公开(公告)号：US20220352084A1

公开(公告)日：2022-11-03

申请号：US17748308

申请日：2022-05-19

申请人： MediaTek Inc.

发明人： Wen-Sung Hsu ,  Tao Cheng ,  Nan-Cheng Chen ,  Che-Ya Chou ,  Wen-Chou Wu ,  Yen-Ju Lu ,  Chih-Ming Hung ,  Wei-Hsiu Hsu

IPC分类号： H01L23/538 ,  H01L21/48 ,  H01L21/56 ,  H01L25/00 ,  H01L25/10 ,  H01L23/31 ,  H01L25/065 ,  H01L25/16 ,  H01L23/50 ,  H01L23/498 ,  H01L21/683 ,  H01Q9/04 ,  H01L23/66 ,  H01Q1/22

摘要： A semiconductor package includes a first substrate, a first layer structure, a second layer structure, a first antenna layer and an electronic component. The first antenna layer is formed on at least one of the first layer structure and the second layer structure, wherein the first antenna layer has an upper surface flush with a layer upper surface of the first layer structure or the second layer structure. The electronic component is disposed on a substrate lower surface of the first substrate and exposed from the first substrate. The first layer structure is formed between the first substrate and the second layer structure.

公开(公告)号：US20190129023A1

公开(公告)日：2019-05-02

申请号：US16143470

申请日：2018-09-27

申请人： MEDIATEK INC.

发明人： Yen-Ju Lu ,  Chih-Ming Hung ,  Wen-Chou Wu

IPC分类号： G01S13/02 ,  H01L23/12 ,  H01L23/28 ,  H05K1/02 ,  H01Q1/24

摘要： A radar module includes a printed circuit board (PCB) and a semiconductor package mounted on the PCB. The semiconductor package comprises an integrated circuit die and a substrate for electrically connecting the integrated circuit die to the PCB. The substrate comprises an antenna layer integrated into the semiconductor package and electrically connected to the integrated circuit die for at least one of transmitting and receiving radar signals. A discrete pattern-shaping device is mounted on the PCB and is configured to shape a radiation pattern of the radar signals.

公开(公告)号：US11837552B2

公开(公告)日：2023-12-05

申请号：US17748308

申请日：2022-05-19

申请人： MediaTek Inc.

发明人： Wen-Sung Hsu ,  Tao Cheng ,  Nan-Cheng Chen ,  Che-Ya Chou ,  Wen-Chou Wu ,  Yen-Ju Lu ,  Chih-Ming Hung ,  Wei-Hsiu Hsu

IPC分类号： H01L23/373 ,  H01L21/52 ,  H01L23/31 ,  H01L23/433 ,  H01L23/498 ,  H01L23/00 ,  H01L25/065 ,  H01L25/07 ,  H01L25/00 ,  H01L29/739 ,  H01L29/861 ,  H01L23/051 ,  H01L25/18 ,  H01L23/495 ,  H01L23/538 ,  H01L21/48 ,  H01L21/56 ,  H01L25/10 ,  H01L25/16 ,  H01L23/50 ,  H01L21/683 ,  H01Q9/04 ,  H01L23/66 ,  H01Q1/22 ,  H01L23/14 ,  H01Q21/06

CPC分类号： H01L23/5389 ,  H01L21/486 ,  H01L21/4846 ,  H01L21/4853 ,  H01L21/565 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/50 ,  H01L23/5383 ,  H01L23/66 ,  H01L25/0657 ,  H01L25/10 ,  H01L25/105 ,  H01L25/16 ,  H01L25/162 ,  H01L25/165 ,  H01L25/50 ,  H01Q1/2283 ,  H01Q9/0407 ,  H01Q9/0414 ,  H01L23/145 ,  H01L23/49816 ,  H01L24/13 ,  H01L24/16 ,  H01L24/48 ,  H01L24/81 ,  H01L2221/68345 ,  H01L2221/68359 ,  H01L2223/6677 ,  H01L2224/131 ,  H01L2224/13101 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2224/45099 ,  H01L2224/48227 ,  H01L2224/81005 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/1533 ,  H01L2924/1579 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19106 ,  H01Q21/065 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/13101 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2224/45099

