公开(公告)号：US20210302467A1

公开(公告)日：2021-09-30

申请号：US17211738

申请日：2021-03-24

Applicant: MEDIATEK INC.

Inventor： Sheng-Wei Lei ,  Chang-Lin Wei ,  Ying-Chou Shih ,  Yeh-Chun Kao ,  Yen-Ju Lu ,  Po-Sen Tseng

IPC: G01R1/04 ,  H04B17/29

Abstract: A test kit for testing a device under test (DUT) includes a socket structure for containing the DUT. The DUT includes an antenna and radiates a RF signal. The test kit further includes a reflector having a lower surface. The RF signal emitted from the antenna of the DUT is reflected by the reflector and a reflected RF signal is received by the antenna of the DUT.

公开(公告)号：US20220397600A1

公开(公告)日：2022-12-15

申请号：US17735130

申请日：2022-05-03

Applicant: MEDIATEK INC.

Inventor： Jing-Hui Zhuang ,  Ying-Chou Shih ,  Sheng-Wei Lei ,  Chang-Lin Wei ,  Chih-Yang Liu ,  Che-Hsien Huang ,  Yi-Chieh Lin

IPC: G01R31/28 ,  G01R31/66 ,  G01R31/26

Abstract: A test kit for testing a device under test (DUT) includes a socket structure for containing the DUT, and a plunger assembly detachably coupled with the socket structure. The plunger assembly includes a multi-layered structure having at least an interposer substrate sandwiched by a top socket and a nest.

公开(公告)号：US11879934B2

公开(公告)日：2024-01-23

申请号：US17735130

申请日：2022-05-03

Applicant: MEDIATEK INC.

Inventor： Jing-Hui Zhuang ,  Ying-Chou Shih ,  Sheng-Wei Lei ,  Chang-Lin Wei ,  Chih-Yang Liu ,  Che-Hsien Huang ,  Yi-Chieh Lin

IPC: G01R31/28 ,  G01R31/66 ,  G01R31/26

CPC classification number: G01R31/2886 ,  G01R31/26 ,  G01R31/66 ,  G01R31/2893

Abstract: A test kit for testing a device under test (DUT) includes a socket structure for containing the DUT, and a plunger assembly detachably coupled with the socket structure. The plunger assembly includes a multi-layered structure having at least an interposer substrate sandwiched by a top socket and a nest.

公开(公告)号：US11624758B2

公开(公告)日：2023-04-11

申请号：US17211738

申请日：2021-03-24

Applicant: MEDIATEK INC.

Inventor： Sheng-Wei Lei ,  Chang-Lin Wei ,  Ying-Chou Shih ,  Yeh-Chun Kao ,  Yen-Ju Lu ,  Po-Sen Tseng

IPC: G01R1/04 ,  H04B17/29

Abstract: A test kit for testing a device under test (DUT) includes a socket structure for containing the DUT. The DUT includes an antenna and radiates a RF signal. The test kit further includes a reflector having a lower surface. The RF signal emitted from the antenna of the DUT is reflected by the reflector and a reflected RF signal is received by the antenna of the DUT.

公开(公告)号：US10852349B2

公开(公告)日：2020-12-01

申请号：US16359954

申请日：2019-03-20

Applicant: MEDIATEK INC.

Inventor： Chih-Yang Liu ,  Ying-Chou Shih ,  Yen-Ju Lu ,  Chih-Ming Hung ,  Jui-Lin Hsu

IPC: G01R31/30 ,  G01R31/302 ,  G01R31/28 ,  G01R31/303 ,  H01Q1/22 ,  G01R1/04

Abstract: A wireless test system includes a load board having an upper surface and a lower surface. The load board has a testing antenna disposed on the load board. A socket for receiving a device under test (DUT) having an antenna structure therein is disposed on the upper surface of the load board. The antenna structure is aligned with the testing antenna. The wireless test system further includes a handler for picking up and delivering the DUT to the socket. The handler has a clamp for holding and pressing the DUT. The clamp is grounded during testing and functions as a ground reflector that reflects and reverses radiation pattern of the DUT from an upward direction to a downward direction toward the testing antenna.

公开(公告)号：US20230236222A1

公开(公告)日：2023-07-27

申请号：US18129040

申请日：2023-03-30

Applicant: MEDIATEK INC.

Inventor： Jing-Hui Zhuang ,  Ying-Chou Shih ,  Sheng-Wei Lei ,  Chang-Lin Wei ,  Che-Hsien Huang ,  Shih-Chia Chiu ,  Yi-Chieh Lin ,  Wun-Jian Lin

IPC: G01R1/04

CPC classification number: G01R1/0466

Abstract: This disclosure provides a test kit for testing a device under test (DUT) including a socket structure for containing the DUT, and a plunger assembly detachably coupled with the socket structure. The plunger assembly includes a multi-layered structure having a nest and an interposer substrate installed under the nest.

公开(公告)号：US20190310314A1

公开(公告)日：2019-10-10

申请号：US16359954

申请日：2019-03-20

Applicant: MEDIATEK INC.

Inventor： Chih-Yang Liu ,  Ying-Chou Shih ,  Yen-Ju Lu ,  Chih-Ming Hung ,  Jui-Lin Hsu

IPC: G01R31/302 ,  H01Q1/22 ,  G01R31/303 ,  G01R31/28

Abstract: A wireless test system includes a load board having an upper surface and a lower surface. The load board has a testing antenna disposed on the load board. A socket for receiving a device under test (DUT) having an antenna structure therein is disposed on the upper surface of the load board. The antenna structure is aligned with the testing antenna. The wireless test system further includes a handler for picking up and delivering the DUT to the socket. The handler has a clamp for holding and pressing the DUT. The clamp is grounded during testing and functions as a ground reflector that reflects and reverses radiation pattern of the DUT from an upward direction to a downward direction toward the testing antenna.

公开(公告)号：US10110325B2

公开(公告)日：2018-10-23

申请号：US14696807

申请日：2015-04-27

Applicant: MediaTek Inc.

Inventor： Yen-Liang Chen ,  Chun-Hsien Peng ,  Ying-Chou Shih ,  Yu-An Chen ,  Chun-Wei Yang

IPC: H04B17/00 ,  H04B3/46 ,  H04B17/29

Abstract: An integrated circuit (IC) is provided. The IC includes an RF transmitter configured to generate an RF signal in response to a command signal from test equipment; an RF receiver configured to generate an evaluation signal according to the RF signal, and report the evaluation signal to the test equipment, so that the test equipment performs a test analysis on the evaluation signal to determine a test result, wherein the test equipment is external to the IC.