LOOP-BACK PROBE TEST AND VERIFICATION METHOD
    1.
    发明申请
    LOOP-BACK PROBE TEST AND VERIFICATION METHOD 审中-公开
    环回测试和验证方法

    公开(公告)号:US20160377657A1

    公开(公告)日:2016-12-29

    申请号:US15188024

    申请日:2016-06-21

    IPC分类号: G01R1/073 G01R31/28

    摘要: A method is provided for using a loop-back test device to verify continuity between loop-back probes electrically connected to each other on a probe card, the loop-back test device including a first conductive region electrically connected to a substrate, a second conductive region electrically isolated from the substrate, the second conductive region spaced apart from the first conductive region such that when a first loop-back probe contacts the first conductive region a second loop-back probe contacts the second conductive region, The method includes placing the first loop-back probe in electrical contact with the first conductive region, and placing the second loop-back probe in electrical contact with the second conductive region. Continuity between the substrate and the second conductive region is then measured.

    摘要翻译: 提供了一种使用回环测试装置来验证在探针卡上彼此电连接的环回探针之间的连续性的方法,所述环回测试装置包括电连接到衬底的第一导电区域,第二导电 所述第二导电区域与所述第一导电区域间隔开,使得当第一环回探针接触所述第一导电区域时,第二环回探针接触所述第二导电区域。所述方法包括将所述第一环回探针 环回探针与第一导电区域电接触,并且将第二环回探针与第二导电区域电接触。 然后测量衬底和第二导电区域之间的连续性。

    Loop-back probe test and verification method

    公开(公告)号:US10768206B2

    公开(公告)日:2020-09-08

    申请号:US15188024

    申请日:2016-06-21

    IPC分类号: G01R1/067 G01R31/28

    摘要: A method is provided for using a loop-back test device to verify continuity between loop-back probes electrically connected to each other on a probe card, the loop-back test device including a first conductive region electrically connected to a substrate, a second conductive region electrically isolated from the substrate, the second conductive region spaced apart from the first conductive region such that when a first loop-back probe contacts the first conductive region a second loop-back probe contacts the second conductive region, The method includes placing the first loop-back probe in electrical contact with the first conductive region, and placing the second loop-back probe in electrical contact with the second conductive region. Continuity between the substrate and the second conductive region is then measured.

    High current Kelvin connection and verification method
    6.
    发明授权
    High current Kelvin connection and verification method 有权
    高电流开尔文连接和验证方法

    公开(公告)号:US09304147B2

    公开(公告)日:2016-04-05

    申请号:US14317499

    申请日:2014-06-27

    IPC分类号: G01R31/20 G01R1/067 G01R27/20

    CPC分类号: G01R1/06794 G01R27/205

    摘要: A method and circuit for implementing high current capability Kelvin connections and measuring the resistance of the contacts and connections to verify that the conducting path is capable of carrying the high current without damage or degraded performance. Included as well is the means and circuit for efficiently dividing a high current test stimulus current into 2 paths with low losses and voltage drops.

    摘要翻译: 一种用于实现高电流能力开尔文连接并测量触点和连接的电阻的方法和电路,以验证导电路径能够承载高电流而不损坏或降低性能。 还包括用于将高电流测试激励电流有效地分成具有低损耗和电压降的2个路径的装置和电路。

    HIGH CURRENT KELVIN CONNECTION AND VERIFICATION METHOD
    7.
    发明申请
    HIGH CURRENT KELVIN CONNECTION AND VERIFICATION METHOD 有权
    高电流KELVIN连接和验证方法

    公开(公告)号:US20140354319A1

    公开(公告)日:2014-12-04

    申请号:US14317499

    申请日:2014-06-27

    IPC分类号: G01R31/26 G01R27/08 G01R31/28

    CPC分类号: G01R1/06794 G01R27/205

    摘要: A method and circuit for implementing high current capability Kelvin connections and measuring the resistance of the contacts and connections to verify that the conducting path is capable of carrying the high current without damage or degraded performance. Included as well is the means and circuit for efficiently dividing a high current test stimulus current into 2 paths with low losses and voltage drops.

    摘要翻译: 一种用于实现高电流能力开尔文连接并测量触点和连接的电阻的方法和电路,以验证导电路径能够承受高电流而不损坏或降低性能。 还包括用于将高电流测试激励电流有效地分成具有低损耗和电压降的2个路径的装置和电路。