摘要： A semiconductor package includes a first substrate, a first layer structure, a second layer structure, a first antenna layer and an electronic component. The first antenna layer is formed on at least one of the first layer structure and the second layer structure, wherein the first antenna layer has an upper surface flush with a layer upper surface of the first layer structure or the second layer structure. The electronic component is disposed on a substrate lower surface of the first substrate and exposed from the first substrate. The first layer structure is formed between the first substrate and the second layer structure.

公开(公告)号：US11821975B2

公开(公告)日：2023-11-21

申请号：US17495769

申请日：2021-10-06

申请人： MediaTek Inc.

发明人： Yen-Ju Lu ,  Chih-Ming Hung ,  Wen-Chou Wu

IPC分类号： G01S13/02 ,  H01Q15/14 ,  G01S7/03 ,  H01Q1/38 ,  H01Q1/32 ,  H01Q1/52 ,  G01S13/931 ,  H01Q1/22 ,  H01Q17/00 ,  H01L23/12 ,  H01L23/28 ,  H01Q1/24 ,  H05K1/02 ,  G01S7/02

CPC分类号： G01S13/02 ,  G01S7/03 ,  G01S13/931 ,  H01L23/12 ,  H01L23/28 ,  H01Q1/2283 ,  H01Q1/245 ,  H01Q1/3233 ,  H01Q1/38 ,  H01Q1/525 ,  H01Q15/14 ,  H01Q17/001 ,  H05K1/0213 ,  G01S7/027 ,  G01S7/028

摘要： A radar module includes a printed circuit board (PCB) and a semiconductor package mounted on the PCB. The semiconductor package comprises an integrated circuit die and a substrate for electrically connecting the integrated circuit die to the PCB. The substrate comprises an antenna layer integrated into the semiconductor package and electrically connected to the integrated circuit die for at least one of transmitting and receiving radar signals. A discrete pattern-shaping device is mounted on the PCB and is configured to shape a radiation pattern of the radar signals.

公开(公告)号：US11624758B2

公开(公告)日：2023-04-11

申请号：US17211738

申请日：2021-03-24

申请人： MEDIATEK INC.

发明人： Sheng-Wei Lei ,  Chang-Lin Wei ,  Ying-Chou Shih ,  Yeh-Chun Kao ,  Yen-Ju Lu ,  Po-Sen Tseng

IPC分类号： G01R1/04 ,  H04B17/29

摘要： A test kit for testing a device under test (DUT) includes a socket structure for containing the DUT. The DUT includes an antenna and radiates a RF signal. The test kit further includes a reflector having a lower surface. The RF signal emitted from the antenna of the DUT is reflected by the reflector and a reflected RF signal is received by the antenna of the DUT.

公开(公告)号：US11244913B2

公开(公告)日：2022-02-08

申请号：US16699851

申请日：2019-12-02

申请人： MEDIATEK Inc.

发明人： Ying-Chih Chen ,  Yen-Ju Lu ,  Che-Ya Chou ,  Hsing-Chih Liu

IPC分类号： H01L23/66 ,  H01L23/31 ,  H01L23/528 ,  H01L23/532 ,  H01Q1/22

摘要： A semiconductor package includes a substrate, an electronic component, a dielectric layer a transmitting antenna, a receiving antenna and a FSS (Frequency selective surface) antenna. The electronic component is disposed on and electrically connected with the substrate. The dielectric layer has a dielectric upper surface. The transmitting antenna and the receiving antenna are formed adjacent to the substrate. The FSS antenna is formed adjacent to the dielectric upper surface of the dielectric layer. The FSS antenna is separated from the substrate by the dielectric layer in a wireless signal emitting direction.

公开(公告)号：US10910706B2

公开(公告)日：2021-02-02

申请号：US16248821

申请日：2019-01-16

申请人： MediaTek Inc.

