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400 条记录 (耗时 0.019 秒)

    LASER-INSCRIBED AND LASER-WELDED SHAPED BODIES AND PRODUCTION THEREOF
    1.
    发明公开
    LASER-INSCRIBED AND LASER-WELDED SHAPED BODIES AND PRODUCTION THEREOF 审中-公开

    公开(公告)号：US20240262043A1

    公开(公告)日：2024-08-08

    申请号：US18289766

    申请日：2022-05-04

    申请人： BASF SE

    发明人： Peter Eibeck

    IPC分类号： B29C65/16 ,  B29K67/00

    CPC分类号： B29C65/1616 ,  B29C65/1635 ,  B29C2791/009 ,  B29C2795/007 ,  B29K2067/006 ,  B29K2995/0027

    摘要： The present invention relates to shaped bodies comprising at least a first molded part and a second molded part, where the first molded part is at least partly transparent to NIR radiation, the second molded part absorbs NIR radiation such that the first molded part and the second molded part are at least partly joined to one another by laser transmission welding, where the first molded part has at least one subregion which is dark-colored and where at least a portion of the subregion has a light-colored laser inscription, where the first molded part consists at least partly of a molding compound comprising, based in each case on the total weight of the molding compound, A)>38.2% by weight to 99.98% by weight of a thermoplastic polymer or a mixture of thermoplastic polymers, B) 0.01% by weight to

    Flexible packaging structure with built-in tamper-evidence features and method for making same
    3.
    发明授权
    Flexible packaging structure with built-in tamper-evidence features and method for making same 有权

    公开(公告)号：US11858195B2

    公开(公告)日：2024-01-02

    申请号：US17970691

    申请日：2022-10-21

    申请人： SONOCO DEVELOPMENT, INC.

    发明人： Benjamin Davis ,  Scott William Huffer

    IPC分类号： B29C59/00 ,  B65D75/58 ,  B29L9/00

    CPC分类号： B29C59/007 ,  B65D75/5833 ,  B65D75/5855 ,  B29C2791/009 ,  B29L2009/00 ,  B65D2401/00 ,  Y10T156/1082

    摘要： A flexible packaging laminate has built-in opening/reclose and tamper-evidence features by forming the laminate from an outer structure joined in face-to-face relation to an inner structure. Score lines are formed in both structures to enable an opening to be formed through the laminate by lifting a flap or the like out of the plane of the laminate. The score line through the outer structure defines a larger opening than the score line through the inner structure, such that a marginal region of the outer structure extends beyond the edge of the opening portion of the inner structure. A pressure-sensitive adhesive is used to re-adhere the marginal region to an underlying surface of the inner structure adjacent the opening through the laminate. The outer score line includes at least one tear portion that is torn through upon initial opening, thus indicating the package has been at least partially opened.

    Flexible Packaging Structure With Built-In Tamper-Evidence Features and Method for Making Same
    5.
    发明申请
    Flexible Packaging Structure With Built-In Tamper-Evidence Features and Method for Making Same 审中-公开

    公开(公告)号：US20180071974A1

    公开(公告)日：2018-03-15

    申请号：US15804793

    申请日：2017-11-06

    申请人： Sonoco Development, Inc.

    发明人： Scott William Huffer

    IPC分类号： B29C59/00 ,  B65D75/58

    CPC分类号： B29C59/007 ,  B29C2791/009 ,  B29L2009/00 ,  B65D75/5833 ,  B65D75/5855 ,  B65D2101/00 ,  Y10T156/1082

    摘要： A flexible packaging laminate has built-in opening/reclose and tamper-evidence features by forming the laminate from an outer structure joined in face-to-face relation to an inner structure. Score lines are formed in both structures to enable an opening to be formed through the laminate by lifting a flap or the like out of the plane of the laminate. The score line through the outer structure defines a larger opening than the score line through the inner structure, such that a marginal region of the outer structure extends beyond the edge of the opening portion of the inner structure. A pressure-sensitive adhesive is used to re-adhere the marginal region to an underlying surface of the inner structure adjacent the opening through the laminate. The outer score line includes at least one tab positioned within a heat seal region of the laminate.

    Light guide plate and manufacturing method thereof, backlight module
    8.
    发明授权
    Light guide plate and manufacturing method thereof, backlight module 有权

    公开(公告)号：US09791615B2

    公开(公告)日：2017-10-17

    申请号：US14785601

    申请日：2015-05-07

    申请人： BOE Technology Group Co., Ltd. ,  Beijing Boe Optoelectronics Technology Co., Ltd.

    发明人： Rui Li ,  Hongjun Yu ,  Hong Zhu ,  Yong Song ,  Hongkun Zhang ,  Jun Long ,  Gang Yang

    IPC分类号： B29D11/00 ,  F21V8/00 ,  G02B6/00 ,  B29C35/08 ,  B29C59/16 ,  B29L11/00

    CPC分类号： G02B6/0061 ,  B29C35/0805 ,  B29C59/16 ,  B29C2791/009 ,  B29D11/00663 ,  B29L2011/0075 ,  G02B6/00 ,  G02B6/0021 ,  G02B6/0041 ,  G02B6/0055 ,  G02B6/0065

    摘要： The present invention relates to the field of display techniques, and discloses a light guide plate and a manufacturing method thereof, as well as a backlight module; the light guide plate comprises a light guide plate body and lattice points, wherein the light guide plate body is provided with a light output surface, and a receiving groove for receiving a light source is formed in a surface of the light guide plate body facing away from the light output surface thereof, and a side surface and a bottom surface of the receiving groove form a light input surface. The lattice points are distributed inside the light guide plate body along a plane parallel with the light output surface; the further the lattice points are distanced from the light input surface, the more densely they are distributed. When the above light guide plate is in use, the light source is situated in the receiving groove, and light emitted from the light source is directed into the light guide plate through the side surface and the bottom surface of the receiving groove. Besides, since the further the lattice points are distanced from the light input surface, the more densely they are distributed, the uniformity of light emitted from the light output surface of the light guide plate body can be ensured; in addition, since the lattice points are located inside the light guide plate body, friction is avoided between the lattice points of the light guide plate and the reflecting sheet of the backlight module, which prolongs the life time of the backlight module.