公开(公告)号：US12230622B2

公开(公告)日：2025-02-18

申请号：US17938965

申请日：2022-09-07

Applicant: MEDIATEK INC.

Inventor： Ya-Lun Yang ,  Wen-Chou Wu ,  Che-Hung Kuo

IPC: H05K1/14 ,  H01L23/31 ,  H01L23/367 ,  H01L23/498 ,  H01L23/538 ,  H01L25/18 ,  H05K1/18 ,  H01L23/00

Abstract: An electronic device includes a main printed circuit board (PCB) assembly comprising a bottom PCB and a semiconductor package mounted on an upper surface of the bottom PCB. The semiconductor package includes a substrate and a semiconductor die mounted on a top surface of the substrate. The semiconductor die and the top surface of the substrate are encapsulated by a molding compound. A top PCB is mounted on the semiconductor package through first connecting elements.

公开(公告)号：US11837552B2

公开(公告)日：2023-12-05

申请号：US17748308

申请日：2022-05-19

Applicant: MediaTek Inc.

Inventor： Wen-Sung Hsu ,  Tao Cheng ,  Nan-Cheng Chen ,  Che-Ya Chou ,  Wen-Chou Wu ,  Yen-Ju Lu ,  Chih-Ming Hung ,  Wei-Hsiu Hsu

IPC: H01L23/373 ,  H01L21/52 ,  H01L23/31 ,  H01L23/433 ,  H01L23/498 ,  H01L23/00 ,  H01L25/065 ,  H01L25/07 ,  H01L25/00 ,  H01L29/739 ,  H01L29/861 ,  H01L23/051 ,  H01L25/18 ,  H01L23/495 ,  H01L23/538 ,  H01L21/48 ,  H01L21/56 ,  H01L25/10 ,  H01L25/16 ,  H01L23/50 ,  H01L21/683 ,  H01Q9/04 ,  H01L23/66 ,  H01Q1/22 ,  H01L23/14 ,  H01Q21/06

CPC classification number: H01L23/5389 ,  H01L21/486 ,  H01L21/4846 ,  H01L21/4853 ,  H01L21/565 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/50 ,  H01L23/5383 ,  H01L23/66 ,  H01L25/0657 ,  H01L25/10 ,  H01L25/105 ,  H01L25/16 ,  H01L25/162 ,  H01L25/165 ,  H01L25/50 ,  H01Q1/2283 ,  H01Q9/0407 ,  H01Q9/0414 ,  H01L23/145 ,  H01L23/49816 ,  H01L24/13 ,  H01L24/16 ,  H01L24/48 ,  H01L24/81 ,  H01L2221/68345 ,  H01L2221/68359 ,  H01L2223/6677 ,  H01L2224/131 ,  H01L2224/13101 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2224/45099 ,  H01L2224/48227 ,  H01L2224/81005 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/1533 ,  H01L2924/1579 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19106 ,  H01Q21/065 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/13101 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2224/45099

Abstract: A semiconductor package includes a first substrate, a first layer structure, a second layer structure, a first antenna layer and an electronic component. The first antenna layer is formed on at least one of the first layer structure and the second layer structure, wherein the first antenna layer has an upper surface flush with a layer upper surface of the first layer structure or the second layer structure. The electronic component is disposed on a substrate lower surface of the first substrate and exposed from the first substrate. The first layer structure is formed between the first substrate and the second layer structure.

公开(公告)号：US11821975B2

公开(公告)日：2023-11-21

申请号：US17495769

申请日：2021-10-06

Applicant: MediaTek Inc.

