公开(公告)号：US12238929B2

公开(公告)日：2025-02-25

申请号：US17349126

申请日：2021-06-16

Applicant: Kioxia Corporation

Inventor： Mutsumi Okajima

IPC: H10B43/30 ,  H10B43/10 ,  H10B43/20

Abstract: A memory device includes a first conductor and a charge storage film extending along a first direction; a first semiconductor of a first conductive type; a second and third semiconductor each of a second conductive type; and a stack comprising a second conductor, a first insulator, and a third conductor sequentially stacked along the first direction and each extending along a second direction. The first conductor, the charge storage film, the first semiconductor, and the stack are arranged in this order along a third direction. The second semiconductor is in contact with the first semiconductor and the second conductor, between the second conductor or the first insulator and the charge storage film.

公开(公告)号：US12232313B2

公开(公告)日：2025-02-18

申请号：US18144650

申请日：2023-05-08

Applicant: YANGTZE MEMORY TECHNOLOGIES CO., LTD.

Inventor： Zhong Zhang ,  Zhongwang Sun ,  Wenxi Zhou ,  Zhiliang Xia

IPC: H10B41/20 ,  H10B41/10 ,  H10B41/35 ,  H10B43/10 ,  H10B43/20 ,  H10B43/35

Abstract: In an example, a three-dimensional (3D) memory device includes a memory array structure including a first and a second memory array structures, a staircase structure between the first and a second memory array structures in a first lateral direction and including a first and a second staircase zones, and a bridge structure between the first and second staircase zones in a second lateral direction perpendicular to the first lateral direction. Each of the first and second staircase zones includes first and second sub-staircases arranged alternately. Each first sub-staircase includes ascending stairs at different depths. Each second sub-staircase includes descending stairs at different depths. At least one stair in each of the first and second sub-staircases is connected to at least one of the first and second memory array structures through the bridge structure.

公开(公告)号：US12199093B2

公开(公告)日：2025-01-14

申请号：US18668218

申请日：2024-05-19

Applicant: Monolithic 3D Inc.

Inventor： Zvi Or-Bach ,  Brian Cronquist

IPC: H01L27/06 ,  G03F9/00 ,  H01L21/762 ,  H01L21/768 ,  H01L21/822 ,  H01L21/8238 ,  H01L21/84 ,  H01L23/367 ,  H01L23/48 ,  H01L23/522 ,  H01L23/528 ,  H01L23/532 ,  H01L23/544 ,  H01L27/02 ,  H01L27/092 ,  H01L27/105 ,  H01L27/118 ,  H01L27/12 ,  H01L29/423 ,  H01L29/45 ,  H01L29/66 ,  H01L29/732 ,  H01L29/786 ,  H01L29/808 ,  H01L29/812 ,  H10B10/00 ,  H10B12/00 ,  H10B20/00 ,  H10B41/20 ,  H10B43/20 ,  H01L21/268 ,  H01L23/00 ,  H01L27/088

Abstract: A semiconductor device including: a first silicon level including a first single crystal silicon layer and a plurality of first transistors; a first metal layer disposed over the first silicon level; a second metal layer disposed over the first metal layer; a third metal layer disposed over the second metal layer; a second level including a plurality of second transistors, disposed over the third metal layer; a third level including a plurality of third transistors, disposed over the second level; a via disposed through the second and third levels; a fourth metal layer disposed over the third level; a fifth metal layer disposed over the fourth metal layer; and a fourth level including a second single crystal silicon layer and is disposed over the fifth metal layer, where each of the plurality of second transistors includes a metal gate, and the via has a diameter of less than 450 nm.

公开(公告)号：US20240395592A1

公开(公告)日：2024-11-28

申请号：US17942109

申请日：2022-09-09

Applicant: Monolithic 3D Inc.

