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公开(公告)号：US12040311B1
公开(公告)日：2024-07-16
申请号：US18145462
申请日：2022-12-22
申请人： The Boeing Company
发明人： Peter D. Brewer , Chia-Ming Chang , Sevag Terterian , Charbel Abijaoude , Diego Eduardo Carrasco
IPC分类号： B23K1/00 , B23K1/018 , H01L23/00 , B23K20/02 , B23K101/40
CPC分类号： H01L24/98 , B23K1/018 , H01L24/799 , B23K20/026 , B23K2101/40 , H01L24/13 , H01L24/16 , H01L24/81 , H01L2224/13109 , H01L2224/13124 , H01L2224/13144 , H01L2224/13147 , H01L2224/16145 , H01L2224/7999 , H01L2224/81203 , H01L2224/98 , H01L2924/35121
摘要： A method for debonding a bonded part includes attaching a handle to a third side of a first substrate of the bonded part with an adhesive layer. The bonded part has a plurality of inter-substrate bond structures that couple a first side of the first substrate to a second side of a second substrate. The third side of the first substrate is opposite the first side. The first substrate and the second substrate have different thicknesses. The method includes absorbing a solvent into the adhesive layer, swelling the adhesive layer in response to the absorbing of the solvent, bending the first substrate in response to the swelling, and breaking a plurality of thermocompression bonds between the plurality of inter-substrate bond structures and the second side of the second substrate in response to the bending to debond the first substrate.
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公开(公告)号：US20230378120A1
公开(公告)日：2023-11-23
申请号：US17663853
申请日：2022-05-18
申请人： The Boeing Company
发明人： Peter D. Brewer , Chia-Ming Chang , Partia Naghibi Mahmoudabadi , Sevag Terterian , Diego Eduardo Carrasco , Charbel Abijaoude
CPC分类号： H01L24/75 , G06T7/60 , H01L24/81 , H01L2224/81201 , H01L2224/75001
摘要： A method to aid in a calibration of a compression system includes mounting a first substrate in a press. The press has calibration parameters, and the first substrate has a test film on a first surface. The method includes mounting a second substrate in the press. The second substrate has spikes arranged in a spike pattern on a second surface. The method includes compressing the first substrate and the second substrate together with a force that causes the spikes to form indentations in the test film, separating the first substrate from the second substrate, determining local pressures applied by the spikes against the test film, and adjusting one or more calibration parameters of the press in response to the local pressures.
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公开(公告)号：US11056092B2
公开(公告)日：2021-07-06
申请号：US15840902
申请日：2017-12-13
申请人： The Boeing Company
发明人： Adam R. Weston , Joshua M. Montgomery , Chia-Ming Chang , Geoffrey P. McKnight , Adam E. Sorensen
IPC分类号： G10K11/168 , G10K11/16 , B60R13/08 , G10K11/172 , B64C1/40 , B32B3/12 , B32B27/12 , B32B3/08 , B64C1/12
摘要： Example methods, panels, and systems are disclosed for providing noise insulation. Noise insulation may be provided by an anti-resonant panel that includes a base panel including a base panel core material and two base panel face sheets, where each of the two base panel face sheets is adjacent to an opposite side of the base panel core material. The anti-resonant panel further includes at least one stiffener-member positioned along the base panel in a defined area of the base panel, where the defined area is less than a full area of the base panel. The stiffener-member includes a stiffener-member core material and two stiffener-member face sheets the stiffener-member face sheets adjacent to an opposite side of the stiffener-member core material.
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公开(公告)号：US20150047923A1
公开(公告)日：2015-02-19
申请号：US14497184
申请日：2014-09-25
申请人： The Boeing Company
IPC分类号： H03H9/25
CPC分类号： H03H9/25 , B60R13/0815 , B64C1/40 , G10K11/172
摘要： A hybrid acoustic absorption and reflection resonator can includes a rigid structure defining a cell, a membrane with at least one orifice attached to the rigid structure, and a back sheet attached to the rigid structure and covering the cell. The membrane is configured to reflect acoustic waves in a predetermined range of frequencies. The rigid structure, the membrane, and the back sheet define a Helmholtz cavity; the Helmholtz cavity is configured to absorb acoustic energy at a frequency within the predetermined range of frequencies.
摘要翻译： 混合声学吸收和反射谐振器可以包括限定电池的刚性结构，具有连接到刚性结构的至少一个孔的膜，以及附着到刚性结构并覆盖电池的背板。 膜被配置成在预定频率范围内反射声波。 刚性结构，膜和背板限定了亥姆霍兹腔; 亥姆霍兹腔被构造成以预定频率范围内的频率吸收声能。
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公开(公告)号：US10938447B1
公开(公告)日：2021-03-02
申请号：US16536026
申请日：2019-08-08
申请人： The Boeing Company
IPC分类号： G08B1/08 , H04B5/00 , G01B7/24 , G06K7/10 , G06K19/077
摘要： A system includes a fastener and a magneto-elastic component connected to the fastener, wherein a strain level applied to the magneto-elastic component is a function of a tightness level within a range of tightness levels of the fastener. The system further includes a radio frequency identification (RFID) circuit. The system also includes an antenna electrically connected to the RFID circuit. The system includes a variable inductor circuit electrically connected to the RFID circuit and to the antenna, where an inductance exhibited by the variable inductor circuit is a function of the strain level applied to the magneto-elastic component, where a resonance response frequency of the RFID circuit is a function of the inductance exhibited by the variable inductor circuit, and where a change in the strain level results in a shift in the resonance response frequency.
