发明申请
- 专利标题： SEMICONDUCTOR PACKAGE WITH LAYER STRUCTURES, ANTENNA LAYER AND ELECTRONIC COMPONENT
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申请号： US17748308申请日： 2022-05-19
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公开(公告)号： US20220352084A1公开(公告)日： 2022-11-03
- 发明人: Wen-Sung Hsu , Tao Cheng , Nan-Cheng Chen , Che-Ya Chou , Wen-Chou Wu , Yen-Ju Lu , Chih-Ming Hung , Wei-Hsiu Hsu
- 申请人： MediaTek Inc.
- 申请人地址： TW Hsin-Chu
- 专利权人： MediaTek Inc.
- 当前专利权人： MediaTek Inc.
- 当前专利权人地址： TW Hsin-Chu
- 主分类号： H01L23/538
- IPC分类号： H01L23/538 ; H01L21/48 ; H01L21/56 ; H01L25/00 ; H01L25/10 ; H01L23/31 ; H01L25/065 ; H01L25/16 ; H01L23/50 ; H01L23/498 ; H01L21/683 ; H01Q9/04 ; H01L23/66 ; H01Q1/22
摘要：
A semiconductor package includes a first substrate, a first layer structure, a second layer structure, a first antenna layer and an electronic component. The first antenna layer is formed on at least one of the first layer structure and the second layer structure, wherein the first antenna layer has an upper surface flush with a layer upper surface of the first layer structure or the second layer structure. The electronic component is disposed on a substrate lower surface of the first substrate and exposed from the first substrate. The first layer structure is formed between the first substrate and the second layer structure.
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