公开(公告)号：US5628926A

公开(公告)日：1997-05-13

申请号：US364451

申请日：1994-12-27

申请人： Haba Belgacem ,  Yukio Morishige

发明人： Haba Belgacem ,  Yukio Morishige

IPC分类号： B23K26/16 ,  B23K26/38 ,  B23K26/40 ,  H01L21/48 ,  H05K3/00 ,  H05K3/38 ,  B23K26/00

CPC分类号： H05K3/0032 ,  B23K26/16 ,  B23K26/382 ,  B23K26/40 ,  B23K26/402 ,  H01L21/486 ,  B23K2201/40 ,  B23K2201/42 ,  B23K2203/08 ,  B23K2203/12 ,  B23K2203/14 ,  B23K2203/16 ,  B23K2203/172 ,  B23K2203/26 ,  B23K2203/42 ,  B23K2203/50 ,  H05K2201/0112 ,  H05K2201/015 ,  H05K2201/0154 ,  H05K2201/0209 ,  H05K2203/0285 ,  H05K2203/1388 ,  H05K3/002 ,  H05K3/0055 ,  H05K3/388

摘要： A method of forming via holes in an organic insulation film or cutting the film includes the steps of exposing predetermined parts of the film to a laser beam to raise a temperature of the exposed parts of the film until the exposed parts are transformed or decomposed and subjecting the film to an ultra sonic wave so that the transformed or decomposed parts are dispersed.

摘要翻译： 在有机绝缘膜中形成通孔或切割膜的方法包括以下步骤：将膜的预定部分暴露于激光束，以提高膜的暴露部分的温度，直到暴露部分变形或分解并且经受 将该胶片变成超声波，使得转化或分解的部分分散。

公开(公告)号：US07122889B2

公开(公告)日：2006-10-17

申请号：US10894693

申请日：2004-07-19

申请人： Haba Belgacem

发明人： Haba Belgacem

IPC分类号： H01L23/48

CPC分类号： H05K1/118 ,  H01L23/36 ,  H01L23/5387 ,  H01L25/0657 ,  H01L2224/16 ,  H01L2225/06551 ,  H01L2225/06579 ,  H01L2225/06589 ,  H01L2924/00014 ,  H01L2924/0102 ,  H01L2924/01079 ,  H01L2924/3011 ,  H05K1/056 ,  H05K1/117 ,  H05K1/189 ,  H05K2201/055 ,  H05K2203/302 ,  H01L2224/0401

摘要： The semiconductor module includes a substrate, at least one semiconductor, and electrical contacts. The substrate includes a base layer having a substantially planar base layer first surface opposing a substantially planar base layer second surface. The base layer first surface is exposed to atmosphere and where the base layer is electrically conductive. The substrate also includes an insulator layer having a substantially planar insulator layer first surface opposing a substantially planar insulator layer second surface. The base layer second surface and the insulator layer first surface are adjacent and contiguous to one another and where the insulator layer is electrically non-conductive. Finally, the substrate includes a conductive layer having a substantially planar conductive layer first surface opposing a substantially planar conductive layer second surface. The insulator layer second surface and the conductive layer first surface are adjacent and contiguous to one another and where the conductive layer is electrically conductive.

摘要翻译： 半导体模块包括衬底，至少一个半导体和电触头。 衬底包括基底层，其具有与基本平坦的基底层第二表面相对的基本平坦的基底层第一表面。 基底层第一表面暴露于大气中，其中基底层是导电的。 衬底还包括具有与基本上平坦的绝缘体层第二表面相对的基本平坦的绝缘体层第一表面的绝缘体层。 基极层第二表面和绝缘体层第一表面彼此相邻并邻接，并且其中绝缘体层是非导电的。 最后，衬底包括具有与基本平坦的导电层第二表面相对的基本上平面的导电层第一表面的导电层。 绝缘体层第二表面和导电层第一表面彼此相邻并邻接，并且其中导电层是导电的。

公开(公告)号：US06833984B1

公开(公告)日：2004-12-21

申请号：US10071298

申请日：2002-02-07

申请人： Haba Belgacem

发明人： Haba Belgacem

IPC分类号： H02H900

CPC分类号： H01L23/647 ,  H01L23/36 ,  H01L23/367 ,  H01L23/4985 ,  H01L23/5387 ,  H01L23/552 ,  H01L24/86 ,  H01L25/0655 ,  H01L25/0657 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06527 ,  H01L2225/06551 ,  H01L2225/06579 ,  H01L2225/06586 ,  H01L2225/06589 ,  H01L2924/12032 ,  H01L2924/14 ,  H01L2924/19105 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/0246 ,  H05K1/189 ,  H05K3/0061 ,  H05K2201/056 ,  H05K2201/09445 ,  H05K2201/10022 ,  H05K2201/1056 ,  H05K2201/10674 ,  H01L2924/00

摘要： A semiconductor module is provided which includes a beat spreader, at least two semiconductors thermally coupled to the heat spreader, and a plurality of electrically conductive leads electrically connected to the semiconductors. At least one of the electrically conductive leads is common to both of the semiconductors The semiconductor module also includes a termination resistor electrically coupled to at least one of the semiconductors. A method of making a semiconductor module is also taught, whereby a plurality of electrically conductive leads are provided. At least two semiconductors are electrically coupled to the plurality of electrically conductive leads, where at least one of the electrically conductive leads is common to both of the semiconductors. The semiconductors are then thermally coupled to a heat spreader. Subsequently, a termination resistor is electrically coupled to at least one of the semiconductors.

摘要翻译： 提供一种半导体模块，其包括击打扩展器，热耦合到散热器的至少两个半导体，以及电连接到半导体的多个导电引线。 至少一个导电引线对于两个半导体是共同的。半导体模块还包括电耦合到至少一个半导体的终端电阻器。 还教导了制造半导体模块的方法，由此提供多个导电引线。 至少两个半导体电耦合到多个导电引线，其中至少一个导电引线对于两个半导体都是共同的。 然后将半导体热耦合到散热器。 随后，终端电阻器电耦合到至少一个半导体。