公开(公告)号：US09775236B2

公开(公告)日：2017-09-26

申请号：US14371387

申请日：2014-03-07

申请人： LG CHEM, LTD.

发明人： Sung-Hak Bae ,  Sang-Choll Han ,  Byong-Mook Kim

IPC分类号： H02K1/02 ,  H05K1/02 ,  H05K3/04 ,  H05B3/12 ,  H05B3/84 ,  H05K1/03 ,  H05K1/09 ,  H05K3/00 ,  H05K3/14 ,  H05K3/38 ,  G03F7/00

CPC分类号： H05K1/0296 ,  G03F7/00 ,  H05B3/12 ,  H05B3/84 ,  H05B2203/017 ,  H05K1/0274 ,  H05K1/0313 ,  H05K1/09 ,  H05K3/0023 ,  H05K3/0044 ,  H05K3/04 ,  H05K3/045 ,  H05K3/146 ,  H05K3/38 ,  H05K2201/0108 ,  H05K2201/0129 ,  H05K2201/0317 ,  H05K2201/09036 ,  H05K2203/0108

摘要： The present disclosure relates to a transparent substrate including: a resin pattern layer including a plurality of grooves respectively including side surfaces and a bottom surface; and, a conductive layer formed within the grooves, wherein a line width of the conductive layer is 0.1 μm to 3 μm and an average height of the conductive layer is 5% to 50% of a maximum depth of each of the grooves, and a manufacturing method thereof, such that simplicity in a manufacturing process and a consecutive process are enabled, manufacturing costs are inexpensive, and a transparent substrate having superior electrical conductivity and transparency characteristics is manufactured.

公开(公告)号：US20170273197A1

公开(公告)日：2017-09-21

申请号：US15614335

申请日：2017-06-05

申请人： TOPPAN PRINTING CO., LTD.

发明人： Takanori OHARA ,  Kyoichi YAMAMOTO ,  Kentaro KUBOTA ,  Kenji HAYASHI

IPC分类号： H05K3/46 ,  H05K1/09 ,  H05K3/10 ,  H05K1/16 ,  H05K3/38 ,  H05K3/22 ,  H05K3/20 ,  H05K3/24 ,  H05K3/12 ,  H05K3/32

CPC分类号： H05K1/028 ,  H05K1/0284 ,  H05K1/0386 ,  H05K1/092 ,  H05K1/095 ,  H05K1/16 ,  H05K3/0014 ,  H05K3/103 ,  H05K3/12 ,  H05K3/1275 ,  H05K3/207 ,  H05K3/22 ,  H05K3/245 ,  H05K3/32 ,  H05K3/38 ,  H05K3/4046 ,  H05K3/4664 ,  H05K2201/0293 ,  H05K2203/1545 ,  H05K2203/302

摘要： An ink layer of an electrically conductive ink is formed on a sheet-like base and then the base is bent-deformed before the ink layer is cured, followed by curing the ink layer, thereby forming wiring. The ink layer is pliable during the bending deformation of the base, preventing breakage of the ink layer associated with the bending deformation of the base, and preventing damage to the wiring even when the wiring is finely formed.

公开(公告)号：US09630701B2

公开(公告)日：2017-04-25

申请号：US14191873

申请日：2014-02-27

申请人： Goodrich Corporation

发明人： Jin Hu

IPC分类号： H05B1/00 ,  B64C1/18 ,  B64D13/00 ,  F24D13/02 ,  H05B3/16 ,  H05K3/38 ,  H05B3/26 ,  H05K3/12 ,  H05K1/16

CPC分类号： B64C1/18 ,  B64D13/00 ,  F24D13/024 ,  F24D2200/08 ,  F24D2220/2081 ,  H05B3/16 ,  H05B3/26 ,  H05B2203/003 ,  H05B2203/013 ,  H05B2203/017 ,  H05K1/167 ,  H05K3/1216 ,  H05K3/1283 ,  H05K3/38 ,  H05K2201/09263 ,  Y02B30/26 ,  Y10T29/49155 ,  Y10T29/49162

摘要： A method for providing an electrical connection for conductive ink includes direct writing a bus bar onto areas of a desired electrical connection of the conductive ink. The conductive ink is screen printed onto a dielectric film to create a conductive circuit. An aircraft heated floor panel includes at least one floor panel of an aircraft. The one floor panel includes a conductive circuit having a conductive ink including a bus bar directly written onto areas of a desired electrical connection of the conductive ink. The conductive ink is screen printed onto a dielectric film to create a conductive circuit.

