公开(公告)号：US11745281B2

公开(公告)日：2023-09-05

申请号：US17307253

申请日：2021-05-04

申请人： Micron Technology, Inc.

发明人： Mark E. Tuttle

IPC分类号： B23K1/00 ,  B23K1/018 ,  H01L23/00 ,  H01L21/66 ,  B23K3/02 ,  B23K3/03 ,  B23K3/08 ,  B23K101/40 ,  B23K101/42

CPC分类号： B23K1/018 ,  B23K1/0016 ,  B23K3/029 ,  B23K3/03 ,  B23K3/08 ,  H01L22/32 ,  H01L24/799 ,  H01L24/98 ,  B23K2101/40 ,  B23K2101/42 ,  H01L24/13 ,  H01L2224/13101 ,  H01L2224/7999 ,  H01L2224/98 ,  H01L2224/13101 ,  H01L2924/014 ,  H01L2924/00014

摘要： A solder removal apparatus is provided. The solder removal apparatus comprises a plurality of solder-interfacing protrusions extending from a body by a length. Each of the plurality of solder-interfacing protrusions is configured to remove a corresponding one of a plurality of solder features from a semiconductor device, where each of the plurality of solder features has a height and an amount of solder material.

公开(公告)号：US09875918B2

公开(公告)日：2018-01-23

申请号：US14788783

申请日：2015-06-30

申请人： Samsung Electronics Co., Ltd.

发明人： Kyu-Dong Jung ,  Jung-Hwan Kim ,  Dong-Gil Lee ,  Tae-Je Cho ,  Kwang-Chul Choi

IPC分类号： B32B43/00 ,  H01L21/67 ,  B32B38/10 ,  B32B41/00

CPC分类号： H01L21/67115 ,  B32B38/10 ,  B32B41/00 ,  B32B43/006 ,  B32B2250/02 ,  B32B2310/0843 ,  B32B2457/14 ,  H01L21/67092 ,  H01L21/67253 ,  H01L2221/68381 ,  H01L2224/98 ,  Y10T156/1158 ,  Y10T156/1917

摘要： Provided are an initiator and a method for debonding a wafer supporting system. The initiator for debonding a wafer supporting system includes a rotation chuck having an upper surface on which a wafer supporting system (WSS), which includes a carrier wafer, a device wafer, and a glue layer for bonding the carrier wafer and the device wafer to each other, is seated to rotate the wafer supporting system, a detecting module detecting a height and a thickness of the glue layer and a laser module generating a fracture portion on the glue layer through irradiating a side surface of the glue layer with a laser on the basis of the height and the thickness of the glue layer.

公开(公告)号：US09711480B2

公开(公告)日：2017-07-18

申请号：US14600691

申请日：2015-01-20

申请人： Global Circuit Innovations Incorporated

发明人： Erick Merle Spory

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L23/00 ,  H01L21/48 ,  H01L23/047 ,  H01L23/057 ,  H01L23/495 ,  H01L23/498 ,  H01L23/04 ,  H01L23/10

CPC分类号： H01L24/49 ,  H01L21/4803 ,  H01L21/52 ,  H01L23/04 ,  H01L23/047 ,  H01L23/057 ,  H01L23/10 ,  H01L23/49551 ,  H01L23/49816 ,  H01L23/49838 ,  H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L24/45 ,  H01L24/48 ,  H01L24/85 ,  H01L24/98 ,  H01L2224/02311 ,  H01L2224/02317 ,  H01L2224/02331 ,  H01L2224/02375 ,  H01L2224/02377 ,  H01L2224/03312 ,  H01L2224/03332 ,  H01L2224/03334 ,  H01L2224/03901 ,  H01L2224/04042 ,  H01L2224/0508 ,  H01L2224/05144 ,  H01L2224/05548 ,  H01L2224/05582 ,  H01L2224/05583 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/06051 ,  H01L2224/06102 ,  H01L2224/2919 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48463 ,  H01L2224/73265 ,  H01L2224/741 ,  H01L2224/83192 ,  H01L2224/85207 ,  H01L2224/98 ,  H01L2924/00014 ,  H01L2924/15153 ,  H01L2924/16152 ,  H01L2224/48 ,  H01L2224/45015 ,  H01L2924/207

