公开(公告)号：US20170186846A1

公开(公告)日：2017-06-29

申请号：US14980850

申请日：2015-12-28

Applicant: QUALCOMM Incorporated

Inventor： Mustafa Badaroglu ,  Vladimir Machkaoutsan ,  Stanley Seungchul Song ,  Jeffrey Junhao Xu ,  Matthew Michael Nowak ,  Choh Fei Yeap

IPC: H01L29/423 ,  H01L29/49 ,  H01L29/06 ,  H01L29/165 ,  H01L29/66 ,  H01L21/762

CPC classification number: H01L29/42392 ,  B82Y10/00 ,  H01L21/02507 ,  H01L21/02532 ,  H01L21/762 ,  H01L29/0653 ,  H01L29/0673 ,  H01L29/086 ,  H01L29/0878 ,  H01L29/165 ,  H01L29/4966 ,  H01L29/66439 ,  H01L29/66484 ,  H01L29/66545 ,  H01L29/66795 ,  H01L29/775 ,  H01L29/7831

Abstract: A nanowire transistor is provided that includes a well implant having a local isolation region for insulating a replacement metal gate from a parasitic channel. In addition, the nanowire transistor includes oxidized caps in the extension regions that inhibit parasitic gate-to-source and gate-to-drain capacitances.

公开(公告)号：US09660110B2

公开(公告)日：2017-05-23

申请号：US14498359

申请日：2014-09-26

Applicant: QUALCOMM Incorporated

Inventor： Daeik Daniel Kim ,  Jonghae Kim ,  Chengjie Zuo ,  Sang-June Park ,  Changhan Hobie Yun ,  Mario Francisco Velez ,  David Francis Berdy ,  Matthew Michael Nowak ,  Robert Paul Mikulka

IPC: H01L29/93 ,  H01L29/94 ,  H01L27/06

CPC classification number: H01L29/93 ,  H01L27/0629 ,  H01L29/94

Abstract: An apparatus includes a varactor having a first contact that is located on a first side of a substrate. The varactor includes a second contact that is located on a second side of the substrate, and the second side is opposite the first side. The apparatus further includes a signal path between the first contact and the second contact.

公开(公告)号：US20170084531A1

公开(公告)日：2017-03-23

申请号：US14861958

申请日：2015-09-22

Applicant: QUALCOMM Incorporated

Inventor： Shiqun Gu ,  Daeik Daniel Kim ,  Matthew Michael Nowak ,  Jonghae Kim ,  Changhan Hobie Yun ,  Je-Hsiung Jeffrey Lan ,  David Francis Berdy

IPC: H01L23/498 ,  H01L21/8234 ,  H01L21/306 ,  H01L27/088 ,  H01L27/12 ,  H01L23/66 ,  H01L21/84 ,  H01L21/304

CPC classification number: H01L27/1203 ,  H01L21/304 ,  H01L21/30604 ,  H01L21/76251 ,  H01L21/76802 ,  H01L21/76877 ,  H01L21/76895 ,  H01L21/823481 ,  H01L21/84 ,  H01L23/49894 ,  H01L23/528 ,  H01L23/66 ,  H01L27/088 ,  H01L27/092 ,  H01L27/1222 ,  H01L27/1248 ,  H01L27/1255 ,  H01L27/1266 ,  H01L29/1087 ,  H01L29/66772

Abstract: An integrated circuit (IC) includes a first semiconductor device on a glass substrate. The first semiconductor device includes a first semiconductive region of a bulk silicon wafer. The IC includes a second semiconductor device on the glass substrate. The second semiconductor device includes a second semiconductive region of the bulk silicon wafer. The IC includes a through substrate trench between the first semiconductive region and the second semiconductive region. The through substrate trench includes a portion disposed beyond a surface of the bulk silicon wafer.