公开(公告)号：US09623951B2

公开(公告)日：2017-04-18

申请号：US14179281

申请日：2014-02-12

申请人： Goodrich Corporation

发明人： Jin Hu ,  Richard R. Hamm ,  Kevin E. Roach

IPC分类号： B60L1/02 ,  B64C1/18 ,  B64D13/00 ,  F24D13/02 ,  H05B3/16 ,  H05K3/38 ,  H05B3/26 ,  H05K3/12 ,  H05K1/16

CPC分类号： B64C1/18 ,  B64D13/00 ,  F24D13/024 ,  F24D2200/08 ,  F24D2220/2081 ,  H05B3/16 ,  H05B3/26 ,  H05B2203/003 ,  H05B2203/013 ,  H05B2203/017 ,  H05K1/167 ,  H05K3/1216 ,  H05K3/1283 ,  H05K3/38 ,  H05K2201/09263 ,  Y02B30/26 ,  Y10T29/49155 ,  Y10T29/49162

摘要： A method of forming a heating element includes depositing a conductive ink of silver particles in an epoxy resin on a dielectric film to create a conductive circuit, and heat curing the conductive circuit to achieve a resistivity of the heating element less than 1.68×10−6 ohm·meter. An aircraft heated floor panel includes at least one floor panel of an aircraft includes a conductive circuit positioned within the floor panel having a conductive ink of silver particles in an epoxy resin on a dielectric film.

公开(公告)号：US09345134B2

公开(公告)日：2016-05-17

申请号：US14335700

申请日：2014-07-18

申请人： KABUSHIKI KAISHA TOSHIBA

发明人： Akihiko Happoya ,  Daigo Suzuki

IPC分类号： H05K9/00 ,  H05K1/02 ,  H05K3/10 ,  H05K3/38

CPC分类号： H05K1/0298 ,  H05K1/028 ,  H05K1/0281 ,  H05K3/0061 ,  H05K3/10 ,  H05K3/38 ,  H05K2201/09036 ,  H05K2201/2009 ,  Y10T29/49155

摘要： According to one embodiment, a printed wiring board includes a circuit board, a ground pattern provided on the circuit board, a wiring pattern provided on the circuit board, a conductive reinforcing plate covering the ground pattern and the wiring pattern and electrically connected with the ground pattern, and an insulating portion provided between the conductive reinforcing plate and the wiring pattern.

摘要翻译： 根据一个实施例，印刷电路板包括电路板，设置在电路板上的接地图案，设置在电路板上的布线图案，覆盖接地图案的导电加强板和布线图案，并与地面电连接 以及设置在导电性加强板和布线图案之间的绝缘部。

公开(公告)号：US09293384B2

公开(公告)日：2016-03-22

申请号：US13522218

申请日：2011-01-13

申请人： Yuusaku Ishimine ,  Masayuki Moriyama ,  Kenji Komatsubara

发明人： Yuusaku Ishimine ,  Masayuki Moriyama ,  Kenji Komatsubara

IPC分类号： H01L23/15 ,  H05K7/20 ,  H05K1/00 ,  B32B33/00 ,  H01L23/13 ,  H01L35/32 ,  C04B35/587 ,  C04B37/02 ,  H05K1/03 ,  H05K3/38

CPC分类号： H01L23/13 ,  C04B35/587 ,  C04B37/026 ,  C04B2235/3206 ,  C04B2235/3217 ,  C04B2235/3224 ,  C04B2235/3878 ,  C04B2235/3882 ,  C04B2235/5276 ,  C04B2235/5436 ,  C04B2235/5445 ,  C04B2235/604 ,  C04B2235/6581 ,  C04B2235/6582 ,  C04B2235/6587 ,  C04B2235/721 ,  C04B2235/723 ,  C04B2235/77 ,  C04B2235/786 ,  C04B2235/80 ,  C04B2235/945 ,  C04B2235/9607 ,  C04B2237/125 ,  C04B2237/368 ,  C04B2237/407 ,  C04B2237/74 ,  H01L23/15 ,  H01L23/3731 ,  H01L23/3735 ,  H01L35/32 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K3/38 ,  H05K2201/0248 ,  H05K2201/0266 ,  H05K2201/0269 ,  Y10T428/24413 ,  Y10T428/24421 ,  Y10T428/25 ,  Y10T428/259 ,  H01L2924/00

摘要： A silicon nitride substrate comprises a substrate comprising a silicon nitride sintered body, and a plurality of granular bodies containing silicon and integrated to a principal surface of the substrate, wherein a plurality of needle crystals or column crystals comprising mainly silicon nitride are extended from a portion of the granular bodies. A brazing material is applied to a principal surface of the substrate, and a circuit member and a heat radiation member are arranged on the applied brazing material, and bonded by heating. Because of a plurality of granular bodies integrated to the principal surface of the substrate, and a plurality of the needle crystals or the column crystals extended from a portion of the granular bodies, a high anchor effect is produced so that the circuit member and the heat radiation member are firmly bonded to the silicon nitride substrate.

