公开(公告)号：US20230377929A1

公开(公告)日：2023-11-23

申请号：US17663858

申请日：2022-05-18

申请人： The Boeing Company

发明人： Peter D. Brewer ,  Sevag Terterian ,  Diego Eduardo Carrasco ,  Charbel Abijaoude

IPC分类号： H01L21/68 ,  H01L21/48

CPC分类号： H01L21/681 ,  H01L21/486

摘要： A method to align targets on opposite sides of a substrate includes forming a first via pattern in a protective layer on a first side of the substrate. The substrate includes a second side opposite the first side. The first via pattern is a first pixelated version of a first alignment target. The first alignment target is optically recognizable by an automated alignment system. The method includes etching a plurality of first vias through the substrate to the second side in the first via pattern. The first via pattern is optically recognizable by the automated alignment system as the first alignment target on both the first side and the second side of the substrate.

公开(公告)号：US20240125817A1

公开(公告)日：2024-04-18

申请号：US18047155

申请日：2022-10-17

申请人： The Boeing Company

发明人： Peter D. Brewer ,  Chia-Ming Chang ,  Sevag Terterian ,  Charbel Abijaoude ,  Diego Eduardo Carrasco

IPC分类号： G01R1/073 ,  G01B7/00 ,  G01B21/22

CPC分类号： G01R1/07307 ,  G01B7/003 ,  G01B21/22

摘要： A probing system includes a device-under-test, a probe device, and a die bonder. The device-under-test includes test patterns. The probe device includes tilt angle sensors. The tilt angle sensors include spikes that protrude from the probe device. The die bonder is operational to mount the device-under-test, mount the probe device facing the device-under-test, compress the probe device and the device-under-test together to causes a subset of the spikes to contact the test patterns, measure a number of connections formed between the tilt angle sensors and the test patterns, determine a first offset angle and a second offset angle between the device-under-test and the probe device based on the number of connections, adjust the spherical positioner in one or more rotational axes in response to the first offset angle and the second offset angle to change a parallelism between the device-under-test and the probe device.

公开(公告)号：US20240213214A1

公开(公告)日：2024-06-27

申请号：US18145462

申请日：2022-12-22

申请人： The Boeing Company

发明人： Peter D. Brewer ,  Chia-Ming Chang ,  Sevag Terterian ,  Charbel Abijaoude ,  Diego Eduardo Carrasco

IPC分类号： H01L23/00

CPC分类号： H01L24/98 ,  H01L24/799 ,  B23K20/026 ,  H01L2224/98

摘要： A method for debonding a bonded part includes attaching a handle to a third side of a first substrate of the bonded part with an adhesive layer. The bonded part has a plurality of inter-substrate bond structures that couple a first side of the first substrate to a second side of a second substrate. The third side of the first substrate is opposite the first side. The first substrate and the second substrate have different thicknesses. The method includes absorbing a solvent into the adhesive layer, swelling the adhesive layer in response to the absorbing of the solvent, bending the first substrate in response to the swelling, and breaking a plurality of thermocompression bonds between the plurality of inter-substrate bond structures and the second side of the second substrate in response to the bending to debond the first substrate.

公开(公告)号：US20230378126A1

公开(公告)日：2023-11-23

申请号：US17663857

申请日：2022-05-18

申请人： The Boeing Company

发明人： Peter D. Brewer ,  John J. Vajo ,  Sevag Terterian ,  Chia-Ming Chang ,  Charbel Abijaoude ,  Diego Eduardo Carrasco

IPC分类号： H01L23/00

CPC分类号： H01L24/98 ,  H01L24/05 ,  H01L24/08 ,  H01L24/80 ,  H01L2224/0508 ,  H01L2224/05164 ,  H01L2224/05166 ,  H01L2224/05172 ,  H01L2224/05179 ,  H01L2224/05181 ,  H01L2224/0517 ,  H01L2224/05123 ,  H01L2224/05101 ,  H01L2224/05117 ,  H01L2224/05138 ,  H01L2224/05565 ,  H01L2224/08145 ,  H01L2224/8012 ,  H01L2224/80203 ,  H01L2924/01046 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01041 ,  H01L2924/01073 ,  H01L2924/01057 ,  H01L2924/01039 ,  H01L2924/0104 ,  H01L2924/01021 ,  H01L2924/01003 ,  H01L2924/01011 ,  H01L2924/01012

摘要： An inter-substrate bond structure includes an adhesion layer that attached to a first substrate, and an outer gas-permeable layer coupled to the adhesion layer. The outer gas-permeable layer expands and fractures in response to absorbing a gas. The inter-substrate bond structure includes an outer bond layer coupled to the outer gas-permeable layer. The outer bond layer forms an initial thermocompression bond with a mating layer on a second substrate. The initial thermocompression bond bonds the first substrate to the second substrate with the inter-substrate bond structure. The fracture in the inter-substrate bond structure debonds the first substrate from the second substrate while leaving a first portion of the inter-substrate bond structure attached to the first substrate.

公开(公告)号：US12040311B1

公开(公告)日：2024-07-16

申请号：US18145462

申请日：2022-12-22

申请人： The Boeing Company

发明人： Peter D. Brewer ,  Chia-Ming Chang ,  Sevag Terterian ,  Charbel Abijaoude ,  Diego Eduardo Carrasco

IPC分类号： B23K1/00 ,  B23K1/018 ,  H01L23/00 ,  B23K20/02 ,  B23K101/40

CPC分类号： H01L24/98 ,  B23K1/018 ,  H01L24/799 ,  B23K20/026 ,  B23K2101/40 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/13109 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16145 ,  H01L2224/7999 ,  H01L2224/81203 ,  H01L2224/98 ,  H01L2924/35121

摘要： A method for debonding a bonded part includes attaching a handle to a third side of a first substrate of the bonded part with an adhesive layer. The bonded part has a plurality of inter-substrate bond structures that couple a first side of the first substrate to a second side of a second substrate. The third side of the first substrate is opposite the first side. The first substrate and the second substrate have different thicknesses. The method includes absorbing a solvent into the adhesive layer, swelling the adhesive layer in response to the absorbing of the solvent, bending the first substrate in response to the swelling, and breaking a plurality of thermocompression bonds between the plurality of inter-substrate bond structures and the second side of the second substrate in response to the bending to debond the first substrate.

公开(公告)号：US20230378120A1

公开(公告)日：2023-11-23

申请号：US17663853

申请日：2022-05-18

申请人： The Boeing Company

发明人： Peter D. Brewer ,  Chia-Ming Chang ,  Partia Naghibi Mahmoudabadi ,  Sevag Terterian ,  Diego Eduardo Carrasco ,  Charbel Abijaoude

IPC分类号： H01L23/00 ,  G06T7/60

CPC分类号： H01L24/75 ,  G06T7/60 ,  H01L24/81 ,  H01L2224/81201 ,  H01L2224/75001

摘要： A method to aid in a calibration of a compression system includes mounting a first substrate in a press. The press has calibration parameters, and the first substrate has a test film on a first surface. The method includes mounting a second substrate in the press. The second substrate has spikes arranged in a spike pattern on a second surface. The method includes compressing the first substrate and the second substrate together with a force that causes the spikes to form indentations in the test film, separating the first substrate from the second substrate, determining local pressures applied by the spikes against the test film, and adjusting one or more calibration parameters of the press in response to the local pressures.