公开(公告)号：US20140099485A1

公开(公告)日：2014-04-10

申请号：US14015650

申请日：2013-08-30

Applicant: APPLIED MATERIALS, INC.

Inventor： Kadthala Ramaya NARENDRNATH ,  Gangadhar SHEELAVANT ,  Monika AGARWAL ,  Ashish BHATNAGAR

IPC: H01L21/67 ,  H01L21/683 ,  B32B7/14

CPC classification number: B32B37/1292 ,  B32B7/14 ,  H01L21/67005 ,  H01L21/67092 ,  H01L21/67109 ,  H01L21/6831 ,  H01L21/6833 ,  H01L21/6835 ,  H01L21/68785 ,  H01L2221/68318 ,  H01L2221/68381 ,  H01L2224/27318 ,  H01L2224/2732 ,  H01L2224/27436 ,  H01L2224/27438 ,  H01L2224/29011 ,  H01L2224/29012 ,  H01L2224/29013 ,  H01L2224/29014 ,  H01L2224/29078 ,  H01L2224/2919 ,  H01L2224/29191 ,  H01L2224/83862 ,  H01L2224/83877 ,  H01L2224/98 ,  H01L2924/15151 ,  Y10T156/10 ,  Y10T279/23 ,  Y10T428/24851 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: Methods for bonding substrates, forming assemblies using the same, along with improved methods for refurbishing said assemblies are disclosed that take advantage of at least one channel formed in an adhesive utilized to join two substrates to improve fabrication, performance and refurbishment of the assemblies. In one embodiment an assembly includes a first substrate secured to a second substrate by an adhesive layer. The assembly includes a channel having at least one side bounded by the adhesive layer and having an outlet exposed to an exterior of the assembly.

Abstract translation: 公开了使用其组合基板的成型组件以及用于翻新所述组件的改进方法的方法，其利用形成在用于连接两个基板的粘合剂中的至少一个通道，以改善组件的制造，性能和翻新。 在一个实施例中，组件包括通过粘合剂层固定到第二衬底的第一衬底。 组件包括通道，其具有由粘合剂层限定的至少一个侧面并具有暴露于组件的外部的出口。

公开(公告)号：US20170173934A1

公开(公告)日：2017-06-22

申请号：US15453456

申请日：2017-03-08

Applicant: Applied Materials, Inc.

Inventor： Kadthala Ramaya NARENDRNATH ,  Gangadhar SHEELAVANT ,  Monika AGARWAL ,  Ashish BHATNAGAR

IPC: B32B37/12 ,  H01L21/687 ,  B32B7/14 ,  H01L21/683

CPC classification number: B32B37/1292 ,  B32B7/14 ,  H01L21/67005 ,  H01L21/67092 ,  H01L21/67109 ,  H01L21/6831 ,  H01L21/6833 ,  H01L21/6835 ,  H01L21/68785 ,  H01L2221/68318 ,  H01L2221/68381 ,  H01L2224/27318 ,  H01L2224/2732 ,  H01L2224/27436 ,  H01L2224/27438 ,  H01L2224/29011 ,  H01L2224/29012 ,  H01L2224/29013 ,  H01L2224/29014 ,  H01L2224/29078 ,  H01L2224/2919 ,  H01L2224/29191 ,  H01L2224/83862 ,  H01L2224/83877 ,  H01L2224/98 ,  H01L2924/15151 ,  Y10T156/10 ,  Y10T279/23 ,  Y10T428/24851 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: Methods for fabricating and refurbishing an assembly are disclosed herein. The method begins by applying an adhesive layer onto a first substrate. A second substrate is placed onto the adhesive layer, thereby securing the two substrates together, the adhesive layer bounding at least one side of a channel that extends laterally between the substrates to an exterior of the assembly. And, the substrates and the adhesive layer are subjected to a bonding procedure and allowing outgassing of volatiles from the adhesive layer to escape from between the substrates through the channel, wherein the substrates bonded by the adhesive layer form a component for a semiconductor vacuum processing chamber.

公开(公告)号：US20200161165A1

公开(公告)日：2020-05-21

申请号：US16752127

申请日：2020-01-24

Applicant: Applied Materials, Inc.

Inventor： Govinda RAJ ,  Kadthala Ramaya NARENDRNATH ,  Bopanna Ichettira VASANTHA ,  Simon YAVELBERG

IPC: H01L21/687 ,  C23C16/458 ,  H01L21/67

Abstract: An edge ring and process for fabricating an edge ring are disclosed herein. In one embodiment, an edge ring includes an annular body and a plurality of thermal breaks disposed within the annular body. The thermal breaks are disposed perpendicular to a center line of the annular body of the edge ring.