公开(公告)号：US20240328023A1

公开(公告)日：2024-10-03

申请号：US18737789

申请日：2024-06-07

申请人： SUZHOU SHINHAO MATERIALS LLC ,  UMICORE GALVANOTECHIK GMBH

发明人： Yun ZHANG ,  Xingxing ZHANG ,  Volker WOHLFARTH ,  Jing WANG ,  Peipei DONG ,  Wei ZHAO

IPC分类号： C25D3/38 ,  C25D17/00 ,  H05K3/24

CPC分类号： C25D3/38 ,  C25D17/001 ,  H05K3/241

摘要： A method of electroplating a stress-free copper film on a substrate includes: providing the substrate; providing an electroplating bath that includes a copper salt, an acid, a leveler, a chlorine compound, an accelerator, a suppressor; and water; heating the electroplating bath to 25 to 60° C.; and electroplating the substrate in the electroplating bath to form the stress-free copper film while maintaining the electroplating bath at 25 to 60° C. The leveler is an organic compound containing an amine group. The method further includes annealing the stress-free copper film at 60-260° C. for 0.5 to 2 hours, or at 60-120° C. for 0.5 to 2 hours. A stress-free electroplated copper film is also disclosed.

公开(公告)号：US20220127742A1

公开(公告)日：2022-04-28

申请号：US17571287

申请日：2022-01-07

申请人： Suzhou Shinhao Materials LLC

发明人： Yun ZHANG ,  Jing WANG ,  Peipei DONG ,  Xingxing ZHANG

IPC分类号： C25D3/38

摘要： A metal material having thermodynamic anisotropy has an X-axis hardness of 160-180 HV, an X-axis hardness thermal expansion coefficient of 5×10-6-100×10-6 K−1; a Y-axis hardness of 160-180 HV, a Y-axis hardness thermal expansion coefficient of 5×10-6-100×10-6 K−1; and a Z-axis hardness of 180-250 HV, a Z-axis hardness thermal expansion coefficient of 50×10-6-1000×10-6 K−1. A method for preparing a metal material having thermodynamic anisotropy is also disclosed.

公开(公告)号：US20220064813A1

公开(公告)日：2022-03-03

申请号：US17166104

申请日：2021-02-03

申请人： SUZHOU SHINHAO MATERIALS LLC ,  UMICORE GALVANOTECHIK GMBH

发明人： Yun ZHANG ,  Xingxing ZHANG ,  Volker WOHLFARTH ,  Jing WANG ,  Peipei DONG ,  Wei ZHAO

IPC分类号： C25D3/38 ,  C25D17/00 ,  H05K3/24

摘要： A method of electroplating a stress-free copper film on a substrate includes: providing the substrate; providing an electroplating bath that includes a copper salt, an acid, a leveler, a chlorine compound, an accelerator, a suppressor; and water; heating the electroplating bath to 25 to 60° C.; and electroplating the substrate in the electroplating bath to form the stress-free copper film while maintaining the electroplating bath at 25 to 60° C. The leveler is an organic compound containing an amine group. The method further includes annealing the stress-free copper film at 60-260° C. for 0.5 to 2 hours, or at 60-120° C. for 0.5 to 2 hours. A stress-free electroplated copper film is also disclosed.

公开(公告)号：US20210017660A1

公开(公告)日：2021-01-21

申请号：US16982262

申请日：2019-03-01

申请人： Suzhou Shinhao Materials LLC

发明人： Yun ZHANG ,  Jing WANG ,  Peipei DONG ,  Xingxing ZHANG

IPC分类号： C25D3/38

摘要： A metal material having thermodynamic anisotropy has an X-axis hardness of 160-180 HV, an X-axis hardness thermal expansion coefficient of 5×10-6-100×10-6 K−1; a Y-axis hardness of 160-180 HV, a Y-axis hardness thermal expansion coefficient of 5×10-6-100×10-6 K−1; and a Z-axis hardness of 180-250 HV, a Z-axis hardness thermal expansion coefficient of 50×10-6-1000×10-6 K−1. A method for preparing a metal material having thermodynamic anisotropy is also disclosed.