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81.
公开(公告)号:US20230317395A1
公开(公告)日:2023-10-05
申请号:US17996520
申请日:2021-04-14
Applicant: Denka Company Limited
Inventor: Daisuke ISHIKAWA , Hiromitsu CHATANI
CPC classification number: H01J9/04 , H01J37/06 , H01J2237/06308
Abstract: A method for manufacturing an electron source according to the present disclosure includes steps of: (A) preparing a first member provided with a columnar portion made of a first material having an electron emission characteristic, (B) preparing a second member which has a higher work function and a lower strength than the first material, and in which a hole is formed extending in a direction from one end surface toward the other end surface, and (C) pushing the columnar portion into the hole in the second member, wherein the first member has a cross-sectional shape that is dissimilar to the cross-sectional shape of the hole; and in the step (C), by pressing the columnar portion into the hole, a portion of a side surface of the columnar portion scrapes the inner surface of the hole and bites into the second member, thereby fixing the columnar portion to the second member.
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公开(公告)号:US20230298846A1
公开(公告)日:2023-09-21
申请号:US18041408
申请日:2021-08-05
Applicant: Denka Company Limited
Inventor: Daisuke ISHIKAWA , Hiromitsu CHATANI
IPC: H01J37/06
CPC classification number: H01J37/06 , H01J2237/06308
Abstract: An emitter according to the present disclosure includes: first and second heaters generating heat by energization; an electron source comprising a first material emitting an electron by being heated by the first and second heaters; and an intermediate member interposed between the electron source, and the first and second heaters, the intermediate member comprising a second material lower in thermal conductivity than the first material.
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公开(公告)号:US20190214224A1
公开(公告)日:2019-07-11
申请号:US16237775
申请日:2019-01-02
Applicant: NuFlare Technology, Inc.
Inventor: Michihiro Kawaguchi , Kiminobu Akeno , Kiyoshi Nakaso , Keita Ideno , Shintaro Yamamoto , Keisuke Goto , Hitoshi Matsushita , Hirokazu Yoshioka , Ryouta Inoue , Yuuki Fukuda
IPC: H01J37/244 , H01J37/317 , H01J37/06
CPC classification number: H01J37/244 , H01J37/06 , H01J37/3174 , H01J2237/0216 , H01J2237/20264
Abstract: The vibration control system configured to control vibration of a vibration-controlled object is disclosed. The vibration control system comprises: (i) actuator units each including a piezoelectric element configured to expand and contract; (ii) a drive power source configured to supply drive voltages to the piezoelectric elements of the actuator units for causing the piezoelectric elements to expand and contract; (iii) a vibration detector configured to detect a status of vibration of the vibration-controlled object; and (iv) a vibration controller configured to control the vibration of the vibration-controlled object by controlling the voltages supplied by the drive power source to the piezoelectric elements of the actuator units based on the status of vibration detected by the vibration detector, respectively.
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公开(公告)号:US20190202000A1
公开(公告)日:2019-07-04
申请号:US16322594
申请日:2017-08-04
Applicant: Consorzio Di Ricerca Hypatia
Inventor: Gildo Di Domenico , Flavio Lucibello , Lorenzo Scatena , Mariano Zarcone
IPC: B23K15/00 , B33Y30/00 , B23K15/02 , H01J37/147 , H01J37/12 , H01J25/10 , H01J37/06 , H01J37/315 , H01J37/301
CPC classification number: B23K15/0086 , B22F3/1055 , B22F2003/1056 , B23K15/0026 , B23K15/02 , B33Y30/00 , H01J25/02 , H01J25/04 , H01J25/10 , H01J25/36 , H01J25/42 , H01J37/06 , H01J37/12 , H01J37/147 , H01J37/301 , H01J37/315 , H01J37/3178 , H01J2237/0473 , H01J2237/3104 , H01J2237/3128 , H03B9/04 , Y02P10/295
Abstract: An electron beam 3D printing machine (1), comprising a chamber (2) for generating and accelerating an electron beam and an operating chamber (3) in which a metal powder is melted, with the consequent production of a three-dimensional product. The chamber (2) for generating and accelerating an electron beam houses means (4) for generating an electron beam and means (6) for accelerating the generated electron beam, while the operating chamber (3) houses at least one platform (16) for depositing the metal powder, metal powder handling means (18) and electron beam deflection means (15). The accelerator means for the generated electron beam comprise a series of resonant cavities fed with an alternating signal.
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公开(公告)号:US20190198284A1
公开(公告)日:2019-06-27
申请号:US16328150
申请日:2016-09-06
Applicant: HITACHI HIGH-TECHNOLOGIES CORPORATION
Inventor: Soichiro MATSUNAGA , Yasunari SOHDA , Souichi KATAGIRI , Hajime KAWANO , Takashi DOI
IPC: H01J37/073 , H01J37/244 , H01J37/28
CPC classification number: H01J37/073 , H01J1/30 , H01J1/304 , H01J37/06 , H01J37/244 , H01J37/28 , H01J2237/2448 , H01J2237/24485 , H01J2237/24578 , H01J2237/2809
Abstract: Provided is a high-brightness, high-current electron source including a wire-like member. The wire-like member has an electron emission plane at the tip of the wire-like member. The electron emission plane has a projectingly curved surface. At least the surface of the electron emission plane is formed of an amorphous material.
