Abstract:
A positive photosensitive resin composition and, more specifically, a positive photosensitive resin composition includes an alkali-soluble polymer resin comprising a polyimide precursor comprising a specific chemical structure; a quinone diazide compound; and a solvent. The positive photosensitive resin composition is a suitable matter for next-generation flexible displays and semiconductor packages.
Abstract:
A resist composition contains: a resin having an acid-labile group, a resin having a structural unit represented by formula (I), an acid generator, and a solvent; wherein Ri41 represents a hydrogen atom or a methyl group, Ri42 represents a C1 to C10 hydrocarbon group that may be substituted with a hydroxy group, a C2 to C7 acyl group or a hydrogen atom, Ri43 in each occurrence independently represents a C1 to C6 alkyl group or a C1 to C6 alkoxy group, “p” represents an integer of 0 to 4, Z represents a divalent C3 to C20 hydrocarbon group having a group represented by formula (Ia), and a methylene group contained in the hydrocarbon group may be replaced by an oxygen atom, a sulfur atom or a carbonyl group, *—[(CH2)w—O]r— (Ia): wherein “w” and “r” each independently represents an integer of 1 to 10, and * represent a bonding position.
Abstract:
Provided is a composition that is sensitive to radiation in electromagnetic spectrum ranges for printing purposes, and includes (a) one or more binder polymers; (b) an ethylenically unsaturated compound; (c) one or more compounds that absorbs radiations in the selected region of the spectrum; (d) a sensitizer; (e) optionally a photoaccelarator; (f) an adhesion promoter; (g) a dye; and (h) optionally thermal polymerization inhibitors. Also provided is a printing plate including the radiation sensitive composition, as well as the use of the composition and an image developing process.
Abstract:
A positive resist composition is provided comprising a polymer comprising recurring units having a carboxyl and/or phenolic hydroxyl group substituted with an acid labile group and recurring units of tert-butyl or tert-amyl-substituted hydroxyphenyl methacrylate and having a weight average molecular weight of 1,000-500,000. The resist composition has a satisfactory effect of suppressing acid diffusion and a high resolution, and forms a pattern of good profile and minimal edge roughness after exposure.
Abstract:
A positive resist composition based on a polymer comprising recurring units of (meth)acrylate having a cyclic acid labile group and a dihydroxynaphthalene novolak resin, and containing a photoacid generator is improved in resolution, step coverage and adhesion on a highly reflective stepped substrate, has high resolution, and forms a pattern of good profile and minimal edge roughness through exposure and development.
Abstract:
A positive resist composition comprising, as base resins contained therein, (A) a polymer having a weight-average molecular weight of 1000 to 500000 and containing a repeating unit which contains a structure having a hydrogen atom of a carboxyl group thereof substituted with an acid-labile group having a cyclic structure and (B) a novolak resin of a substituted or an unsubstituted fluorescein, and in addition, a photo acid generator. There can be provided a positive resist composition having an appropriate absorption to form a pattern on a highly reflective substrate with excellent pattern profile after light exposure, adhesion, implantation characteristics onto a non-planar substrate, and in addition, ion implantation resistance at the time of ion implantation; and to provide a patterning process.
Abstract:
The invention provides a positive resist composition comprising, as base resins contained therein, (A) a polymer having a weight-average molecular weight of 1000 to 500000 and containing a repeating unit which contains a structure having a hydrogen atom of a carboxyl group thereof substituted with an acid-labile group having a cyclic structure and (B) a novolak resin of a substituted or an unsubstituted naphtholphthalein, and in addition, a photo acid generator. There can be provided a positive resist composition having an appropriate absorption to form a pattern on a highly reflective substrate, excellent characteristics in adhesion and implantation onto a non-planar substrate, a good pattern profile after light exposure, and an ion implantation resistance at the time of ion implantation; and a patterning process.
Abstract:
A positive-type photosensitive resin composition includes (A) an alkali-soluble resin, (B) a photosensitizer, and (C) a silicon compound shown by the following general formula (1). R1 represents an alkylene group having 6 to 8 carbon atoms, and R2 represents an alkyl group having 1 to 10 carbon atoms. The positive-type photosensitive resin composition exhibits excellent storage stability, produces a film that exhibits excellent adhesion to a substrate during development, and produces a cured film that exhibits excellent adhesion to a substrate after humidification. (R2O)3—Si—R1—Si—(OR2)3 (1)
Abstract:
A method for producing a polymer is provided. The polymer improves variations in the content ratio and molecular weights of a copolymer's constitutional units, solvent solubility, and the sensitivity of a resist composition using such a polymer. The method includes polymerizing two or more monomers while adding with a polymerization initiator to obtain the polymer, feeding a first solution containing first composition monomers in an initial polymerization stage, and starting dropwise addition of a second solution containing second composition monomers after or simultaneously with the feeding of the first solution. The second composition is equal to a target composition ratio of the polymer to be obtained. The first composition is calculated in advance based on a target composition ratio and the reactivity of the monomers. The above dropping rate is set to high.
Abstract:
Solving problems in the prior art, provided are a resist polymer which is small in lot-to-lot, reactor-to-reactor and scale-to-scale variations, and contains no high polymer, is excellent in solubility and storage stability, and is suitable for fine pattern formation, and a method for production thereof. The present invention provides the resist polymer at least having a repeating unit having a structure which is decomposed by an acid to become soluble in an alkali developer and a repeating unit having a polar group to enhance adhesion to a substrate, characterized in that a peak area of a high molecular weight component (high polymer) with molecular weight of 100,000 or more is 0.1% or less based on an entire peak area in a molecular weight distribution determined, by gel permeation chromatography (GPC).