公开(公告)号：US09818727B2

公开(公告)日：2017-11-14

申请号：US15012018

申请日：2016-02-01

申请人： MediaTek Inc.

发明人： Che-Hung Kuo ,  Ying-Chih Chen ,  Che-Ya Chou

IPC分类号： H01L23/48 ,  H01L25/065 ,  H01L25/16 ,  H01L23/31 ,  H01L23/00

CPC分类号： H01L25/0657 ,  H01L23/3128 ,  H01L24/05 ,  H01L24/06 ,  H01L24/32 ,  H01L24/73 ,  H01L25/0652 ,  H01L25/16 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/04105 ,  H01L2224/05554 ,  H01L2224/06135 ,  H01L2224/12105 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48265 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06568 ,  H01L2225/06572 ,  H01L2225/06582 ,  H01L2924/1431 ,  H01L2924/1432 ,  H01L2924/1436 ,  H01L2924/15311 ,  H01L2924/16235 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19104 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/00012 ,  H01L2924/00

摘要： The invention provides a semiconductor package assembly. The semiconductor package assembly includes a first substrate. A first semiconductor die is disposed on the first substrate. A passive device is located directly on the first semiconductor die. The passive device is disposed within a boundary of the first semiconductor die in a plan view.

公开(公告)号：US11244913B2

公开(公告)日：2022-02-08

申请号：US16699851

申请日：2019-12-02

申请人： MEDIATEK Inc.

发明人： Ying-Chih Chen ,  Yen-Ju Lu ,  Che-Ya Chou ,  Hsing-Chih Liu

IPC分类号： H01L23/66 ,  H01L23/31 ,  H01L23/528 ,  H01L23/532 ,  H01Q1/22

摘要： A semiconductor package includes a substrate, an electronic component, a dielectric layer a transmitting antenna, a receiving antenna and a FSS (Frequency selective surface) antenna. The electronic component is disposed on and electrically connected with the substrate. The dielectric layer has a dielectric upper surface. The transmitting antenna and the receiving antenna are formed adjacent to the substrate. The FSS antenna is formed adjacent to the dielectric upper surface of the dielectric layer. The FSS antenna is separated from the substrate by the dielectric layer in a wireless signal emitting direction.

公开(公告)号：US09564395B2

公开(公告)日：2017-02-07

申请号：US14809482

申请日：2015-07-27

申请人： MediaTek Inc.

发明人： Hsing-Chih Liu ,  Chia-Hao Yang ,  Ying-Chih Chen

IPC分类号： H01L23/48 ,  H01L23/522 ,  H01L23/538 ,  H01L23/528 ,  H01L23/50 ,  H01L23/495 ,  H01L23/00 ,  H01L25/065

CPC分类号： H01L25/0655 ,  H01L23/49575 ,  H01L23/50 ,  H01L23/5221 ,  H01L23/528 ,  H01L23/5381 ,  H01L23/5386 ,  H01L24/05 ,  H01L24/06 ,  H01L24/09 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/85 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/0603 ,  H01L2224/0612 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48095 ,  H01L2224/48137 ,  H01L2224/48138 ,  H01L2224/48139 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/48479 ,  H01L2224/4903 ,  H01L2224/4909 ,  H01L2224/4911 ,  H01L2224/4912 ,  H01L2224/4917 ,  H01L2224/49171 ,  H01L2224/4945 ,  H01L2224/73265 ,  H01L2224/85181 ,  H01L2224/85186 ,  H01L2224/85205 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2224/05599 ,  H01L2924/00015 ,  H01L2924/00 ,  H01L2224/4554

摘要： A semiconductor package structure includes a base. A first die is mounted on the base. The first die comprises a plurality of first pads with a first pad area arranged in a first tier. A plurality of second pads with a second pad area is arranged in a second tier. A second die is mounted on the base. The second die includes a plurality of third pads arranged in a third tier. A first bonding wire has two terminals respectively coupled to one of the first pads and one of the third pads. A second bonding wire has two terminals respectively coupled to one of the third pads and one of the second pads.

摘要翻译： 半导体封装结构包括基底。 第一个模具安装在基座上。 第一管芯包括多个第一焊盘，第一焊盘区域布置在第一层中。 具有第二焊盘区域的多个第二焊盘被布置在第二层中。 第二个模具安装在基座上。 第二管芯包括布置在第三层中的多个第三焊盘。 第一接合线具有分别耦合到第一焊盘之一和第三焊盘中的一个的两个端子。 第二接合线具有分别耦合到第三焊盘之一和第二焊盘之一的两个端子。

公开(公告)号：US09991227B2

公开(公告)日：2018-06-05

申请号：US15385988

申请日：2016-12-21

申请人： MediaTek Inc.

