公开(公告)号：US20240255561A1

公开(公告)日：2024-08-01

申请号：US18560530

申请日：2022-05-19

申请人： Tokyo Electron Limited

发明人： Miyoko KURODA

IPC分类号： G01R31/26

CPC分类号： G01R31/26

摘要： The processing system includes multiple testers configured to test a semiconductor device, and a management device connected to be capable of performing information communication with the multiple testers. The multiple testers are arranged in a height direction in two or more levels and each of the multiple testers includes a tester-side storage unit configured to store log information related to a state of the tester. The management device collectively outputs a request command for requesting log information to one or more selected testers determined by selecting all the multiple testers or some of the multiple testers, and acquires the log information from the selected tester that has received the request command. The management device acquires the log information when an authenticating unit determines that tester-side identification information matches management identification information, and disables acquisition of the log information to the management device when the authenticating unit determines that the tester-side identification information does not match the management identification information.

公开(公告)号：US11879934B2

公开(公告)日：2024-01-23

申请号：US17735130

申请日：2022-05-03

申请人： MEDIATEK INC.

发明人： Jing-Hui Zhuang ,  Ying-Chou Shih ,  Sheng-Wei Lei ,  Chang-Lin Wei ,  Chih-Yang Liu ,  Che-Hsien Huang ,  Yi-Chieh Lin

IPC分类号： G01R31/28 ,  G01R31/66 ,  G01R31/26

CPC分类号： G01R31/2886 ,  G01R31/26 ,  G01R31/66 ,  G01R31/2893

摘要： A test kit for testing a device under test (DUT) includes a socket structure for containing the DUT, and a plunger assembly detachably coupled with the socket structure. The plunger assembly includes a multi-layered structure having at least an interposer substrate sandwiched by a top socket and a nest.

公开(公告)号：US11808801B2

公开(公告)日：2023-11-07

申请号：US17047393

申请日：2019-04-19

申请人： Mitsubishi Electric Corporation

发明人： Chihiro Kawahara ,  Yukihiko Wada

IPC分类号： G01R31/26 ,  G01N17/00 ,  G01R31/30 ,  G01R31/317

CPC分类号： G01R31/26 ,  G01N17/00 ,  G01R31/3008 ,  G01R31/317

摘要： A direct-current power supply applies a DC voltage to test semiconductor devices. A current detection unit detects a leakage current of a test circuit in which test semiconductor devices are included. A measuring instrument records a pulse waveform of the leakage current. An analyzer analyzes reliability of test semiconductor devices included in the test circuit based on the recorded pulse waveform.

公开(公告)号：US11726126B2

公开(公告)日：2023-08-15

申请号：US17548255

申请日：2021-12-10

申请人： KLA Corporation

发明人： Tom Marivoet ,  Carl Truyens ,  Christophe Wouters

IPC分类号： G01N21/95 ,  G01R31/01 ,  G01N21/88 ,  G01N21/956 ,  G01R31/26 ,  G01R31/28

CPC分类号： G01R31/01 ,  G01N21/8806 ,  G01N21/95 ,  G01N21/9501 ,  G01N21/9505 ,  G01N21/95684 ,  G01R31/26 ,  G01R31/28

摘要： An apparatus, a method and a computer program product for defect detection in work pieces is disclosed. At least one light source is provided and the light source generates an illumination light of a wavelength range at which the work piece is transparent. A camera images the light from at least one face of the work piece on a detector of the camera by means of a lens. A stage is used for moving the work piece and for imaging the at least one face of the semiconductor device completely with the camera. The computer program product is disposed on a non-transitory, computer readable medium for defect detection in work pieces. A computer is used to execute the various process steps and to control the various means of the apparatus.

公开(公告)号：US20190252595A1

公开(公告)日：2019-08-15

申请号：US16336909

申请日：2017-09-28

申请人： Tzila IMRY ,  YEDA RESEARCH AND DEVELOPMENT CO.LTD

发明人： Yoseph IMRY ,  Dan SHAHAR

IPC分类号： H01L35/34 ,  G01R31/26

CPC分类号： H01L35/34 ,  G01R31/26 ,  G01R31/2632

摘要： Thermoelectric devices based on diodes. Devices and systems can be used as cooling devices or cooling systems or as energy harvesting devices or energy harvesting systems. System comprising: a diode (3.1) comprising a first end and a second end; at least one thermometer (3.2) attached to said first end of said diode; and a power supply/current generator (3.6). Method of changing the temperature of an element, said method comprising: providing a system comprising: a diode comprising a first end and a second end; a thermometer attached to at least said first end or said second end of said diode; and a power supply/current generator; contacting said first end or said second end of said diode to said element; driving current through or applying voltage to said diode, thereby cooling the first end of said diode and heating the second end of said diode, thereby transferring heat between said diode and said element, thus changing the temperature of said element.

公开(公告)号：US20190234798A1

公开(公告)日：2019-08-01

申请号：US16378935

申请日：2019-04-09

申请人： Nikkiso Co., Ltd.