摘要： A packaged integrated circuit for operating reliably at elevated temperatures is provided. The packaged integrated circuit includes a modified extracted die, which includes one or more extended bond pads, a package comprising a base and a lid, and a plurality of new bond wires. The modified extracted die is placed into a cavity of the base. After the modified extracted die is placed into the cavity, the plurality of new bond wires are bonded between the one or more extended bond pads of the modified extracted die and package leads of the package base or downbonds. After bonding the plurality of new bond wires, the lid is sealed to the base.

公开(公告)号：US20170173934A1

公开(公告)日：2017-06-22

申请号：US15453456

申请日：2017-03-08

申请人： Applied Materials, Inc.

发明人： Kadthala Ramaya NARENDRNATH ,  Gangadhar SHEELAVANT ,  Monika AGARWAL ,  Ashish BHATNAGAR

IPC分类号： B32B37/12 ,  H01L21/687 ,  B32B7/14 ,  H01L21/683

CPC分类号： B32B37/1292 ,  B32B7/14 ,  H01L21/67005 ,  H01L21/67092 ,  H01L21/67109 ,  H01L21/6831 ,  H01L21/6833 ,  H01L21/6835 ,  H01L21/68785 ,  H01L2221/68318 ,  H01L2221/68381 ,  H01L2224/27318 ,  H01L2224/2732 ,  H01L2224/27436 ,  H01L2224/27438 ,  H01L2224/29011 ,  H01L2224/29012 ,  H01L2224/29013 ,  H01L2224/29014 ,  H01L2224/29078 ,  H01L2224/2919 ,  H01L2224/29191 ,  H01L2224/83862 ,  H01L2224/83877 ,  H01L2224/98 ,  H01L2924/15151 ,  Y10T156/10 ,  Y10T279/23 ,  Y10T428/24851 ,  H01L2924/00012 ,  H01L2924/00014

摘要： Methods for fabricating and refurbishing an assembly are disclosed herein. The method begins by applying an adhesive layer onto a first substrate. A second substrate is placed onto the adhesive layer, thereby securing the two substrates together, the adhesive layer bounding at least one side of a channel that extends laterally between the substrates to an exterior of the assembly. And, the substrates and the adhesive layer are subjected to a bonding procedure and allowing outgassing of volatiles from the adhesive layer to escape from between the substrates through the channel, wherein the substrates bonded by the adhesive layer form a component for a semiconductor vacuum processing chamber.

公开(公告)号：US20160093518A1

公开(公告)日：2016-03-31

申请号：US14788783

申请日：2015-06-30

申请人： Samsung Electronics Co., Ltd.

发明人： Kyu-Dong JUNG ,  Jung-Hwan KIM ,  Dong-Gil LEE ,  Tae-Je CHO ,  Kwang-Chul CHOI

IPC分类号： H01L21/67 ,  B32B43/00

CPC分类号： H01L21/67115 ,  B32B38/10 ,  B32B41/00 ,  B32B43/006 ,  B32B2250/02 ,  B32B2310/0843 ,  B32B2457/14 ,  H01L21/67092 ,  H01L21/67253 ,  H01L2221/68381 ,  H01L2224/98 ,  Y10T156/1158 ,  Y10T156/1917

摘要： Provided are an initiator and a method for debonding a wafer supporting system. The initiator for debonding a wafer supporting system includes a rotation chuck having an upper surface on which a wafer supporting system (WSS), which includes a carrier wafer, a device wafer, and a glue layer for bonding the carrier wafer and the device wafer to each other, is seated to rotate the wafer supporting system, a detecting module detecting a height and a thickness of the glue layer and a laser module generating a fracture portion on the glue layer through irradiating a side surface of the glue layer with a laser on the basis of the height and the thickness of the glue layer.