Inventor： Yen-Ju Lu ,  Chih-Ming Hung ,  Wen-Chou Wu

IPC: G01S13/02 ,  H01Q15/14 ,  G01S7/03 ,  H01Q1/38 ,  H01Q1/32 ,  H01Q1/52 ,  G01S13/931 ,  H01Q1/22 ,  H01Q17/00 ,  H01L23/12 ,  H01L23/28 ,  H01Q1/24 ,  H05K1/02 ,  G01S7/02

CPC classification number: G01S13/02 ,  G01S7/03 ,  G01S13/931 ,  H01L23/12 ,  H01L23/28 ,  H01Q1/2283 ,  H01Q1/245 ,  H01Q1/3233 ,  H01Q1/38 ,  H01Q1/525 ,  H01Q15/14 ,  H01Q17/001 ,  H05K1/0213 ,  G01S7/027 ,  G01S7/028

Abstract: A radar module includes a printed circuit board (PCB) and a semiconductor package mounted on the PCB. The semiconductor package comprises an integrated circuit die and a substrate for electrically connecting the integrated circuit die to the PCB. The substrate comprises an antenna layer integrated into the semiconductor package and electrically connected to the integrated circuit die for at least one of transmitting and receiving radar signals. A discrete pattern-shaping device is mounted on the PCB and is configured to shape a radiation pattern of the radar signals.

公开(公告)号：US20200303806A1

公开(公告)日：2020-09-24

申请号：US16867583

申请日：2020-05-06

Applicant: MEDIATEK INC.

Inventor： Wen-Chou Wu ,  Yi-Chieh Lin ,  Chia-Yu Jin ,  Hsing-Chih Liu

IPC: H01Q1/22 ,  H01L23/498 ,  H01L25/16 ,  H01Q21/06

Abstract: A semiconductor package includes a bottom chip package having a first side and a second side opposing the first side. The bottom chip package comprises a first semiconductor chip and a second semiconductor chip arranged in a side-by-side manner on the second side. A top antenna package is mounted on the first side of the bottom chip package. The top antenna package comprises a radiative antenna element. A connector is disposed on the second side.

公开(公告)号：US20220302574A1

公开(公告)日：2022-09-22

申请号：US17713105

申请日：2022-04-04

Applicant: MediaTek Inc.

Inventor： Shih-Chia Chiu ,  Yen-Ju Lu ,  Wen-Chou Wu ,  Nan-Cheng Chen

IPC: H01Q1/22 ,  H01L23/66 ,  H01L23/31 ,  H01Q21/06 ,  H01L23/14 ,  H01Q15/00 ,  H01Q19/06 ,  H01Q15/10

Abstract: A semiconductor package includes a substrate having thereon at least an antenna layer and a ground reflector layer under the antenna layer, a radio frequency (RF) die disposed on or in the substrate, a molding compound disposed on the antenna layer of the substrate, and a frequency-selective surface (FSS) structure disposed on the molding compound. The FSS structure is a two-dimensional periodic array of metal patterns of same shape and size. The FSS structure has highly reflective characteristic.

公开(公告)号：US20200287271A1

公开(公告)日：2020-09-10

申请号：US16884064

申请日：2020-05-27

Applicant: MEDIATEK INC.

Inventor： Yen-Ju Lu ,  Wen-Chou Wu

IPC: H01Q1/22 ,  H01Q1/48 ,  H01Q1/52 ,  H01Q21/12 ,  H01Q9/26 ,  H01Q21/06 ,  H01L23/28 ,  H01L23/528 ,  H01L23/64 ,  H01L23/66

Abstract: An Antenna-in-Package (AiP) includes an interface layer having at least an antenna layer and an insulating layer disposed under the antenna layer. The antenna layer includes a first antenna region and a second antenna region spaced apart from the first antenna region. An integrated circuit die is disposed on the interface layer. The integrated circuit die is interposed between the first antenna region and the second antenna region. The first antenna region includes a first antenna element, a second antenna element extending along a first direction, and a feeding network electrically connecting the first antenna element and the second antenna element to the integrated circuit die. The feeding network, the first antenna element, and the second antenna element are coplanar. A plurality of solder balls is disposed on a surface of the interface layer.

