Printing solder point quality identification and maintenance suggestion system and method thereof

    公开(公告)号:US12100129B2

    公开(公告)日:2024-09-24

    申请号:US17357396

    申请日:2021-06-24

    发明人: Meng Sun

    IPC分类号: G06T7/00 B23K31/12 G01N21/956

    摘要: A printing solder point quality identification and maintenance suggestion system and a method thereof are disclosed. In the system, when solder paste inspection data, component inspection data or circuit inspection data indicates presence of defect, an analysis and calculation device intercepts the operating data, the equipment data, the raw material data, the process data and the environment data from a time data stream, to generate a data feature portrait. The analysis and calculation device then sets a reliability value based on location association between the solder paste inspection data, the component inspection data, the circuit inspection data and the maintenance data in the location data stream, and performs similarity calculation on the data feature portrait and the comparison data feature portrait to calculate a similarity value, and then calculates a relative reliability value, and compares the relative reliability value with a reliability threshold value to generate maintenance suggestion information.

    Inspection system for inspecting a lighting device during an assembly process of the lighting device and a method thereof

    公开(公告)号:US12072301B2

    公开(公告)日:2024-08-27

    申请号:US17800325

    申请日:2021-02-15

    IPC分类号: G01N21/956

    CPC分类号: G01N21/956

    摘要: An inspection system (100) for inspecting a lighting device (150) during an assembly process of the lighting device; wherein the lighting device comprises a base plate (153) and a plurality of components (155) mounted on the base plate; wherein the inspection system comprises: a light source (120) arranged for illuminating the lighting device according to a first light output spectrum for providing a luminance contrast between the base plate and the plurality of components; an imaging unit/camera (130) arranged for capturing a first image of the illuminated lighting device; a controller (110) comprising a processing unit for determining a luminance contrast measure of the captured first image; wherein the processing unit is further arranged for, when the luminance contrast measure of the captured first image exceeds a threshold value, adapting the first light output spectrum, and wherein the imaging unit is further arranged for capturing a second image of the lighting device illuminated according to the adapted first light output spectrum; and wherein the controller further comprises: a comparing unit arranged for comparing the second image with a reference image; a determination unit arranged for determining a defect in the base plate and/or in the plurality of components based on the comparison.

    Inspection system
    5.
    发明授权

    公开(公告)号:US12066388B2

    公开(公告)日:2024-08-20

    申请号:US17282877

    申请日:2020-10-21

    申请人: WIT CO., LTD.

    IPC分类号: G01N21/88 G01N21/956

    摘要: In order to reduce inspection tact time in centralized management of a plurality of inspection lines, the system includes: a plurality of inspection lines 4 each having a visual appearance inspection device 3; a first database 5A for storing a captured image captured by each of the visual appearance inspection device 3; and a centralized control device 6 connected to each of the visual appearance inspection devices 3 and the first database 5A, having a display unit 32 that displays an inspection image of an inspection object 7, and enabling visual inspection of the inspection object 7 conveyed on each of the inspection lines 4 in a centralized manner; wherein, while one of the inspection lines 4 is inspected by using the centralized control device 6, the visual appearance inspection devices 3 of the other inspection lines 4 pre-captures the inspection object 7 conveyed on the inspection line 4 under predetermined capturing conditions and stores the pre-captured image in the first database 5A, and wherein the pre-captured image read from the first database 5A is displayed on the display unit 32 in the visual inspection.

    MEASURING DEVICE AND MEASURING METHOD
    6.
    发明公开

    公开(公告)号:US20240231244A1

    公开(公告)日:2024-07-11

    申请号:US18405339

    申请日:2024-01-05

    IPC分类号: G03F7/00 G01N21/95 G01N21/956

    摘要: A measuring device includes a light source that irradiates a measurement spot on a wafer formed with memory holes and slits with a multi-wavelength light, a first imaging unit that acquires a first pupil plane intensity distribution image of reflected light from the measurement spot, a second imaging unit that acquires a second pupil plane intensity distribution image of the reflected light, and a detection unit that analyzes the second pupil plane intensity distribution image to measure overlay. The measuring device includes an overlay analysis unit that acquires the first and second pupil plane intensity distribution images while moving a position of the measurement spot and selects a measurement spot not including the slit based on the first pupil plane intensity distribution image, and uses the overlay obtained by analyzing the second pupil plane intensity distribution image of the selected measurement spot as the overlay of the memory hole and a slit.

    Methods And Systems For Scatterometry Based Metrology Of Structures Fabricated On Transparent Substrates

    公开(公告)号:US20240201073A1

    公开(公告)日:2024-06-20

    申请号:US18231688

    申请日:2023-08-08

    申请人: KLA Corporation

    摘要: Methods and systems for performing spectroscopic ellipsometry (SE) measurements of surface structures of optical elements fabricated on transparent substrates are presented herein. The SE measurement system is configured to detect light from the measured structures without contamination from light reflected from the backside surface of the transparent substrate. Surface structures of optical elements include film structures and grating structures fabricated on thin transparent substrates. The SE based measurement system is configured with a relatively large illumination Numerical Aperture (NA) and relatively high demagnification from the illumination source to the measurement spot on the optically transparent substrate. This configuration results in a relatively small measurement spot size and small depth of focus that minimizes the amount of light reflected from the backside of the optically transparent substrate. In addition, a relatively small collection aperture size further minimizes backside reflected light from reaching the detector.