Inventor： Zvi Or-Bach ,  Brian Cronquist ,  Deepak C. Sekar

IPC: H01L21/683 ,  G11C8/16 ,  H01L21/74 ,  H01L21/762 ,  H01L21/768 ,  H01L21/822 ,  H01L21/8238 ,  H01L21/84 ,  H01L23/00 ,  H01L23/367 ,  H01L23/48 ,  H01L23/525 ,  H01L25/00 ,  H01L25/065 ,  H01L27/02 ,  H01L27/06 ,  H01L27/092 ,  H01L27/10 ,  H01L27/105 ,  H01L27/118 ,  H01L27/12 ,  H01L29/423 ,  H01L29/66 ,  H01L29/78 ,  H01L29/788 ,  H01L29/792 ,  H10B10/00 ,  H10B12/00 ,  H10B20/00 ,  H10B20/20 ,  H10B41/20 ,  H10B41/40 ,  H10B41/41 ,  H10B43/20 ,  H10B43/40

Abstract: A method for producing a 3D memory device including: providing a first level including a first single-crystal layer and control circuits, where the first level includes at least two interconnecting metal layers; forming at least one second level disposed above the first level; performing a first etch step including etching holes within the second level; forming at least one third level above the second level; performing a second etch step including etching holes within the third level; and performing additional processing steps to form a plurality of first memory cells within the second level and a plurality of second memory cells within the third level; each of first memory cells include one first transistor and each of second memory cells include one second transistor, where first memory cells and second memory cells are a NAND nonvolatile type memory, and at least one of the second transistors include a metal gate.

公开(公告)号：US20240389334A1

公开(公告)日：2024-11-21

申请号：US18785757

申请日：2024-07-26

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Meng-Han Lin ,  Han-Jong Chia ,  Sheng-Chen Wang ,  Feng-Cheng Yang ,  Yu-Ming Lin ,  Chung-Te Lin

IPC: H10B51/20 ,  G11C11/22 ,  H01L23/522 ,  H01L29/66 ,  H01L29/78 ,  H10B43/20 ,  H10B43/27 ,  H10B51/10 ,  H10B51/30

Abstract: In an embodiment, a device includes: a source line extending in a first direction; a bit line extending in the first direction; a back gate between the source line and the bit line, the back gate extending in the first direction; a channel layer surrounding the back gate; a word line extending in a second direction, the second direction perpendicular to the first direction; and a data storage layer extending along the word line, the data storage layer between the word line and the channel layer, the data storage layer between the word line and the bit line, the data storage layer between the word line and the source line.

公开(公告)号：US20240379502A1

公开(公告)日：2024-11-14

申请号：US18778977

申请日：2024-07-20

Applicant: Monolithic 3D Inc.

Inventor： Zvi Or-Bach ,  Deepak C. Sekar ,  Brian Cronquist

IPC: H01L23/48 ,  H01L21/74 ,  H01L23/34 ,  H01L23/50 ,  H01L23/544 ,  H01L27/02 ,  H01L27/06 ,  H01L27/088 ,  H01L27/118 ,  H01L29/10 ,  H01L29/66 ,  H01L29/732 ,  H01L29/78 ,  H01L29/808 ,  H10B12/00 ,  H10B41/20 ,  H10B41/40 ,  H10B43/20 ,  H10B43/40 ,  H10B63/00

Abstract: A 3D semiconductor device, the device including: a first level including single crystal first transistors, a first metal layer, and a first isolation layer; a second level including second transistors and a second isolation layer, where the first level is overlaid by the second level; a third level including single crystal third transistors, where the second level is overlaid by the third level, where the third level includes a third isolation layer, where the third level is bonded to the second level; and a power delivery path to the second transistors, where at least a portion of the power delivery path is connected to at least one of the first transistors.

公开(公告)号：US20240349504A1

公开(公告)日：2024-10-17

申请号：US18527356

申请日：2023-12-03

Applicant: Monolithic 3D Inc.