摘要翻译： 氮化硅衬底包括含有氮化硅烧结体的衬底和多个含有硅的颗粒体并且与衬底的主表面集成在一起，其中主要包含氮化硅的多个针状晶体或柱状晶体从一部分 的颗粒体。 将钎焊材料施加到基板的主表面，并且将电路构件和散热构件布置在所施加的钎焊材料上，并通过加热粘合。 由于集成到基板的主面的多个粒状体以及从一部分粒状体延伸的多个针状晶体或柱状晶体，产生高的锚定效应，使得电路部件和热量 辐射构件牢固地结合到氮化硅衬底上。

公开(公告)号：US20160081189A1

公开(公告)日：2016-03-17

申请号：US14849960

申请日：2015-09-10

申请人： JSR Corporation

发明人： Sugirou SHIMODA ,  Kenzou OOKITA ,  Keisuke SATOU ,  Kazuto WATANABE

IPC分类号： H05K1/09 ,  H05K3/18 ,  C03C17/10 ,  H01B1/02

CPC分类号： C03C17/10 ,  C03C2217/253 ,  C03C2217/256 ,  C03C2217/27 ,  C03C2218/365 ,  G06F3/041 ,  G06F3/044 ,  G06F2203/04111 ,  H01B1/02 ,  H05K1/0306 ,  H05K1/0386 ,  H05K1/097 ,  H05K3/188 ,  H05K3/38 ,  H05K2203/1157 ,  H05K2203/125

摘要： A composition for forming a conductive film includes at least one of a metal salt (A1) and a metal particle (A2) as component (A) that serves as a metal source of the conductive film, and a metalloxane compound (B). The metal salt (A1) and the metal particle (A2) contain one or more metals selected from the group consisting of Ni, Pd, Pt, Cu, Ag, and Au. The metalloxane compound (B) has at least one metal atom selected from the group consisting of Ti, Zr, Sn, Si, and Al in its main chain. Preferably, the metal salt (A1) is a carboxylate containing a metal selected from the group consisting of Cu, Ag, and Ni. Preferably, the metal particle (A2) has an average particle diameter of 5 nm to 100 nm and comprises a metal selected from the group consisting of Cu, Ag, and Ni.

摘要翻译： 用于形成导电膜的组合物包括作为导电膜的金属源的组分（A）的金属盐（A1）和金属颗粒（A2）和金属氧化物化合物（B）中的至少一种。 金属盐（A1）和金属颗粒（A2）含有一种或多种选自Ni，Pd，Pt，Cu，Ag和Au的金属。 金属氧化物（B）在其主链中具有选自Ti，Zr，Sn，Si和Al中的至少一种金属原子。 优选地，金属盐（A1）是含有选自Cu，Ag和Ni的金属的羧酸盐。 优选地，金属颗粒（A2）的平均粒径为5nm至100nm，并且包含选自Cu，Ag和Ni的金属。

公开(公告)号：US09101065B2

公开(公告)日：2015-08-04

申请号：US14306887

申请日：2014-06-17

申请人： Kabushiki Kaisha Toshiba ,  Toshiba Materials Co., Ltd.

发明人： Hiromasa Kato

IPC分类号： B23K31/02 ,  H05K3/06 ,  H01L21/44 ,  B23K1/00 ,  H01L23/15 ,  H01L23/373 ,  H05K3/38 ,  H05K1/03

CPC分类号： H05K3/062 ,  B23K1/0016 ,  B23K2101/36 ,  C04B37/026 ,  C04B2235/658 ,  C04B2235/96 ,  C04B2235/9607 ,  C04B2237/125 ,  C04B2237/126 ,  C04B2237/127 ,  C04B2237/343 ,  C04B2237/366 ,  C04B2237/368 ,  C04B2237/706 ,  H01L21/44 ,  H01L23/15 ,  H01L23/3735 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K3/06 ,  H05K3/067 ,  H05K3/202 ,  H05K3/3484 ,  H05K3/38 ,  H05K2201/0355 ,  H05K2203/013 ,  H05K2203/0392 ,  H05K2203/0465 ,  H05K2203/0545 ,  H05K2203/125 ,  H05K2203/167 ,  Y10T29/49156 ,  H01L2924/00

摘要： According to one embodiment, a ceramic circuit board includes a ceramic substrate, a copper circuit plate and a brazing material protrudent part. The copper circuit plate is bonded to at least one surface of the ceramic substrate through a brazing material layer including Ag, Cu, and Ti. The brazing material protrudent part includes a Ti phase and a TiN phase by 3% by mass or more in total, which is different from the total amount of a Ti phase and a TiN phase in the brazing material layer that is interposed between the ceramic substrate and the copper circuit plate. The number of voids each having an area of 200 μm2 or less in the brazing material protrudent part is one or less (including zero).

