公开(公告)号：US09165791B2

公开(公告)日：2015-10-20

申请号：US14069201

申请日：2013-10-31

Applicant: QUALCOMM Incorporated

Inventor： Xiaoxia Wu ,  Yunqiang Yang ,  Chengjie Zuo ,  Durodami Joscelyn Lisk

IPC: H01L23/522 ,  H01L21/48 ,  H01L49/02 ,  H01L23/538 ,  H01L23/498

CPC classification number: H01L21/486 ,  H01L23/48 ,  H01L23/49816 ,  H01L23/5383 ,  H01L23/5384 ,  H01L23/645 ,  H01L24/13 ,  H01L24/16 ,  H01L25/0655 ,  H01L28/10 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2924/12042 ,  H01L2924/15174 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/157 ,  H01L2924/30107 ,  H01L2924/014 ,  H01L2924/00

Abstract: Some implementations provide an interposer that includes a substrate, a first passive device in the substrate, and a second passive device. The first passive device includes a first set of through substrate vias (TSVs) in the substrate. The second passive device is configured to wirelessly couple to the first passive device. In some implementations, the second passive device includes a second set of through substrate vias (TSVs) in the substrate. In some implementations, the second passive device is configured to inductively couple to the first passive device. In some implementations, the first passive device is a first inductor and the second passive device is a second inductor. In some implementations, the interposer further includes a first set of interconnects coupled to the first set of TSVs, and a second set of interconnects coupled to the second set of TSVs.

Abstract translation: 一些实施方案提供了一种插入器，其包括衬底，衬底中的第一无源器件和第二无源器件。 第一无源器件包括衬底中的第一组贯通衬底通孔（TSV）。 第二无源设备被配置为无线地耦合到第一无源设备。 在一些实施方案中，第二无源器件包括衬底中的第二组穿通衬底通孔（TSV）。 在一些实现中，第二无源设备被配置为感应地耦合到第一无源设备。 在一些实施方案中，第一无源器件是第一电感器，第二无源器件是第二电感器。 在一些实现中，插入器还包括耦合到第一组TSV的第一组互连以及耦合到第二组TSV的第二组互连。

公开(公告)号：US20150115405A1

公开(公告)日：2015-04-30

申请号：US14069201

申请日：2013-10-31

Applicant: QUALCOMM Incorporated

Inventor： Xiaoxia Wu ,  Yunqiang Yang ,  Chengjie Zuo ,  Durodami Joscelyn Lisk

IPC: H01L23/522 ,  H01L21/48 ,  H01L49/02

CPC classification number: H01L21/486 ,  H01L23/48 ,  H01L23/49816 ,  H01L23/5383 ,  H01L23/5384 ,  H01L23/645 ,  H01L24/13 ,  H01L24/16 ,  H01L25/0655 ,  H01L28/10 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2924/12042 ,  H01L2924/15174 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/157 ,  H01L2924/30107 ,  H01L2924/014 ,  H01L2924/00

Abstract: Some implementations provide an interposer that includes a substrate, a first passive device in the substrate, and a second passive device. The first passive device includes a first set of through substrate vias (TSVs) in the substrate. The second passive device is configured to wirelessly couple to the first passive device. In some implementations, the second passive device includes a second set of through substrate vias (TSVs) in the substrate. In some implementations, the second passive device is configured to inductively couple to the first passive device. In some implementations, the first passive device is a first inductor and the second passive device is a second inductor. In some implementations, the interposer further includes a first set of interconnects coupled to the first set of TSVs, and a second set of interconnects coupled to the second set of TSVs.

Abstract translation: 一些实施方案提供了一种插入器，其包括衬底，衬底中的第一无源器件和第二无源器件。 第一无源器件包括衬底中的第一组贯通衬底通孔（TSV）。 第二无源设备被配置为无线地耦合到第一无源设备。 在一些实施方案中，第二无源器件包括衬底中的第二组穿通衬底通孔（TSV）。 在一些实现中，第二无源设备被配置为感应地耦合到第一无源设备。 在一些实施方案中，第一无源器件是第一电感器，第二无源器件是第二电感器。 在一些实现中，插入器还包括耦合到第一组TSV的第一组互连以及耦合到第二组TSV的第二组互连。

公开(公告)号：US20140252561A1

公开(公告)日：2014-09-11

申请号：US13791223

申请日：2013-03-08

Applicant: QUALCOMM INCORPORATED

Inventor： Durodami Joscelyn Lisk ,  Vidhya Ramachandran ,  Jae Sik Lee

IPC: H01L23/538 ,  H01L25/00

Abstract: A via-enabled package-on-package circuit includes a first package including a first package die having a plurality of through substrate vias (TSVs). The TSVs are configured to carry the input/output signaling for at least one second package die.

Abstract translation: 通孔使能封装电路包括包括具有多个贯穿衬底通孔（TSV）的第一封装管芯的第一封装。 TSV被配置为承载用于至少一个第二封装管芯的输入/输出信号。

公开(公告)号：US20140225246A1

公开(公告)日：2014-08-14

申请号：US14133451

申请日：2013-12-18

Applicant: QUALCOMM INCORPORATED

Inventor： Brian Matthew Henderson ,  Durodami Joscelyn Lisk ,  Shiqun Gu ,  Ratibor Radojcic ,  Matthew Michael Nowak

IPC: H01L23/538 ,  H01L23/36

CPC classification number: H01L23/5384 ,  H01L21/50 ,  H01L23/3128 ,  H01L23/34 ,  H01L23/36 ,  H01L23/481 ,  H01L23/49811 ,  H01L23/5286 ,  H01L23/5383 ,  H01L23/5389 ,  H01L24/19 ,  H01L25/0657 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/17181 ,  H01L2224/73259 ,  H01L2224/92224 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06527 ,  H01L2225/06544 ,  H01L2225/06548 ,  H01L2225/06586 ,  H01L2225/06589 ,  H01L2924/15184 ,  H01L2924/15311

Abstract: Some implementations provide an integrated device that includes a first substrate, a first die coupled to the first substrate, a second die coupled to the first die, and a second substrate coupled to the second die. The second substrate is configured to provide an electrical path for a signal to the second die. The integrated device further includes a molding surrounding the first die and the second die, and several through mold vias (TMVs) coupled to the second substrate. The TMVs are configured to provide an electrical path for the signal to the second die through the second substrate. In some implementations, the second substrate includes a signal distribution structure configured to provide the electrical path for the signal to the second die. In some implementations, the first substrate and the second substrate are part of a signal distribution network that provides signal to the second die.

Abstract translation: 一些实施方案提供了集成器件，其包括第一衬底，耦合到第一衬底的第一裸片，耦合到第一裸片的第二裸片以及耦合到第二裸片的第二衬底。 第二基板被配置为提供用于到第二管芯的信号的电路径。 集成装置还包括围绕第一管芯和第二管芯的模制件以及耦合到第二衬底的多个通孔模具通孔（TMV）。 TMV被配置为提供通过第二基板的信号到第二管芯的电路径。 在一些实施方案中，第二衬底包括被配置为向第二裸片提供信号的电路的信号分配结构。 在一些实施方案中，第一衬底和第二衬底是向第二裸片提供信号的信号分配网络的一部分。