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公开(公告)号：US20240328023A1
公开(公告)日：2024-10-03
申请号：US18737789
申请日：2024-06-07
发明人： Yun ZHANG , Xingxing ZHANG , Volker WOHLFARTH , Jing WANG , Peipei DONG , Wei ZHAO
CPC分类号： C25D3/38 , C25D17/001 , H05K3/241
摘要： A method of electroplating a stress-free copper film on a substrate includes: providing the substrate; providing an electroplating bath that includes a copper salt, an acid, a leveler, a chlorine compound, an accelerator, a suppressor; and water; heating the electroplating bath to 25 to 60° C.; and electroplating the substrate in the electroplating bath to form the stress-free copper film while maintaining the electroplating bath at 25 to 60° C. The leveler is an organic compound containing an amine group. The method further includes annealing the stress-free copper film at 60-260° C. for 0.5 to 2 hours, or at 60-120° C. for 0.5 to 2 hours. A stress-free electroplated copper film is also disclosed.
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公开(公告)号：US20230335479A1
公开(公告)日：2023-10-19
申请号：US18211093
申请日：2023-06-16
发明人： Chan Hoon KO , Sang Hoon KIM , Yoong OH , Hea Sung KIM
CPC分类号： H01L23/49838 , H01L23/49811 , H01L21/4846 , H05K1/111 , H05K3/18 , H05K3/241 , H05K3/28 , H05K2203/0723 , H01L23/49822 , H05K2201/098 , H05K2201/099
摘要： A printed circuit board includes a first insulating layer; a pad disposed on the insulating layer and having a protrusion; and a protective layer disposed on the insulating layer and having an opening exposing at least a portion of the pad. The protrusion protrudes from one surface of the pad and is buried in at least one of the insulating layer and the protective layer.
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3.发明公开公开(公告)号：US20230247763A1
公开(公告)日：2023-08-03
申请号：US18297857
申请日：2023-04-10
发明人： Koji NITTA , Yasushi MOCHIDA , Yoshio OKA , Shoichiro SAKAI , Tadahiro KAIBUKI , Junichi OKAUE
CPC分类号： H05K1/118 , H05K1/0265 , H05K1/0298 , H05K3/241 , H05K3/361 , H05K2201/094 , H05K2201/0338 , H05K2201/09236 , H05K2201/09736 , H05K2203/0723
摘要： A flexible printed circuit board includes a base film having an insulating property and a plurality of interconnects laminated to at least one surface side of the base film. The plurality of interconnects includes a first interconnect and a second interconnect in a same plane. An average thickness of the second interconnect being greater than an average thickness of the first interconnect. A ratio of the average thickness of the second interconnect to the average thickness of the first interconnect is greater than or equal to 1.5 and less than or equal to 50. The first interconnect includes a first conductive underlayer and a first plating layer, and the second interconnect includes a second conductive underlayer, a second plating layer, and a third plating layer.
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公开(公告)号：US20190250502A1
公开(公告)日：2019-08-15
申请号：US16395244
申请日：2019-04-26
发明人： Pu-Ju Lin , Shih-Lian Cheng , Yu-Hua Chen , Cheng-Ta Ko , Jui-Jung Chien , Wei-Tse Ho
IPC分类号： G03F1/50 , G03F7/20 , H05K3/42 , H05K3/18 , H05K3/12 , H05K3/10 , H05K3/00 , G01K15/00 , G01K7/24 , H05K3/24 , H05K3/06
CPC分类号： G03F1/50 , G01K7/24 , G01K15/007 , G03F7/2032 , G03F7/2047 , H05K3/0023 , H05K3/064 , H05K3/107 , H05K3/1275 , H05K3/182 , H05K3/241 , H05K3/422 , Y10T29/49124
摘要： A mask structure and a manufacturing method of the mask structure are provided. The mask structure includes a transparent substrate, a patterned metal layer, and a plurality of microlens structures. The patterned metal layer is disposed on the transparent substrate and exposing a portion of the transparent substrate. The microlens structures are disposed on the transparent substrate exposed by a portion of the patterned metal layer and being in contact with the portion of the patterned metal layer.
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公开(公告)号：US20180135194A1
公开(公告)日：2018-05-17
申请号：US15560228
申请日：2015-04-28
发明人： Lingli DUAN , Chen CHEN , Tong SUN , Zukhra I. NIAZIMBETOVA , Maria Anna RZEZNIK
CPC分类号： C25D3/32 , C08G73/00 , C08G73/1017 , C08G73/1092 , C08K5/17 , C25D3/30 , C25D3/38 , C25D7/00 , H05K3/241
摘要： Reaction products of amines and polymers containing saturated heterocyclic moieties may be used as levelers in metal electroplating baths. The reaction products may plate metal with good surface properties and good physical reliability.