公开(公告)号：US10680727B2

公开(公告)日：2020-06-09

申请号：US16056549

申请日：2018-08-07

Applicant: MEDIATEK INC.

Inventor： Yen-Ju Lu ,  Chih-Ming Hung ,  Wen-Chou Wu ,  Nan-Cheng Chen

IPC: H04B1/38 ,  H04B17/16 ,  G01R31/28 ,  G01R31/302 ,  G01R1/24 ,  G01R29/08 ,  G01R1/04

Abstract: An over-the-air (OTA) wireless test system includes a container, a machine plate disposed on the container, a supporter disposed on the machine plate, a load board disposed on the supporter, a socket disposed on the load board, a device under test (DUT) installed in the socket, and a wave-guiding feature in the socket and the load board configured to pass and guide electromagnetic waves to and/or from an antenna structure of the DUT. The wave-guiding feature comprises a wave-guiding channel in the socket defined by a plurality of pogo pins surrounding the antenna structure of the DUT. The wave-guiding feature may further comprise a radiation passage in the load board defined by rows of via fence extending through an entire thickness of the load board.

公开(公告)号：US20190305428A1

公开(公告)日：2019-10-03

申请号：US16293661

申请日：2019-03-06

Applicant: MEDIATEK INC.

Inventor： Jiunn-Nan Hwang ,  Yi-Chieh Lin ,  Yen-Ju Lu ,  Shih-Chia Chiu ,  Wen-Chou Wu

IPC: H01Q9/04 ,  H01Q1/48 ,  H01Q19/10 ,  H05K1/18 ,  H05K1/02 ,  H05K1/11 ,  H01Q21/06 ,  H01Q1/22 ,  H01L23/66 ,  H01L23/498

Abstract: An antenna structure includes a radiative antenna element disposed in a first conductive layer, a reflector ground plane disposed in a second conductive layer under the first conductive layer, a feeding network comprising a transmission line disposed in a third conductive layer under the second conductive layer, and at least one coupling element disposed in proximity to a feeding terminal that electrically couples one end of the transmission line to the radiative antenna element. The coupling element is capacitively coupled with the feeding terminal.

公开(公告)号：US20190115646A1

公开(公告)日：2019-04-18

申请号：US16120446

申请日：2018-09-03

Applicant: MEDIATEK INC.

Inventor： Shih-Chia Chiu ,  Yen-Ju Lu ,  Wen-Chou Wu ,  Nan-Cheng Chen

IPC: H01Q1/22 ,  H01L23/66 ,  H01L23/31 ,  H01L23/14 ,  H01Q21/06

Abstract: A semiconductor package includes a substrate having thereon at least an antenna layer and a ground reflector layer under the antenna layer, a radio frequency (RF) die disposed on or in the substrate, an encapsulation layer disposed on the antenna layer of the substrate, and a frequency-selective surface (FSS) structure disposed on the encapsulation layer. The FSS structure is a two-dimensional periodic array of metal patterns of same shape and size. The FSS structure has highly reflective characteristic.

公开(公告)号：US20190068300A1

公开(公告)日：2019-02-28

申请号：US16056549

申请日：2018-08-07

Applicant: MEDIATEK INC.

Inventor： Yen-Ju Lu ,  Chih-Ming Hung ,  Wen-Chou Wu ,  Nan-Cheng Chen

IPC: H04B17/16

Abstract: An over-the-air (OTA) wireless test system includes a container, a machine plate disposed on the container, a supporter disposed on the machine plate, a load board disposed on the supporter, a socket disposed on the load board, a device under test (DUT) installed in the socket, and a wave-guiding feature in the socket and the load board configured to pass and guide electromagnetic waves to and/or from an antenna structure of the DUT. The wave-guiding feature comprises a wave-guiding channel in the socket defined by a plurality of pogo pins surrounding the antenna structure of the DUT. The wave-guiding feature may further comprise a radiation passage in the load board defined by rows of via fence extending through an entire thickness of the load board.