Invention Grant
- Patent Title: Test kit for testing a device under test
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Application No.: US17211738Application Date: 2021-03-24
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Publication No.: US11624758B2Publication Date: 2023-04-11
- Inventor: Sheng-Wei Lei , Chang-Lin Wei , Ying-Chou Shih , Yeh-Chun Kao , Yen-Ju Lu , Po-Sen Tseng
- Applicant: MEDIATEK INC.
- Applicant Address: TW Hsin-Chu
- Assignee: MEDIATEK INC.
- Current Assignee: MEDIATEK INC.
- Current Assignee Address: TW Hsin-Chu
- Agent Winston Hsu
- Main IPC: G01R1/04
- IPC: G01R1/04 ; H04B17/29

Abstract:
A test kit for testing a device under test (DUT) includes a socket structure for containing the DUT. The DUT includes an antenna and radiates a RF signal. The test kit further includes a reflector having a lower surface. The RF signal emitted from the antenna of the DUT is reflected by the reflector and a reflected RF signal is received by the antenna of the DUT.
Public/Granted literature
- US20210302467A1 TEST KIT FOR TESTING A DEVICE UNDER TEST Public/Granted day:2021-09-30
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