发明人： Hsing-Chih Liu ,  Chia-Hao Yang ,  Ying-Chih Chen

IPC分类号： H01L23/48 ,  H01L25/065 ,  H01L23/00

CPC分类号： H01L25/0655 ,  H01L23/49575 ,  H01L23/50 ,  H01L23/5221 ,  H01L23/528 ,  H01L23/5381 ,  H01L23/5386 ,  H01L24/05 ,  H01L24/06 ,  H01L24/09 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/85 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/0603 ,  H01L2224/0612 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48095 ,  H01L2224/48137 ,  H01L2224/48138 ,  H01L2224/48139 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/48479 ,  H01L2224/4903 ,  H01L2224/4909 ,  H01L2224/4911 ,  H01L2224/4912 ,  H01L2224/4917 ,  H01L2224/49171 ,  H01L2224/4945 ,  H01L2224/73265 ,  H01L2224/85181 ,  H01L2224/85186 ,  H01L2224/85205 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2224/05599 ,  H01L2924/00015 ,  H01L2924/00 ,  H01L2224/4554

摘要： A semiconductor package structure includes a base. A first die is mounted on the base. The first die includes a plurality of first pads arranged in a first tier, and a plurality of second pads arranged in a second tier. A second die is mounted on the base and includes a plurality of third pads with the first pad area, and a plurality of fourth pads with the second pad area, alternately arranged in a third tier. The second die also includes a first bonding wire having two terminals respectively coupled to one of the first pads and one of the fourth pads. The semiconductor package structure also includes a second bonding wire having two terminals respectively coupled to one of the third pads and one of the second pads.

公开(公告)号：US09129962B1

公开(公告)日：2015-09-08

申请号：US14271792

申请日：2014-05-07

申请人： MediaTek Inc.

发明人： Hsing-Chih Liu ,  Chia-Hao Yang ,  Ying-Chih Chen

IPC分类号： H01L23/48 ,  H01L23/522 ,  H01L23/538 ,  H01L23/528 ,  H01L23/50 ,  H01L23/495

CPC分类号： H01L25/0655 ,  H01L23/49575 ,  H01L23/50 ,  H01L23/5221 ,  H01L23/528 ,  H01L23/5381 ,  H01L23/5386 ,  H01L24/05 ,  H01L24/06 ,  H01L24/09 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/85 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/0603 ,  H01L2224/0612 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48095 ,  H01L2224/48137 ,  H01L2224/48138 ,  H01L2224/48139 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/48479 ,  H01L2224/4903 ,  H01L2224/4909 ,  H01L2224/4911 ,  H01L2224/4912 ,  H01L2224/4917 ,  H01L2224/49171 ,  H01L2224/4945 ,  H01L2224/73265 ,  H01L2224/85181 ,  H01L2224/85186 ,  H01L2224/85205 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2224/05599 ,  H01L2924/00015 ,  H01L2924/00 ,  H01L2224/4554

摘要： The invention provides a semiconductor package structure. The semiconductor package structure includes a base. A first die is mounted on the base. The first die comprises a plurality of first pads with a first pad area arranged in a first tier. A plurality of second pads with a second pad area is arranged in a second tier. A second die is mounted on the base. The second die comprises a plurality of third pads with the first pad area and a plurality of fourth pads with the second pad area alternately arranged in a third tier. A first bonding wire has two terminals respectively coupled to one of the first pads and one of the fourth pads. A second bonding wire has two terminals respectively coupled to one of the third pads and one of the second pads.

摘要翻译： 本发明提供一种半导体封装结构。 半导体封装结构包括基底。 第一个模具安装在基座上。 第一管芯包括多个第一焊盘，第一焊盘区域布置在第一层中。 具有第二焊盘区域的多个第二焊盘被布置在第二层中。 第二个模具安装在基座上。 第二管芯包括具有第一焊盘区域的多个第三焊盘和具有第二焊盘区域的多个第四焊盘，其交替地布置在第三层中。 第一接合线具有分别耦合到第一焊盘之一和第四焊盘之一的两个端子。 第二接合线具有分别耦合到第三焊盘之一和第二焊盘之一的两个端子。