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公开(公告)号:US20190108966A1
公开(公告)日:2019-04-11
申请号:US16150675
申请日:2018-10-03
Applicant: KLA-TENCOR CORPORATION
Inventor: Gildardo R. Delgado , Rudy F. Garcia , Katerina Ioakeimidi , Frances Hill , Michael E. Romero
CPC classification number: H01J37/073 , G02B27/0927 , H01J1/3044 , H01J1/34 , H01J19/24 , H01J37/06 , H01J37/26 , H01J37/28 , H01J40/06 , H01J40/18 , H01J2201/30411 , H01J2201/30449 , H01J2201/3048 , H01J2201/308 , H01J2201/3423 , H01J2201/3425 , H01J2201/3426 , H01J2237/06333 , H01J2237/24521 , H01J2237/24592 , H01J2237/2817 , H01L21/67288
Abstract: A photocathode structure, which can include an alkali halide, has a protective film on an exterior surface of the photocathode structure. The protective film includes ruthenium. This protective film can be, for example, ruthenium or an alloy of ruthenium and platinum. The protective film can have a thickness from 1 nm to 20 nm. The photocathode structure can be used in an electron beam tool like a scanning electron microscope.
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公开(公告)号:US20190057834A1
公开(公告)日:2019-02-21
申请号:US15980399
申请日:2018-05-15
Inventor: Lawrence H. Friedman , Wen-Li WU
CPC classification number: H01J37/1471 , G01B15/04 , G01B2210/56 , H01J37/06 , H01J37/10 , H01J37/20 , H01J37/22
Abstract: An electron reflectometer includes: a sample stage; a source that produces source electrons; a source collimator; and an electron detector that receives collimated reflected electrons.
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公开(公告)号:US20180327126A1
公开(公告)日:2018-11-15
申请号:US16032333
申请日:2018-07-11
Applicant: TETRA LAVAL HOLDINGS & FINANCE S.A.
Inventor: Dominique CLOETTA , Urs HOSTETTLER , Werner HAAG , Simone BIANCO
CPC classification number: B65B55/08 , A61L2/087 , A61L2/26 , A61L2202/11 , A61L2202/23 , H01J1/15 , H01J29/04 , H01J33/02 , H01J37/06
Abstract: Electron beam generator comprising an electron emitting device adapted to emit an electron beam when heated to an elevated temperature, wherein the electron emitting device comprises a filament having a spiral portion.
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89.
公开(公告)号:US10020200B1
公开(公告)日:2018-07-10
申请号:US14966165
申请日:2015-12-11
Applicant: Multibeam Corporation
Inventor: Kevin M. Monahan , Theodore A. Prescop , Michael C. Smayling , David K. Lam
IPC: H01L21/3065 , H01L21/02 , H01L21/308 , H01L21/66
CPC classification number: H01L21/3065 , B81C1/00373 , B81C2201/0143 , B81C2201/0188 , C23C14/48 , C23C16/047 , C23C16/48 , C23C16/486 , C23C16/487 , H01J37/05 , H01J37/06 , H01J37/08 , H01J37/228 , H01J37/244 , H01J37/30 , H01J37/304 , H01J37/305 , H01J37/3053 , H01J37/3056 , H01J37/3172 , H01J37/3174 , H01J37/3177 , H01J37/3178 , H01J2237/004 , H01J2237/0635 , H01J2237/1501 , H01J2237/24592 , H01J2237/30466 , H01J2237/30472 , H01J2237/31708 , H01J2237/31732 , H01J2237/31735 , H01J2237/31737 , H01J2237/3174 , H01J2237/31749 , H01L21/0228 , H01L21/0262 , H01L21/26 , H01L21/308 , H01L21/3085 , H01L22/12 , H01L22/20 , H01L22/26
Abstract: Methods and systems for direct atomic layer etching and deposition on or in a substrate using charged particle beams. Electrostatically-deflected charged particle beam columns can be targeted in direct dependence on the design layout database to perform atomic layer etch and atomic layer deposition, expressing pattern with selected 3D-structure. Reducing the number of process steps in patterned atomic layer etch and deposition reduces manufacturing cycle time and increases yield by lowering the probability of defect introduction. Local gas and photon injectors and detectors are local to corresponding columns, and support superior, highly-configurable process execution and control.
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公开(公告)号:US09953803B2
公开(公告)日:2018-04-24
申请号:US15049524
申请日:2016-02-22
Applicant: Hermes Microvision Inc.
CPC classification number: H01J37/20 , H01J37/06 , H01J37/222 , H01J37/3045 , H01J2237/202 , H01J2237/2826 , H01L22/12
Abstract: A calibration method for calibrating the position error in the point of interest induced from the stage of the defect inspection tool is achieved by controlling the deflectors directly. The position error in the point of interest is obtained from the design layout database.
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