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公开(公告)号：US20240213214A1
公开(公告)日：2024-06-27
申请号：US18145462
申请日：2022-12-22
申请人： The Boeing Company
发明人： Peter D. Brewer , Chia-Ming Chang , Sevag Terterian , Charbel Abijaoude , Diego Eduardo Carrasco
IPC分类号： H01L23/00
CPC分类号： H01L24/98 , H01L24/799 , B23K20/026 , H01L2224/98
摘要： A method for debonding a bonded part includes attaching a handle to a third side of a first substrate of the bonded part with an adhesive layer. The bonded part has a plurality of inter-substrate bond structures that couple a first side of the first substrate to a second side of a second substrate. The third side of the first substrate is opposite the first side. The first substrate and the second substrate have different thicknesses. The method includes absorbing a solvent into the adhesive layer, swelling the adhesive layer in response to the absorbing of the solvent, bending the first substrate in response to the swelling, and breaking a plurality of thermocompression bonds between the plurality of inter-substrate bond structures and the second side of the second substrate in response to the bending to debond the first substrate.
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公开(公告)号：US20230378126A1
公开(公告)日：2023-11-23
申请号：US17663857
申请日：2022-05-18
申请人： The Boeing Company
发明人： Peter D. Brewer , John J. Vajo , Sevag Terterian , Chia-Ming Chang , Charbel Abijaoude , Diego Eduardo Carrasco
IPC分类号： H01L23/00
CPC分类号： H01L24/98 , H01L24/05 , H01L24/08 , H01L24/80 , H01L2224/0508 , H01L2224/05164 , H01L2224/05166 , H01L2224/05172 , H01L2224/05179 , H01L2224/05181 , H01L2224/0517 , H01L2224/05123 , H01L2224/05101 , H01L2224/05117 , H01L2224/05138 , H01L2224/05565 , H01L2224/08145 , H01L2224/8012 , H01L2224/80203 , H01L2924/01046 , H01L2924/01022 , H01L2924/01023 , H01L2924/01041 , H01L2924/01073 , H01L2924/01057 , H01L2924/01039 , H01L2924/0104 , H01L2924/01021 , H01L2924/01003 , H01L2924/01011 , H01L2924/01012
摘要： An inter-substrate bond structure includes an adhesion layer that attached to a first substrate, and an outer gas-permeable layer coupled to the adhesion layer. The outer gas-permeable layer expands and fractures in response to absorbing a gas. The inter-substrate bond structure includes an outer bond layer coupled to the outer gas-permeable layer. The outer bond layer forms an initial thermocompression bond with a mating layer on a second substrate. The initial thermocompression bond bonds the first substrate to the second substrate with the inter-substrate bond structure. The fracture in the inter-substrate bond structure debonds the first substrate from the second substrate while leaving a first portion of the inter-substrate bond structure attached to the first substrate.
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公开(公告)号：US20210044332A1
公开(公告)日：2021-02-11
申请号：US16536026
申请日：2019-08-08
申请人： The Boeing Company
IPC分类号： H04B5/00 , G06K19/077 , G06K7/10 , G01B7/24
摘要： A system includes a fastener and a magneto-elastic component connected to the fastener, wherein a strain level applied to the magneto-elastic component is a function of a tightness level within a range of tightness levels of the fastener. The system further includes a radio frequency identification (RFID) circuit. The system also includes an antenna electrically connected to the RFID circuit. The system includes a variable inductor circuit electrically connected to the RFID circuit and to the antenna, where an inductance exhibited by the variable inductor circuit is a function of the strain level applied to the magneto-elastic component, where a resonance response frequency of the RFID circuit is a function of the inductance exhibited by the variable inductor circuit, and where a change in the strain level results in a shift in the resonance response frequency.
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公开(公告)号：US08857563B1
公开(公告)日：2014-10-14
申请号：US13953155
申请日：2013-07-29
申请人： The Boeing Company
IPC分类号： E04B1/86
CPC分类号： H03H9/25 , B60R13/0815 , B64C1/40 , G10K11/172
摘要： A hybrid acoustic absorption and reflection resonator can includes a rigid structure defining a cell, a membrane with at least one orifice attached to the rigid structure, and a back sheet attached to the rigid structure and covering the cell. The membrane is configured to reflect acoustic waves in a predetermined range of frequencies. The rigid structure, the membrane, and the back sheet define a Helmholtz cavity; the Helmholtz cavity is configured to absorb acoustic energy at a frequency within the predetermined range of frequencies.
摘要翻译： 混合声学吸收和反射谐振器可以包括限定电池的刚性结构，具有连接到刚性结构的至少一个孔的膜，以及附着到刚性结构并覆盖电池的背板。 膜被配置成在预定的频率范围内反射声波。 刚性结构，膜和背板限定了亥姆霍兹腔; 亥姆霍兹腔被构造成以预定频率范围内的频率吸收声能。
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公开(公告)号：US20240125817A1
公开(公告)日：2024-04-18
申请号：US18047155
申请日：2022-10-17
申请人： The Boeing Company
发明人： Peter D. Brewer , Chia-Ming Chang , Sevag Terterian , Charbel Abijaoude , Diego Eduardo Carrasco
CPC分类号： G01R1/07307 , G01B7/003 , G01B21/22
摘要： A probing system includes a device-under-test, a probe device, and a die bonder. The device-under-test includes test patterns. The probe device includes tilt angle sensors. The tilt angle sensors include spikes that protrude from the probe device. The die bonder is operational to mount the device-under-test, mount the probe device facing the device-under-test, compress the probe device and the device-under-test together to causes a subset of the spikes to contact the test patterns, measure a number of connections formed between the tilt angle sensors and the test patterns, determine a first offset angle and a second offset angle between the device-under-test and the probe device based on the number of connections, adjust the spherical positioner in one or more rotational axes in response to the first offset angle and the second offset angle to change a parallelism between the device-under-test and the probe device.
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