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公开(公告)号：US09598786B2
公开(公告)日：2017-03-21
申请号：US14994211
申请日：2016-01-13
CPC分类号： C25D3/38 , C08G59/00 , C08G59/10 , C08G59/50 , C08G73/18 , C25D3/58 , C25D5/38 , H05K3/188 , H05K3/241 , H05K3/243 , H05K3/42 , H05K2203/0723
摘要： Amino sulfonic acid based polymers are reaction products of amino sulfonic acids, an amine, polyepoxide compounds and epihalohydrin. The polymers may be used as levelers in copper electroplating baths, to provide good throwing power. Such reaction products may plate copper or copper alloys with good surface properties and good physical reliability.
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公开(公告)号：US20160186345A1
公开(公告)日：2016-06-30
申请号：US14585227
申请日：2014-12-30
摘要： Sulfonamide based polymers are reaction products of sulfonamides and epoxides. The polymers may be used as levelers in copper electroplating baths, to provide good throwing power. Such reaction products may plate copper or copper alloys with good surface properties and good physical reliability.
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公开(公告)号：US20160160066A1
公开(公告)日：2016-06-09
申请号：US14906670
申请日：2014-07-16
发明人： Zhiyi Zhang , Ye Tao , Hiroshi Fukutani , Gaozhi Xiao
CPC分类号： C09D11/52 , C09D11/037 , C09D11/322 , C09D11/38 , C09D11/54 , C23C16/06 , C23C18/161 , C23C18/166 , C23C18/1676 , C23C18/1678 , C23C18/2066 , C23C18/31 , C23C18/40 , C23C18/44 , H05K3/12 , H05K3/182 , H05K3/241 , H05K2203/1105 , H05K2203/1157
摘要： A process for depositing a metal on a substrate involves the use of two reduction reactions in a bottom-up based tandem manner starting from a substrate surface and working upward. A first reduction reaction starts on the substrate surface at ambient temperature, and a second reduction reaction, which is initiated by the reaction heat of the first reduction reaction, occurs in a reactive ink solution film coated on top, which becomes solid after the reaction. Gas and other small molecules generated from the reduction reactions, and the solvent, can readily escape through the upper surface of the film before the solid metal layer is formed or during post-treatment, with no or few voids left in the metal film. Thus, the process can be used to form highly conductive films and features at ambient temperature on various substrates.
摘要翻译： 用于在基板上沉积金属的方法涉及以从底部向上串联的方式使用两个还原反应，从基板表面开始并向上工作。 第一还原反应在环境温度下在基材表面上开始，并且通过第一还原反应的反应热引发的第二还原反应发生在反应性油墨溶液膜上，反应性油墨溶液膜在反应后变成固体。 由还原反应产生的气体和其它小分子以及溶剂可以在形成固体金属层之前或在后处理期间容易地从薄膜的上表面逸出，而金属膜中没有留下或少量的空隙。 因此，该方法可用于在环境温度下在各种基材上形成高导电膜和特征。
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9.发明授权Photosensitive resin composition, photosensitive element, method for forming resist pattern and method for producing wiring board 有权光敏树脂组合物，感光元件，抗蚀剂图案形成方法和布线板的制造方法公开(公告)号：US09110371B2
公开(公告)日：2015-08-18
申请号：US14403233
申请日：2013-05-28
摘要： Provided is a photosensitive resin composition, including: a binder polymer; a photopolymerizable compound having an ethylenically unsaturated group; a photopolymerization initiator; a benzotriazole compound; and an aliphatic diamine compound having from 8 to 30 carbon atoms.
摘要翻译： 提供一种感光性树脂组合物，其包含：粘合剂聚合物; 具有烯属不饱和基团的光聚合化合物; 光聚合引发剂; 苯并三唑化合物; 和碳原子数为8〜30的脂肪族二胺化合物。
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公开(公告)号：US20150108004A1
公开(公告)日：2015-04-23
申请号：US14587883
申请日：2014-12-31
发明人： Adam L. Cohen
CPC分类号： C25D5/10 , B33Y10/00 , B33Y70/00 , B81C1/00126 , B81C2201/0181 , B81C2201/0197 , B81C2201/032 , C25D1/00 , C25D1/003 , C25D5/022 , C25D5/12 , C25D5/22 , C25D17/06 , H01L21/2885 , H05K3/241 , Y10T428/12486 , Y10T428/239
摘要： An electroplating method that includes: a) contacting a first substrate with a first article, which includes a substrate and a conformable mask disposed in a pattern on the substrate; b) electroplating a first metal from a source of metal ions onto the first substrate in a first pattern, the first pattern corresponding to the complement of the conformable mask pattern; and c) removing the first article from the first substrate, is disclosed. Electroplating articles and electroplating apparatus are also disclosed.
摘要翻译： 一种电镀方法，包括：a）使第一衬底与第一制品接触，所述第一制品包括衬底和以衬底形式设置的贴合掩模; b）以第一图案将来自金属离子源的第一金属电镀到所述第一基板上，所述第一图案对应于所述适形掩模图案的所述补体; 和c）从第一基板上去除第一制品。 还公开了电镀制品和电镀装置。
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