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公开(公告)号：US20220064813A1
公开(公告)日：2022-03-03
申请号：US17166104
申请日：2021-02-03
发明人： Yun ZHANG , Xingxing ZHANG , Volker WOHLFARTH , Jing WANG , Peipei DONG , Wei ZHAO
摘要： A method of electroplating a stress-free copper film on a substrate includes: providing the substrate; providing an electroplating bath that includes a copper salt, an acid, a leveler, a chlorine compound, an accelerator, a suppressor; and water; heating the electroplating bath to 25 to 60° C.; and electroplating the substrate in the electroplating bath to form the stress-free copper film while maintaining the electroplating bath at 25 to 60° C. The leveler is an organic compound containing an amine group. The method further includes annealing the stress-free copper film at 60-260° C. for 0.5 to 2 hours, or at 60-120° C. for 0.5 to 2 hours. A stress-free electroplated copper film is also disclosed.
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公开(公告)号：US20240328023A1
公开(公告)日：2024-10-03
申请号：US18737789
申请日：2024-06-07
发明人： Yun ZHANG , Xingxing ZHANG , Volker WOHLFARTH , Jing WANG , Peipei DONG , Wei ZHAO
CPC分类号： C25D3/38 , C25D17/001 , H05K3/241
摘要： A method of electroplating a stress-free copper film on a substrate includes: providing the substrate; providing an electroplating bath that includes a copper salt, an acid, a leveler, a chlorine compound, an accelerator, a suppressor; and water; heating the electroplating bath to 25 to 60° C.; and electroplating the substrate in the electroplating bath to form the stress-free copper film while maintaining the electroplating bath at 25 to 60° C. The leveler is an organic compound containing an amine group. The method further includes annealing the stress-free copper film at 60-260° C. for 0.5 to 2 hours, or at 60-120° C. for 0.5 to 2 hours. A stress-free electroplated copper film is also disclosed.
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公开(公告)号：US20210017660A1
公开(公告)日：2021-01-21
申请号：US16982262
申请日：2019-03-01
发明人： Yun ZHANG , Jing WANG , Peipei DONG , Xingxing ZHANG
IPC分类号： C25D3/38
摘要： A metal material having thermodynamic anisotropy has an X-axis hardness of 160-180 HV, an X-axis hardness thermal expansion coefficient of 5×10-6-100×10-6 K−1; a Y-axis hardness of 160-180 HV, a Y-axis hardness thermal expansion coefficient of 5×10-6-100×10-6 K−1; and a Z-axis hardness of 180-250 HV, a Z-axis hardness thermal expansion coefficient of 50×10-6-1000×10-6 K−1. A method for preparing a metal material having thermodynamic anisotropy is also disclosed.
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公开(公告)号：US20220127742A1
公开(公告)日：2022-04-28
申请号：US17571287
申请日：2022-01-07
发明人： Yun ZHANG , Jing WANG , Peipei DONG , Xingxing ZHANG
IPC分类号： C25D3/38
摘要： A metal material having thermodynamic anisotropy has an X-axis hardness of 160-180 HV, an X-axis hardness thermal expansion coefficient of 5×10-6-100×10-6 K−1; a Y-axis hardness of 160-180 HV, a Y-axis hardness thermal expansion coefficient of 5×10-6-100×10-6 K−1; and a Z-axis hardness of 180-250 HV, a Z-axis hardness thermal expansion coefficient of 50×10-6-1000×10-6 K−1. A method for preparing a metal material having thermodynamic anisotropy is also disclosed.
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公开(公告)号：US20230257896A1
公开(公告)日：2023-08-17
申请号：US17750790
申请日：2022-05-23
发明人： Yun ZHANG , Peipei DONG , Jing WANG
摘要： A method of electroplating nanograined copper on a substrate includes: providing the substrate; providing an electroplating bath that includes a copper salt, an acid, a leveler, a chlorine compound, an accelerator, a suppressor; and water; and electroplating the substrate in the electroplating bath to form the nanograined copper at room temperature. The suppressor is a ployether polyol compound, the nanograined copper has an average grain size of about 100 nm, and the nanograined copper has a resistivity of about 1.78-1.90 μOhm·cm. A nanograined copper prepared according to the method is also disclosed.
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