公开(公告)号：US11624758B2

公开(公告)日：2023-04-11

申请号：US17211738

申请日：2021-03-24

Applicant: MEDIATEK INC.

Inventor： Sheng-Wei Lei ,  Chang-Lin Wei ,  Ying-Chou Shih ,  Yeh-Chun Kao ,  Yen-Ju Lu ,  Po-Sen Tseng

IPC: G01R1/04 ,  H04B17/29

Abstract: A test kit for testing a device under test (DUT) includes a socket structure for containing the DUT. The DUT includes an antenna and radiates a RF signal. The test kit further includes a reflector having a lower surface. The RF signal emitted from the antenna of the DUT is reflected by the reflector and a reflected RF signal is received by the antenna of the DUT.

公开(公告)号：US20230236222A1

公开(公告)日：2023-07-27

申请号：US18129040

申请日：2023-03-30

Applicant: MEDIATEK INC.

Inventor： Jing-Hui Zhuang ,  Ying-Chou Shih ,  Sheng-Wei Lei ,  Chang-Lin Wei ,  Che-Hsien Huang ,  Shih-Chia Chiu ,  Yi-Chieh Lin ,  Wun-Jian Lin

IPC: G01R1/04

CPC classification number: G01R1/0466

Abstract: This disclosure provides a test kit for testing a device under test (DUT) including a socket structure for containing the DUT, and a plunger assembly detachably coupled with the socket structure. The plunger assembly includes a multi-layered structure having a nest and an interposer substrate installed under the nest.

公开(公告)号：US20210302467A1

公开(公告)日：2021-09-30

申请号：US17211738

申请日：2021-03-24

Applicant: MEDIATEK INC.

Inventor： Sheng-Wei Lei ,  Chang-Lin Wei ,  Ying-Chou Shih ,  Yeh-Chun Kao ,  Yen-Ju Lu ,  Po-Sen Tseng

IPC: G01R1/04 ,  H04B17/29

Abstract: A test kit for testing a device under test (DUT) includes a socket structure for containing the DUT. The DUT includes an antenna and radiates a RF signal. The test kit further includes a reflector having a lower surface. The RF signal emitted from the antenna of the DUT is reflected by the reflector and a reflected RF signal is received by the antenna of the DUT.

公开(公告)号：US20220397600A1

公开(公告)日：2022-12-15

申请号：US17735130

申请日：2022-05-03

Applicant: MEDIATEK INC.

Inventor： Jing-Hui Zhuang ,  Ying-Chou Shih ,  Sheng-Wei Lei ,  Chang-Lin Wei ,  Chih-Yang Liu ,  Che-Hsien Huang ,  Yi-Chieh Lin

IPC: G01R31/28 ,  G01R31/66 ,  G01R31/26

Abstract: A test kit for testing a device under test (DUT) includes a socket structure for containing the DUT, and a plunger assembly detachably coupled with the socket structure. The plunger assembly includes a multi-layered structure having at least an interposer substrate sandwiched by a top socket and a nest.

公开(公告)号：US11879934B2

公开(公告)日：2024-01-23

申请号：US17735130

申请日：2022-05-03

Applicant: MEDIATEK INC.

Inventor： Jing-Hui Zhuang ,  Ying-Chou Shih ,  Sheng-Wei Lei ,  Chang-Lin Wei ,  Chih-Yang Liu ,  Che-Hsien Huang ,  Yi-Chieh Lin

IPC: G01R31/28 ,  G01R31/66 ,  G01R31/26

CPC classification number: G01R31/2886 ,  G01R31/26 ,  G01R31/66 ,  G01R31/2893

Abstract: A test kit for testing a device under test (DUT) includes a socket structure for containing the DUT, and a plunger assembly detachably coupled with the socket structure. The plunger assembly includes a multi-layered structure having at least an interposer substrate sandwiched by a top socket and a nest.