发明授权
- 专利标题： High current Kelvin connection and verification method
- 专利标题（中）： 高电流开尔文连接和验证方法
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申请号： US14317499申请日： 2014-06-27
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公开(公告)号： US09304147B2公开(公告)日： 2016-04-05
- 发明人: Rodney Schwartz , Gary Rogers , Steven Clauter
- 申请人： Integrated Technology Corporation
- 申请人地址： US AZ Tempe
- 专利权人： Integrated Technology Corporation
- 当前专利权人： Integrated Technology Corporation
- 当前专利权人地址： US AZ Tempe
- 代理机构： Renner, Otto, Boisselle & Sklar, LLP
- 主分类号： G01R31/20
- IPC分类号： G01R31/20 ; G01R1/067 ; G01R27/20
摘要：
A method and circuit for implementing high current capability Kelvin connections and measuring the resistance of the contacts and connections to verify that the conducting path is capable of carrying the high current without damage or degraded performance. Included as well is the means and circuit for efficiently dividing a high current test stimulus current into 2 paths with low losses and voltage drops.
公开/授权文献
- US20140354319A1 HIGH CURRENT KELVIN CONNECTION AND VERIFICATION METHOD 公开/授权日：2014-12-04
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