摘要翻译： 根据一个实施例，陶瓷电路板包括陶瓷基板，铜电路板和钎焊材料突出部分。 铜电路板通过包括Ag，Cu和Ti的钎料层结合到陶瓷基板的至少一个表面上。 钎焊材料突出部分包括Ti相和总共3质量％以上的TiN相，其与介于陶瓷基板之间的钎焊材料层中的Ti相和TiN相的总量不同 和铜电路板。 钎焊材料凸部的面积为200μm2以下的空隙数为1个以下（包括零）。

公开(公告)号：US20150195911A1

公开(公告)日：2015-07-09

申请号：US14661635

申请日：2015-03-18

申请人： FUJITSU COMPONENT LIMITED

发明人： Shinya YAMAMOTO

IPC分类号： H05K1/11 ,  H05K1/09

CPC分类号： H05K1/113 ,  H05K1/09 ,  H05K1/116 ,  H05K3/3436 ,  H05K3/3452 ,  H05K3/38 ,  H05K3/4007 ,  H05K3/42 ,  H05K2201/099 ,  Y10T29/49155

摘要： A printed circuit board includes: a substrate; a land that is disposed on a surface of the substrate, and includes a central portion and a plurality of extended portions, the central portion having the same shape and the same size as a land of a surface mount device, and the extended portions being up-and-down symmetry and right-and-left symmetry with respect to a straight line which passes through the center of the central portion; gaps that are disposed on the surface of the substrate, each of the gaps being disposed on a periphery of the central portion and between the extended portions; and a resist that is disposed on the surface of the substrate, and has an opening portion formed at a position corresponding to the central portion and the gaps.

摘要翻译： 印刷电路板包括：基板; 设置在所述基板的表面上并且包括中心部分和多个延伸部分的区域，所述中心部分具有与表面安装装置的平台相同的形状和尺寸相同的尺寸，并且所述延伸部分向上 相对于穿过中心部分的中心的直线对称和右对称; 设置在基板的表面上的间隙，每个间隙设置在中心部分的周边和延伸部分之间; 以及设置在基板的表面上的抗蚀剂，并且具有形成在与中心部分和间隙相对应的位置处的开口部分。

公开(公告)号：US20150062851A1

公开(公告)日：2015-03-05

申请号：US14469782

申请日：2014-08-27

申请人： SHINKO ELECTRIC INDUSTRIES CO., LTD.

发明人： Noriyoshi SHIMIZU ,  Wataru KANEDA ,  Hiromu ARISAKA ,  Akio ROKUGAWA

IPC分类号： H05K1/11 ,  H05K1/09 ,  H05K1/18 ,  H05K1/02

CPC分类号： H05K3/421 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/15311 ,  H05K1/115 ,  H05K1/116 ,  H05K3/38 ,  H05K3/4644 ,  H05K2201/0338 ,  H05K2201/0352 ,  H05K2201/09381 ,  H05K2201/09481 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2201/0979 ,  H05K2201/09827 ,  H05K2201/09854 ,  H05K2201/2072 ,  H05K2203/0789 ,  H01L2924/00

摘要： A wiring board includes a first insulating layer coating a first wiring layer. A first through hole is opened in a surface of the first insulating layer and exposes a surface of the first wiring layer. A first via arranged in the first through hole includes an end surface exposed to the surface of the first insulating layer. A gap is formed between the first insulating layer and the first via in the first through hole. A second wiring layer is stacked on the surface of the first insulating layer and the end surface of the first via. The second wiring layer includes a pad filling the gap. The pad is greater in planar shape than the first through hole.

摘要翻译： 布线板包括涂覆第一布线层的第一绝缘层。 第一通孔在第一绝缘层的表面上开放，并露出第一布线层的表面。 布置在第一通孔中的第一通孔包括暴露于第一绝缘层的表面的端表面。 在第一通孔中的第一绝缘层和第一通孔之间形成间隙。 在第一绝缘层的表面和第一通孔的端面上堆叠第二布线层。 第二布线层包括填充间隙的垫。 该垫的平面形状大于第一通孔。