Inventor： Zvi Or-Bach ,  Jin-Woo Han

IPC: H10B43/27 ,  H01L23/528 ,  H01L27/02 ,  H01L29/167 ,  H01L29/47 ,  H01L29/78 ,  H01L29/792 ,  H10B41/10 ,  H10B41/20 ,  H10B43/10 ,  H10B43/20 ,  H10B53/20

CPC classification number: H10B43/27 ,  H01L23/5283 ,  H01L27/0207 ,  H01L29/167 ,  H01L29/47 ,  H01L29/7827 ,  H01L29/792 ,  H10B43/10 ,  H10B43/20 ,  H10B41/10 ,  H10B41/20 ,  H10B53/20

Abstract: A 3D semiconductor device including: a first level including a single crystal layer and a memory control circuit including first transistors and at least one power-down control circuit; a first metal layer overlaying the single crystal layer; a second metal layer overlaying the first metal layer; a third metal layer overlaying the second metal layer; second transistors disposed atop the third metal layer with at least one including a metal gate; third transistors disposed atop the second transistors; a fourth metal layer atop the third transistors; a memory array including word-lines and at least four memory mini arrays, each including at least four rows by four columns of memory cells, each of the memory cells includes at least one of the second transistors or at least one of the third transistors; a connection path from the fourth metal to the third metal including a via disposed through the memory array.

公开(公告)号：US12119056B2

公开(公告)日：2024-10-15

申请号：US17701463

申请日：2022-03-22

Applicant: Micron Technology, Inc.

Inventor： Ferdinando Bedeschi

IPC: G11C13/00 ,  G11C16/04 ,  H10B43/20

CPC classification number: G11C13/0026 ,  G11C13/0004 ,  G11C16/0483 ,  H10B43/20 ,  G11C2213/71

Abstract: Methods, systems, and devices for multiple transistor architecture for three-dimensional memory arrays are described. A memory device may include conductive pillars coupled with an access line using two transistors positioned between the conductive pillar and the access line. As part of an access operation for a memory cell coupled with the conductive pillar, the memory device may be configured to bias the access line to a first voltage and activate the two transistors using a second voltage to couple the conductive pillar with the access line. Additionally, the memory device may be configured to bias a gate of a first transistor and a gate of a second transistor coupling an unselected conductive pillar with the access line to a third and fourth voltage, respectively, which may deactivate at least one of the first or second transistor during the access operation and isolate the unselected conductive pillar from the access line.

公开(公告)号：US20240315019A1

公开(公告)日：2024-09-19

申请号：US18671074

申请日：2024-05-22

Applicant: Kioxia Corporation

Inventor： Hideto TAKEKIDA ,  Yosuke MURAKAMI ,  Keisuke NAKATSUKA ,  Yefei HAN

IPC: H10B43/10 ,  H10B43/20 ,  H10B43/50

CPC classification number: H10B43/10 ,  H10B43/20 ,  H10B43/50

Abstract: A semiconductor storage device of an embodiment includes a first conductive layer, a second conductive layer, a first conductive pillar, a first semiconductor layer, and a first storage layer. The first conductive layer extends in a first direction. The second conductive layer is along the first conductive layer in a third direction intersecting the first direction. The second conductive layer extends in the first direction. The first conductive pillar penetrates the first conductive layer and the second conductive layer in the third direction. The first semiconductor layer is in contact with the first conductive layer and the second conductive layer. The first semiconductor layer faces the first conductive pillar in the first direction. The first storage layer is between the first semiconductor layer and the first conductive pillar.

公开(公告)号：US20240297257A1

公开(公告)日：2024-09-05

申请号：US18658367

申请日：2024-05-08

Applicant: Micron Technology, Inc.

Inventor： Manzar Siddik ,  Terry H. Kim

IPC: H01L29/792 ,  G11C16/04 ,  H01L29/423 ,  H10B43/20 ,  H10B43/30

CPC classification number: H01L29/792 ,  G11C16/0466 ,  H01L29/4234 ,  H10B43/20 ,  H10B43/30

Abstract: Some embodiments include a memory cell having charge-trapping-material between a semiconductor channel material and a gating region. The charge-trapping-material includes silicon, nitrogen and trap-enhancing-additive. The trap-enhancing-additive includes one or more of carbon, phosphorus, boron and metal. Some embodiments include an integrated assembly having a stack of alternating first and second levels. The first levels include conductive structures and the second levels are insulative. Channel-material-pillars extend through the stack. Charge-trapping-regions are along the channel-material-pillars and are between the channel-material-pillars and the conductive structures. The charge-trapping-regions include a charge-trapping-material which contains silicon, nitrogen and trap-enhancing-additive. The trap-enhancing-additive includes one or more of carbon, phosphorus, boron and metal.