公开(公告)号：US20140099485A1

公开(公告)日：2014-04-10

申请号：US14015650

申请日：2013-08-30

Applicant: APPLIED MATERIALS, INC.

Inventor： Kadthala Ramaya NARENDRNATH ,  Gangadhar SHEELAVANT ,  Monika AGARWAL ,  Ashish BHATNAGAR

IPC: H01L21/67 ,  H01L21/683 ,  B32B7/14

CPC classification number: B32B37/1292 ,  B32B7/14 ,  H01L21/67005 ,  H01L21/67092 ,  H01L21/67109 ,  H01L21/6831 ,  H01L21/6833 ,  H01L21/6835 ,  H01L21/68785 ,  H01L2221/68318 ,  H01L2221/68381 ,  H01L2224/27318 ,  H01L2224/2732 ,  H01L2224/27436 ,  H01L2224/27438 ,  H01L2224/29011 ,  H01L2224/29012 ,  H01L2224/29013 ,  H01L2224/29014 ,  H01L2224/29078 ,  H01L2224/2919 ,  H01L2224/29191 ,  H01L2224/83862 ,  H01L2224/83877 ,  H01L2224/98 ,  H01L2924/15151 ,  Y10T156/10 ,  Y10T279/23 ,  Y10T428/24851 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: Methods for bonding substrates, forming assemblies using the same, along with improved methods for refurbishing said assemblies are disclosed that take advantage of at least one channel formed in an adhesive utilized to join two substrates to improve fabrication, performance and refurbishment of the assemblies. In one embodiment an assembly includes a first substrate secured to a second substrate by an adhesive layer. The assembly includes a channel having at least one side bounded by the adhesive layer and having an outlet exposed to an exterior of the assembly.

Abstract translation: 公开了使用其组合基板的成型组件以及用于翻新所述组件的改进方法的方法，其利用形成在用于连接两个基板的粘合剂中的至少一个通道，以改善组件的制造，性能和翻新。 在一个实施例中，组件包括通过粘合剂层固定到第二衬底的第一衬底。 组件包括通道，其具有由粘合剂层限定的至少一个侧面并具有暴露于组件的外部的出口。

公开(公告)号：US20170173934A1

公开(公告)日：2017-06-22

申请号：US15453456

申请日：2017-03-08

Applicant: Applied Materials, Inc.

Inventor： Kadthala Ramaya NARENDRNATH ,  Gangadhar SHEELAVANT ,  Monika AGARWAL ,  Ashish BHATNAGAR

IPC: B32B37/12 ,  H01L21/687 ,  B32B7/14 ,  H01L21/683

CPC classification number: B32B37/1292 ,  B32B7/14 ,  H01L21/67005 ,  H01L21/67092 ,  H01L21/67109 ,  H01L21/6831 ,  H01L21/6833 ,  H01L21/6835 ,  H01L21/68785 ,  H01L2221/68318 ,  H01L2221/68381 ,  H01L2224/27318 ,  H01L2224/2732 ,  H01L2224/27436 ,  H01L2224/27438 ,  H01L2224/29011 ,  H01L2224/29012 ,  H01L2224/29013 ,  H01L2224/29014 ,  H01L2224/29078 ,  H01L2224/2919 ,  H01L2224/29191 ,  H01L2224/83862 ,  H01L2224/83877 ,  H01L2224/98 ,  H01L2924/15151 ,  Y10T156/10 ,  Y10T279/23 ,  Y10T428/24851 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: Methods for fabricating and refurbishing an assembly are disclosed herein. The method begins by applying an adhesive layer onto a first substrate. A second substrate is placed onto the adhesive layer, thereby securing the two substrates together, the adhesive layer bounding at least one side of a channel that extends laterally between the substrates to an exterior of the assembly. And, the substrates and the adhesive layer are subjected to a bonding procedure and allowing outgassing of volatiles from the adhesive layer to escape from between the substrates through the channel, wherein the substrates bonded by the adhesive layer form a component for a semiconductor vacuum processing chamber.

公开(公告)号：US20160107117A1

公开(公告)日：2016-04-21

申请号：US14877753

申请日：2015-10-07

Applicant: APPLIED MATERIALS, INC.

Inventor： Govinda RAJ ,  Monika AGARWAL ,  Hamid MOHIUDDIN ,  Kadthala R. NARENDRNATH

IPC: B01D53/32 ,  B01D53/68 ,  H01J37/32

CPC classification number: B01D53/32 ,  B01D53/68 ,  B01D2257/2025 ,  B01D2257/2027 ,  B01D2257/2045 ,  B01D2257/2047 ,  B01D2258/0216 ,  B01D2259/818 ,  H01J37/32082 ,  H01J37/321 ,  H01J37/3244 ,  H01J37/32477 ,  H01J37/32844 ,  Y02C20/30

Abstract: Embodiments disclosed herein include a plasma source, and an abatement system for abating compounds produced in semiconductor processes. In one embodiment, a plasma source is disclosed. The plasma source includes a body having an inlet and an outlet, and the inlet and the outlet are fluidly coupled within the body. The body further includes inside surfaces, and the inside surfaces are coated with yttrium oxide or diamond-like carbon. The plasma source further includes a flow splitter disposed in the body in a position that formed two flow paths between the inlet and the outlet, and a plasma generator disposed in a position operable to form a plasma within the body between the flow splitter and inside surfaces of the body.

Abstract translation: 本文公开的实施方案包括等离子体源和用于减轻在半导体工艺中产生的化合物的减排系统。 在一个实施例中，公开了一种等离子体源。 等离子体源包括具有入口和出口的本体，并且入口和出口在体内流体耦合。 身体还包括内表面，并且内表面涂覆有氧化钇或类金刚石碳。 等离子体源还包括设置在主体中的分流器，其形成在入口和出口之间的两个流动路径的位置，以及等离子体发生器，其布置在可操作的位置中，以在主体内在分流器和内表面之间形成等离子体 的身体。