发明人： Shoichi NIIZEKI ,  Hiroyasu ICHINOKURA

IPC分类号： G01J3/02 ,  G01R31/26 ,  H01L33/00

CPC分类号： G01J3/0286 ,  G01J3/0218 ,  G01R31/26 ,  G01R31/2635 ,  G01R31/2642 ,  H01L33/0095

摘要： A test device includes: a support that supports a light emitting device subject to a test; a light waveguide that guides light output from the light emitting device supported by the support; a light diffuser plate that diffuses light output from the light waveguide; and a light receiving device that receives light diffused by the light diffuser plate. The test device may further include a constant-temperature device that houses the support and the light emitting device supported by the support and control a temperature of the light emitting device. The light receiving device may be provided outside the constant-temperature device, and the light waveguide may guide light from inside the constant-temperature device to a space outside the constant-temperature device.

公开(公告)号：US20180329313A1

公开(公告)日：2018-11-15

申请号：US16042063

申请日：2018-07-23

申请人： Taiwan Semiconductor Manufacturing Company, Ltd.

发明人： Yang-Hung Chang ,  Chih-Ming Ke ,  Kai-Hsiung Chen

IPC分类号： G03F7/20 ,  G06F17/50

CPC分类号： G03F7/70633 ,  G01N37/00 ,  G01P21/00 ,  G01R31/26 ,  G03F1/00 ,  G03F9/00 ,  G06F17/5081 ,  G06F19/00 ,  G06F2217/02 ,  G06F2217/06 ,  G06F2217/12 ,  G06F2217/16 ,  G21K5/00 ,  H01L21/00

摘要： A method for overlay monitoring and control is introduced in the present disclosure. The method includes selecting a group of patterned wafers from a lot using a wafer selection model; selecting a group of fields for each of the selected group of patterned wafers using a field selection model; selecting at least one point in each of the selected group of fields using a point selection model; measuring overlay errors of the selected at least one point on a selected wafer; forming an overlay correction map using the measured overlay errors on the selected wafer; and generating a combined overlay correction map using the overlay correction map of each selected wafer in the lot.

公开(公告)号：US20180259568A1

公开(公告)日：2018-09-13

申请号：US15455810

申请日：2017-03-10

申请人： Integrated Technology Corporation

发明人： Steven T. Clauter ,  Gary B. Rogers ,  Norvell Eric Austin ,  Bradley T. Wolford

IPC分类号： G01R31/26 ,  H02J50/10 ,  H02J7/02

CPC分类号： G01R31/26 ,  G01R1/36

摘要： An energy supply for a test device includes an energy source configured to provide energy via an inductive element for use by test circuitry; and an energy recovery circuit electrically couplable to the energy source and configured to direct unused energy from the inductive element to the energy source.

公开(公告)号：US10061679B2

公开(公告)日：2018-08-28

申请号：US14846879

申请日：2015-09-07

申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION

发明人： Dean G. Bair ,  Rebecca M. Gott ,  Edward J. Kaminski, Jr. ,  William J. Lewis

IPC分类号： G06F17/50 ,  G06F11/34 ,  G01R31/26 ,  G06F13/00

CPC分类号： G06F11/3409 ,  G01R31/26 ,  G06F13/00 ,  G06F17/50 ,  G06F17/5022

摘要： Pre-silicon fairness evaluation to detect fairness issues pre-silicon. Drivers drive a plurality of commands on one or more interfaces of a device under test to test the device under test. State associated with the device under test is checked. Based on the state, a determination is made as to whether the drivers are to continue driving commands against the device under test. Based on determining that the drivers are to continue driving the commands, a further determination is made as to whether a predefined limit has been reached. Based on determining the predefined limit has been reached, ending the test of the device under test in which the test fails.

公开(公告)号：US10061673B2

公开(公告)日：2018-08-28

申请号：US15292586

申请日：2016-10-13

申请人： Primax Electronics Ltd.

发明人： Pei-Ming Chang ,  Shih-Chieh Hsu ,  Shi-Jie Zhang ,  Wei-Lung Huang

IPC分类号： G06F11/263 ,  G01R31/319 ,  G01R31/26 ,  G06F11/273 ,  G01R31/28 ,  G06F9/4401 ,  G06F13/362

CPC分类号： G06F11/263 ,  G01R31/26 ,  G01R31/28 ,  G01R31/2806 ,  G01R31/2851 ,  G01R31/319 ,  G01R31/31903 ,  G06F9/4408 ,  G06F11/273 ,  G06F11/2733 ,  G06F13/362 ,  Y02P90/30

摘要： A testing system uses different operating systems to test electronic products. The testing system includes a master computer, a slave computer and a relay. A first operating system is installed in the master computer. A second operating system is installed in the slave computer. The master computer and the slave computer are connected with each other through RS-232 ports. The relay is connected with the master computer, the slave computer and an under-test product. By changing the voltage level state of specified pins of the RS-232 ports, the master computer notifies the slave computer to test the under-test product. Moreover, by controlling the relay, the connection between the master computer and the under-test product is switched to the connection between the slave computer and the under-test product. Consequently, the under-test product is tested by the slave computer.