Invention Publication
- Patent Title: TEST KIT FOR TESTING A DEVICE UNDER TEST
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Application No.: US18129040Application Date: 2023-03-30
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Publication No.: US20230236222A1Publication Date: 2023-07-27
- Inventor: Jing-Hui Zhuang , Ying-Chou Shih , Sheng-Wei Lei , Chang-Lin Wei , Che-Hsien Huang , Shih-Chia Chiu , Yi-Chieh Lin , Wun-Jian Lin
- Applicant: MEDIATEK INC.
- Applicant Address: TW Hsin-Chu
- Assignee: MEDIATEK INC.
- Current Assignee: MEDIATEK INC.
- Current Assignee Address: TW Hsin-Chu
- Main IPC: G01R1/04
- IPC: G01R1/04

Abstract:
This disclosure provides a test kit for testing a device under test (DUT) including a socket structure for containing the DUT, and a plunger assembly detachably coupled with the socket structure. The plunger assembly includes a multi-layered structure having a nest and an interposer substrate installed under the nest.
Information query