公开(公告)号：US09508439B2

公开(公告)日：2016-11-29

申请号：US14602090

申请日：2015-01-21

Applicant: QUALCOMM Incorporated

Inventor： Xia Li ,  Jeffrey Junhao Xu ,  Xiao Lu ,  Matthew Michael Nowak ,  Seung Hyuk Kang ,  Xiaonan Chen ,  Zhongze Wang ,  Yu Lu

IPC: G11C16/10 ,  H01L29/423 ,  H01L29/792 ,  H01L29/51 ,  G11C16/26 ,  H01L27/112

CPC classification number: G11C16/10 ,  G11C11/223 ,  G11C11/2259 ,  G11C11/2273 ,  G11C11/2275 ,  G11C16/26 ,  H01L27/11246 ,  H01L29/4234 ,  H01L29/513 ,  H01L29/517 ,  H01L29/7836 ,  H01L29/792

Abstract: An apparatus includes a multiple time programmable (MTP) memory device. The MTP memory device includes a metal gate, a substrate material, and an oxide structure between the metal gate and the substrate material. The oxide structure includes a hafnium oxide layer and a silicon dioxide layer. The hafnium oxide layer is in contact with the metal gate and in contact with the silicon dioxide layer. The silicon dioxide layer is in contact with the substrate material. The MTP device includes a transistor, and a non-volatile state of the MTP memory device is based on a threshold voltage of the transistor.

Abstract translation: 一种装置包括多时间可编程（MTP）存储器件。 MTP存储器件包括金属栅极，衬底材料和金属栅极和衬底材料之间的氧化物结构。 氧化物结构包括氧化铪层和二氧化硅层。 氧化铪层与金属栅极接触并与二氧化硅层接触。 二氧化硅层与衬底材料接触。 MTP器件包括晶体管，并且MTP存储器件的非易失性状态基于晶体管的阈值电压。

公开(公告)号：US09425096B2

公开(公告)日：2016-08-23

申请号：US14330950

申请日：2014-07-14

Applicant: QUALCOMM Incorporated

Inventor： Shiqun Gu ,  Matthew Michael Nowak ,  Jeffrey Junhao Xu

IPC: H01L21/4763 ,  H01L21/768 ,  H01L23/532 ,  H01L23/522 ,  H01L23/14 ,  H01L23/498

CPC classification number: H01L21/76895 ,  H01L21/7682 ,  H01L23/147 ,  H01L23/481 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/5222 ,  H01L23/53257 ,  H01L23/53295 ,  H01L2224/16225 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00012

Abstract: Systems and methods are directed to a semiconductor device, which includes an integrated circuit, wherein the integrated circuit includes at least a first layer comprising two or more Tungsten lines and at least one air gap between at least two Tungsten lines, the air gaps to reduce capacitance. An interposer is coupled to the integrated circuit, to reduce stress on the two or more Tungsten lines and the at least one air gap. A laminated package substrate may be attached to the interposer such that the interposer is configured to absorb mechanical stress induced by mismatch in coefficient of thermal expansion (CTE) between the laminated package substrate and the interposer and protect the air gap from the mechanical stress.

Abstract translation: 系统和方法涉及包括集成电路的半导体器件，其中集成电路至少包括包含两条或更多条钨线的至少一条第一层和至少两条钨线之间的至少一个气隙，所述气隙减少 电容。 插入器耦合到集成电路，以减少两个或多个钨线和至少一个气隙的应力。 层叠封装基板可以附接到插入件，使得插入件被构造成吸收由层压封装基板和插入件之间的热膨胀系数（CTE）失配引起的机械应力，并保护气隙免受机械应力。

公开(公告)号：US09373782B2

公开(公告)日：2016-06-21

申请号：US14518459

申请日：2014-10-20

Applicant: QUALCOMM Incorporated

Inventor： Xia Li ,  Seung Hyuk Kang ,  Matthew Michael Nowak

IPC: H01L43/12 ,  H01L43/08 ,  H01L27/22

CPC classification number: H01L43/12 ,  H01L27/222 ,  H01L43/08

Abstract: A memory device may comprise a magnetic tunnel junction (MTJ) stack, a bottom electrode (BE) layer, and a contact layer. The MTJ stack may include a free layer, a barrier, and a pinned layer. The BE layer may be coupled to the MTJ stack, and encapsulated in a planarized layer. The BE layer may also have a substantial common axis with the MTJ stack. The contact layer may be embedded in the BE layer, and form an interface between the BE layer and the MTJ stack.