摘要翻译： 提供了一种用于剥离晶片支撑系统的引发剂和方法。 用于剥离晶片支撑系统的启动器包括具有上表面的旋转卡盘，其上包括载体晶片的晶片支撑系统（WSS），器件晶片和用于将载体晶片和器件晶片接合的胶层 彼此坐下来旋转晶片支撑系统，检测模块检测胶层的高度和厚度;以及激光模块，其通过用激光照射胶层的侧表面而在胶层上产生断裂部分 胶层的高度和厚度的基础。

公开(公告)号：US09070662B2

公开(公告)日：2015-06-30

申请号：US12716197

申请日：2010-03-02

申请人： Mihalis Michael ,  Ilija Jergovic

发明人： Mihalis Michael ,  Ilija Jergovic

IPC分类号： H01L23/367 ,  H01L23/42 ,  H01L23/31 ,  H01L23/00

CPC分类号： H01L23/3675 ,  H01L21/56 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/367 ,  H01L23/3672 ,  H01L23/42 ,  H01L24/13 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/75 ,  H01L24/83 ,  H01L24/92 ,  H01L24/97 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/2731 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2224/75745 ,  H01L2224/81191 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83193 ,  H01L2224/838 ,  H01L2224/83855 ,  H01L2224/83862 ,  H01L2224/83874 ,  H01L2224/92242 ,  H01L2224/97 ,  H01L2224/98 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/1426 ,  H01L2924/181 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/014 ,  H01L2924/00 ,  H01L2224/0401

摘要： A semiconductor package can include a semiconductor die having an integrated circuit, a first die surface, and an opposite second die surface. A packaging can be attached to the die and have a holder surface opposite the first die surface. A heat spreader can be configured to cover the second die surface and the packaging surface and can be attached thereto by a layer of adhesive positioned between the heat spreader and the semiconductor die. A semiconductor package array can include an array of semiconductor dies and a heat spreader configured to cover each semiconductor die. A conductive lead can be electrically connected to the integrated circuit in a semiconductor die and can extend from the first die surface. Manufacturing a semiconductor package can include applying thermally conductive adhesive to the heat spreader and placing the heat spreader proximate the semiconductor die.

摘要翻译： 半导体封装可以包括具有集成电路的半导体管芯，第一管芯表面和相对的第二管芯表面。 包装可以附接到模具并且具有与第一模具表面相对的保持器表面。 散热器可以被配置为覆盖第二模具表面和包装表面，并且可以通过位于散热器和半导体管芯之间的粘合剂层附接到散热器。 半导体封装阵列可以包括半导体管芯阵列和配置成覆盖每个半导体管芯的散热器。 导电引线可以与半导体管芯中的集成电路电连接并且可以从第一管芯表面延伸。 制造半导体封装可以包括将热传导粘合剂施加到散热器并将散热器放置在半导体管芯附近。

公开(公告)号：US20060202001A1

公开(公告)日：2006-09-14

申请号：US10906824

申请日：2005-03-08

申请人： Raymond Birchall ,  Brian Chapman ,  Wai Ma ,  James Petrone ,  Nandakumar Ranadive

发明人： Raymond Birchall ,  Brian Chapman ,  Wai Ma ,  James Petrone ,  Nandakumar Ranadive

IPC分类号： H02H7/00 ,  B23K1/018 ,  H05K7/06

CPC分类号： H05K3/3494 ,  B23K1/012 ,  B23K2101/36 ,  H01L2224/98 ,  H05K1/112 ,  H05K2203/081 ,  H05K2203/1581 ,  H05K2203/176

摘要： A method and system for heating a circuit board component to an approximately uniform temperature sufficient to reflow the connections between the circuit board component and the circuit board. The method and system include a supplemental gas heater having a diffuser plate. The circuit board is placed against the diffuser plate and heated gas is channeled through openings in the diffuser plate into vias in the circuit board to heat a circuit board component connected on the opposite side of the circuit board. Heated gas can be channeled through selected vias towards predetermined areas and/or specified connections such as towards those areas or connections where there is a temperature differential greater than approximately 10 degrees Celsius compared to other areas or connections across the circuit board component. Hot gas can be channeled through selected vias by baffling or patterning the diffuser plate, accordingly.

