invention, a laser beam with a prespecified oscillation frequency is divided into the arbitrary number of pulses to be irradiated to all holes in an area, and this step is repeated until the irradiation reaches a desired number of pulses, whereby an interactive time can be decided according to the number of divided pulses and a cooling period of time can be obtained, and also the number of pulses per one division is set to be a plurality of pulses, which allows an etching rate to be increased, so that the number of pulses required for machining can be reduced as compared to a case where a laser is irradiated to all the holes pulse by pulse.

    摘要翻译： 在本发明中，具有预定振荡频率的激光束被划分为要照射到区域中的所有孔的任意数量的脉冲，并且重复该步骤直到照射达到期望数量的脉冲，由此交互时间 可以根据分割脉冲的数量决定并且可以获得冷却时间，并且每个分割的脉冲数也被设置为多个脉冲，这允许蚀刻速率增加，使得 与通过脉冲脉冲对激光照射到所有空穴的情况相比，可以减少加工所需的脉冲数。

    Multiple frequency processing to improve electrical resistivity of blind micro-vias
    3.
    发明授权
    Multiple frequency processing to improve electrical resistivity of blind micro-vias 失效
    多频处理提高了盲孔的电阻率

    公开(公告)号：US5731047A

    公开(公告)日：1998-03-24

    申请号：US746425

    申请日：1996-11-08

    申请人： David B. Noddin

    发明人： David B. Noddin

    IPC分类号： B23K26/00 ,  H05K3/00 ,  H05K3/46 ,  B05D3/02 ,  C08J7/18

    CPC分类号： H05K3/0035 ,  B23K26/0006 ,  B23K2203/16 ,  B23K2203/30 ,  B23K2203/42 ,  H01L2224/16225 ,  H01L2924/15311 ,  H05K2203/0554 ,  H05K2203/1105 ,  H05K2203/128 ,  H05K3/4652

    摘要： A method of forming a blind-via in a laminated substrate by forming a first conductive layer. A dielectric layer is then formed on the first conductive layer. An exposed second conductive layer is formed on the dielectric layer, with the second conductive layer having a preformed aperture. The dielectric layer is laser drilled through to the first conductive layer to form a blind-via at a location within the preformed aperture of the second conductive layer using a plurality of laser pulses. Each laser pulse has a first energy density per pulse that is greater than an ablation threshold of the dielectric layer and less than an ablation threshold of the first conductive layer. The first conductive layer is then laser drilled for a predetermined number of pulses. Each of the predetermined number of pulses has a second energy density per pulse that is greater than an ablation threshold of the first conductive layer. The predetermined number of pulses cause the surface of the first conductive layer exposed by the laser drilling to become molten.

    摘要翻译： 通过形成第一导电层在层叠基板中形成盲通孔的方法。 然后在第一导电层上形成电介质层。 暴露的第二导电层形成在电介质层上，其中第二导电层具有预制孔。 使用多个激光脉冲将电介质层激光钻到第一导电层上以在第二导电层的预制孔的位置处形成盲通孔。 每个激光脉冲具有大于电介质层的消融阈值且小于第一导电层的消融阈值的每脉冲的第一能量密度。 然后将第一导电层激光钻出预定数量的脉冲。 预定数量的脉冲中的每一个具有大于第一导电层的消融阈值的每脉冲的第二能量密度。 预定数量的脉冲导致由激光钻孔暴露的第一导电层的表面变得熔化。

    Bonding diverse thermal expansion materials
    7.
    发明授权
    Bonding diverse thermal expansion materials 失效
    粘合各种热膨胀材料

    公开(公告)号：US5495978A

    公开(公告)日：1996-03-05

    申请号：US300857

    申请日：1994-09-06

    申请人： David L. Muth

    发明人： David L. Muth

    IPC分类号： B23K1/19 ,  B23K103/16

    CPC分类号： B23K1/19 ,  B23K2203/16

    摘要： The disclosure is for a method of bonding materials with severely mismatched coefficients of thermal expansion, such as carbon/carbon and a composite of aluminum oxide and niobium and for the structure of the bonded joint. The key to a good bond between such materials is the use of a thin layer of porous sintered metal as an intermediate material which is bonded to the two diverse thermal expansion materials. The sintered material has a porosity of 20 to 80 percent, and stays bonded to both of the different material surfaces while the sintered material itself is also not destroyed by the thermal stress.

    摘要翻译： 本公开内容涉及将具有严重错配的热膨胀系数的材料如碳/碳和氧化铝和铌的复合物以及用于结合接头的结构的方法。 这种材料之间良好结合的关键是使用薄层的多孔烧结金属作为中间材料，其结合到两种不同的热膨胀材料上。 烧结材料的孔隙率为20〜80％，并且与两种不同的材料表面保持粘合，而烧结材料本身也不被热应力破坏。

    Apparatus and method for producing a printing screen
    8.
    发明授权
    Apparatus and method for producing a printing screen 失效
    用于制造印刷丝网的装置和方法

    公开(公告)号：US5444212A

    公开(公告)日：1995-08-22

    申请号：US191482

    申请日：1994-02-04

    申请人： George MacNaughton ,  Steven Forti ,  Douglas Whittington ,  Kevin Ackley

    发明人： George MacNaughton ,  Steven Forti ,  Douglas Whittington ,  Kevin Ackley

    IPC分类号： B23K26/06 ,  B23K26/08 ,  B23K26/38 ,  B41C1/14 ,  B41F15/08 ,  H05K3/12

    CPC分类号： B23K26/382 ,  B23K26/0622 ,  B23K26/0846 ,  B23K26/40 ,  B23K26/402 ,  B41C1/145 ,  B41F15/0863 ,  B23K2201/34 ,  B23K2203/05 ,  B23K2203/08 ,  B23K2203/12 ,  B23K2203/16 ,  B23K2203/38 ,  B23K2203/40 ,  B23K2203/42 ,  B23K2203/50 ,  H05K3/1216

    摘要： An apparatus for inking or printing on the surface of an item, such as a badge or emblem, is described. The apparatus incorporates a number of sub-systems including: an apparatus for holding and positioning blank screen material; a laser ablation system for producing the desired hole pattern in the blank screen material to form screens; a print/ink station; a table assembly for supporting a plurality of labels or emblems and moving such labels or emblems sequentially to the print station; and an apparatus for moving the screens to the print/ink station. The apparatus also includes heater for drying the ink after the printing/inking step is completed. The apparatus for producing the patterns includes a laser, mirrors for moving the beam in the x and y directions, and optics for focusing the beam on the blank screen material. The inking station includes an ink tray, a reciprocating squeegee and blades for wiping ink from the leading edges of the squeegee after the squeegee passes over the pattern.

    摘要翻译： 描述了用于在诸如徽章或徽章的物品的表面上着墨或印刷的装置。 该装置包括许多子系统，包括：用于保持和定位空白屏幕材料的装置; 激光烧蚀系统，用于在坯料筛网材料中产生所需的孔图形以形成筛网; 印刷/墨水站; 用于支撑多个标签或标志并将这样的标签或标志顺序地移动到打印站的工作台组件; 以及用于将屏幕移动到打印/墨水站的装置。 该装置还包括在打印/上墨步骤完成之后干燥油墨的加热器。 用于产生图案的装置包括激光器，用于在x和y方向上移动光束的反射镜，以及用于将光束聚焦在空白屏幕材料上的光学器件。 上墨站包括墨盘，往复式刮刀和用于在刮板通过图案之后从刮板的前缘擦拭墨的刀片。