发明人： Chih-Ming Hung ,  Yu Chun Lu ,  Yen-Ju Lu ,  ChiaYu Lin

IPC分类号： H01Q1/42 ,  H05K1/02 ,  G01S13/93 ,  G01S7/02 ,  G01S13/931 ,  H01Q1/32

摘要： Various examples pertaining to a sensor housing design for millimeter wave (mmWave) sensors are described. A sensor housing may include a radar sensor, a printed circuit board (PCB), a radome and a PCB holder. The radar sensor may be capable of emitting a radio wave. The PCB may have a first side and a second side opposite the first side with the radar sensor mounted on the first side thereof to form a PCB assembly (PCBA). The radome may include a cavity in which the PCBA is disposed. The PCB holder may be disposed along a circumference of an inner wall of the radome, and the PCB holder may be configured to hold the PCBA such that a distance between an inner surface of the radome and a side of the radar sensor facing the inner surface of the radome is proportional to half wavelength of the radio wave.

公开(公告)号：US10852349B2

公开(公告)日：2020-12-01

申请号：US16359954

申请日：2019-03-20

申请人： MEDIATEK INC.

发明人： Chih-Yang Liu ,  Ying-Chou Shih ,  Yen-Ju Lu ,  Chih-Ming Hung ,  Jui-Lin Hsu

IPC分类号： G01R31/30 ,  G01R31/302 ,  G01R31/28 ,  G01R31/303 ,  H01Q1/22 ,  G01R1/04

摘要： A wireless test system includes a load board having an upper surface and a lower surface. The load board has a testing antenna disposed on the load board. A socket for receiving a device under test (DUT) having an antenna structure therein is disposed on the upper surface of the load board. The antenna structure is aligned with the testing antenna. The wireless test system further includes a handler for picking up and delivering the DUT to the socket. The handler has a clamp for holding and pressing the DUT. The clamp is grounded during testing and functions as a ground reflector that reflects and reverses radiation pattern of the DUT from an upward direction to a downward direction toward the testing antenna.

公开(公告)号：US20190229410A1

公开(公告)日：2019-07-25

申请号：US16248821

申请日：2019-01-16

申请人： MediaTek Inc.

发明人： Chih-Ming Hung ,  Yu Chun Lu ,  Yen-Ju Lu ,  ChiaYu Lin

IPC分类号： H01Q1/42 ,  H05K1/02 ,  G01S13/93 ,  G01S7/02

摘要： Various examples pertaining to a sensor housing design for millimeter wave (mmWave) sensors are described. A sensor housing may include a radar sensor, a printed circuit board (PCB), a radome and a PCB holder. The radar sensor may be capable of emitting a radio wave. The PCB may have a first side and a second side opposite the first side with the radar sensor mounted on the first side thereof to form a PCB assembly (PCBA). The radome may include a cavity in which the PCBA is disposed. The PCB holder may be disposed along a circumference of an inner wall of the radome, and the PCB holder may be configured to hold the PCBA such that a distance between an inner surface of the radome and a side of the radar sensor facing the inner surface of the radome is proportional to half wavelength of the radio wave.

公开(公告)号：US12062864B2

公开(公告)日：2024-08-13

申请号：US18233335

申请日：2023-08-14

申请人： MEDIATEK INC.

发明人： Debapratim Dhara ,  Shih-Chia Chiu ,  Yen-Ju Lu ,  Sheng-Mou Lin

IPC分类号： H01Q9/04 ,  H01Q1/48

CPC分类号： H01Q9/045 ,  H01Q1/48

摘要： An antenna structure includes a radiative antenna element disposed in a first conductive layer and a reference ground plane, disposed in a second conductive layer under the first conductive layer. The radiative antenna element is loaded with a plurality of slots and is electrically connected to the reference ground plane through a plurality of vias, and the vias are placed along a first line of the radiative antenna element and the slots are placed along a second line perpendicular to the first line.