Abstract translation: 存储器件可以包括磁性隧道结（MTJ）堆叠，底部电极（BE）层和接触层。 MTJ堆叠可以包括自由层，阻挡层和钉扎层。 BE层可以耦合到MTJ堆叠，并且封装在平坦化层中。 BE层也可以具有与MTJ叠层相当的共同轴。 接触层可以嵌入在BE层中，并且在BE层和MTJ堆叠之间形成界面。

公开(公告)号：US20160012896A1

公开(公告)日：2016-01-14

申请号：US14602090

申请日：2015-01-21

Applicant: QUALCOMM Incorporated

Inventor： Xia Li ,  Jeffrey Junhao Xu ,  Xiao Lu ,  Matthew Michael Nowak ,  Seung Hyuk Kang ,  Xiaonan Chen ,  Zhongze Wang ,  Yu Lu

IPC: G11C16/10 ,  H01L29/423 ,  H01L29/792 ,  G11C16/26 ,  H01L29/51

CPC classification number: G11C16/10 ,  G11C11/223 ,  G11C11/2259 ,  G11C11/2273 ,  G11C11/2275 ,  G11C16/26 ,  H01L27/11246 ,  H01L29/4234 ,  H01L29/513 ,  H01L29/517 ,  H01L29/7836 ,  H01L29/792

Abstract: An apparatus includes a multiple time programmable (MTP) memory device. The MTP memory device includes a metal gate, a substrate material, and an oxide structure between the metal gate and the substrate material. The oxide structure includes a hafnium oxide layer and a silicon dioxide layer. The hafnium oxide layer is in contact with the metal gate and in contact with the silicon dioxide layer. The silicon dioxide layer is in contact with the substrate material. The MTP device includes a transistor, and a non-volatile state of the MTP memory device is based on a threshold voltage of the transistor.

Abstract translation: 一种装置包括多时间可编程（MTP）存储器件。 MTP存储器件包括金属栅极，衬底材料和金属栅极和衬底材料之间的氧化物结构。 氧化物结构包括氧化铪层和二氧化硅层。 氧化铪层与金属栅极接触并与二氧化硅层接触。 二氧化硅层与衬底材料接触。 MTP器件包括晶体管，并且MTP存储器件的非易失性状态基于晶体管的阈值电压。

公开(公告)号：US09230630B2

公开(公告)日：2016-01-05

申请号：US14072599

申请日：2013-11-05

Applicant: QUALCOMM Incorporated

Inventor： Xiaochun Zhu ,  Steven M. Millendorf ,  Xu Guo ,  David M. Jacobson ,  Kangho Lee ,  Seung H. Kang ,  Matthew Michael Nowak

IPC: G11C11/16 ,  H04L9/30 ,  H04L9/08 ,  H04L9/32

CPC classification number: G11C11/1673 ,  G09C1/00 ,  G11C11/161 ,  H04L9/0866 ,  H04L9/30 ,  H04L9/3278

Abstract: One feature pertains to a method for implementing a physically unclonable function (PUF). The method includes providing an array of magnetoresistive random access memory (MRAM) cells, where the MRAM cells are each configured to represent one of a first logical state and a second logical state. The array of MRAM cells are un-annealed and free from exposure to an external magnetic field oriented in a direction configured to initialize the MRAM cells to a single logical state of the first and second logical states. Consequently, each MRAM cell has a random initial logical state of the first and second logical states. The method further includes sending a challenge to the MRAM cell array that reads logical states of select MRAM cells of the array, and obtaining a response to the challenge from the MRAM cell array that includes the logical states of the selected MRAM cells of the array.

Abstract translation: 一个特征涉及用于实现物理不可克隆功能（PUF）的方法。 该方法包括提供磁阻随机存取存储器（MRAM）单元阵列，其中MRAM单元被配置为表示第一逻辑状态和第二逻辑状态之一。 MRAM单元的阵列是未退火的，并且没有暴露于被配置为将MRAM单元初始化的方向定向到第一和第二逻辑状态的单个逻辑状态的外部磁场。 因此，每个MRAM单元具有第一和第二逻辑状态的随机初始逻辑状态。 该方法还包括向MRAM单元阵列发送挑战，该MRAM单元阵列读取阵列的选择MRAM单元的逻辑状态，以及从包括阵列的所选MRAM单元的逻辑状态的MRAM单元阵列获得对挑战的响应。