摘要翻译： 一种用于将电路板部件加热到大致均匀的温度以足以回流电路板部件和电路板之间的连接的方法和系统。 该方法和系统包括具有扩散板的补充气体加热器。 将电路板放置在扩散板上，将加热的气体通过扩散板中的开口引导到电路板中的通孔中，以加热连接在电路板相对侧的电路板部件。 与电路板部件上的其他区域或连接相比，加热气体可以通过选定的通孔被引导到预定区域和/或指定的连接，例如朝向与大于约10摄氏度的温度差的那些区域或连接。 因此，热气体可以通过选择的通孔引导通过挡板或图案化扩散板。

公开(公告)号：US4270260A

公开(公告)日：1981-06-02

申请号：US949763

申请日：1978-10-10

申请人： Ellison F. Krueger

发明人： Ellison F. Krueger

IPC分类号： H01L21/60 ,  H05K3/34 ,  H05K13/04 ,  B23Q17/00

CPC分类号： H01L24/81 ,  H01L24/75 ,  H05K13/0486 ,  H01L2224/75 ,  H01L2224/7999 ,  H01L2224/81801 ,  H01L2224/98 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/0105 ,  H01L2924/01077 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K3/3494 ,  Y10T29/49757

摘要： Components such as IC's mounted on a substrate such as a PCB are removed from the PCB in a heating apparatus. The heating apparatus has a mounting frame which positions the PCB above an array of infra red heating sources. The method includes the steps of bombarding the PCB with infra red energy which is absorbed and conducted to the solder joints to melt the solder to permit extraction of the components.

摘要翻译： 诸如PCB等基板上的IC等部件在加热装置中被从PCB中除去。 加热装置具有将PCB定位在红外加热源阵列上方的安装框架。 该方法包括以红外能量轰击PCB的步骤，其被吸收并传导到焊点以熔化焊料以允许提取部件。

公开(公告)号：US20240347367A1

公开(公告)日：2024-10-17

申请号：US18294754

申请日：2021-08-09

申请人： X-Celeprint Limited ,  LEONHARD KURZ Stiftung & Co. KG

发明人： Ronald S. Cok ,  António José Marques Trindade ,  MIchael Scharfenberg ,  Christian Schulz ,  Gabriele Roithmeier

IPC分类号： H01L21/683 ,  H01L23/00

CPC分类号： H01L21/6835 ,  H01L24/27 ,  H01L24/83 ,  H01L24/98 ,  H01L2224/27515 ,  H01L2224/27848 ,  H01L2224/8312 ,  H01L2224/98 ,  H01L2924/15156

摘要： A module collection and deposition system comprises a container, a module source wafer comprising modules released from the module source wafer, a module collection device operable to remove the modules from the module source wafer and dispose the modules as a disordered and dry collection into the container, and a module deposition device for removing the modules from the container and randomly disposing the modules on a receiving surface. Each module comprises an electronically active unpackaged component.

公开(公告)号：US20240213214A1

公开(公告)日：2024-06-27

申请号：US18145462

申请日：2022-12-22

申请人： The Boeing Company

发明人： Peter D. Brewer ,  Chia-Ming Chang ,  Sevag Terterian ,  Charbel Abijaoude ,  Diego Eduardo Carrasco

IPC分类号： H01L23/00

CPC分类号： H01L24/98 ,  H01L24/799 ,  B23K20/026 ,  H01L2224/98

摘要： A method for debonding a bonded part includes attaching a handle to a third side of a first substrate of the bonded part with an adhesive layer. The bonded part has a plurality of inter-substrate bond structures that couple a first side of the first substrate to a second side of a second substrate. The third side of the first substrate is opposite the first side. The first substrate and the second substrate have different thicknesses. The method includes absorbing a solvent into the adhesive layer, swelling the adhesive layer in response to the absorbing of the solvent, bending the first substrate in response to the swelling, and breaking a plurality of thermocompression bonds between the plurality of inter-substrate bond structures and the second side of the second substrate in response to the bending to debond the first substrate.