公开(公告)号：US20150070979A1

公开(公告)日：2015-03-12

申请号：US14072537

申请日：2013-11-05

Applicant: QUALCOMM Incorporated

Inventor： Xiaochun Zhu ,  Steven M. Millendorf ,  Xu Guo ,  David M. Jacobson ,  Kangho Lee ,  Seung H. Kang ,  Matthew Michael Nowak

IPC: G11C11/16

CPC classification number: G11C11/1695 ,  G09C1/00 ,  G11C11/161 ,  G11C11/1673 ,  G11C11/1675 ,  H04L9/0866 ,  H04L9/3278 ,  H04L2209/12

Abstract: One feature pertains to a method of implementing a physically unclonable function. The method includes initializing an array of magnetoresistive random-access memory (MRAM) cells to a first logical state, where each of the MRAM cells have a random transition voltage that is greater than a first voltage and less than a second voltage. The transition voltage represents a voltage level that causes the MRAM cells to transition from the first logical state to a second logical state. The method further includes applying a programming signal voltage to each of the MRAM cells of the array to cause at least a portion of the MRAM cells of the array to randomly change state from the first logical state to the second logical state, where the programming signal voltage is greater than the first voltage and less than the second voltage.

Abstract translation: 一个特征涉及实现物理上不可克隆功能的方法。 该方法包括将磁阻随机存取存储器（MRAM）单元的阵列初始化为第一逻辑状态，其中每个MRAM单元具有大于第一电压且小于第二电压的随机转变电压。 转换电压表示使MRAM单元从第一逻辑状态转换到第二逻辑状态的电压电平。 该方法还包括将编程信号电压施加到阵列的每个MRAM单元，以使阵列的MRAM单元的至少一部分随机地将状态从第一逻辑状态改变到第二逻辑状态，其中编程信号 电压大于第一电压且小于第二电压。

公开(公告)号：US20140225246A1

公开(公告)日：2014-08-14

申请号：US14133451

申请日：2013-12-18

Applicant: QUALCOMM INCORPORATED

Inventor： Brian Matthew Henderson ,  Durodami Joscelyn Lisk ,  Shiqun Gu ,  Ratibor Radojcic ,  Matthew Michael Nowak

IPC: H01L23/538 ,  H01L23/36

CPC classification number: H01L23/5384 ,  H01L21/50 ,  H01L23/3128 ,  H01L23/34 ,  H01L23/36 ,  H01L23/481 ,  H01L23/49811 ,  H01L23/5286 ,  H01L23/5383 ,  H01L23/5389 ,  H01L24/19 ,  H01L25/0657 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/17181 ,  H01L2224/73259 ,  H01L2224/92224 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06527 ,  H01L2225/06544 ,  H01L2225/06548 ,  H01L2225/06586 ,  H01L2225/06589 ,  H01L2924/15184 ,  H01L2924/15311

Abstract: Some implementations provide an integrated device that includes a first substrate, a first die coupled to the first substrate, a second die coupled to the first die, and a second substrate coupled to the second die. The second substrate is configured to provide an electrical path for a signal to the second die. The integrated device further includes a molding surrounding the first die and the second die, and several through mold vias (TMVs) coupled to the second substrate. The TMVs are configured to provide an electrical path for the signal to the second die through the second substrate. In some implementations, the second substrate includes a signal distribution structure configured to provide the electrical path for the signal to the second die. In some implementations, the first substrate and the second substrate are part of a signal distribution network that provides signal to the second die.

Abstract translation: 一些实施方案提供了集成器件，其包括第一衬底，耦合到第一衬底的第一裸片，耦合到第一裸片的第二裸片以及耦合到第二裸片的第二衬底。 第二基板被配置为提供用于到第二管芯的信号的电路径。 集成装置还包括围绕第一管芯和第二管芯的模制件以及耦合到第二衬底的多个通孔模具通孔（TMV）。 TMV被配置为提供通过第二基板的信号到第二管芯的电路径。 在一些实施方案中，第二衬底包括被配置为向第二裸片提供信号的电路的信号分配结构。 在一些实施方案中，第一衬底和第二衬底是向第二裸片提供信号的信号分配网络的一部分。