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    Apparatus for focused electric-field imprinting for micron and sub-micron patterns on wavy or planar surfaces
    4.
    发明授权
    Apparatus for focused electric-field imprinting for micron and sub-micron patterns on wavy or planar surfaces 有权
    用于在波浪或平面表面上用于微米和亚微米图案的聚焦电场印记的装置

    公开(公告)号：US09150979B1

    公开(公告)日：2015-10-06

    申请号：US14145697

    申请日：2013-12-31

    申请人： Actus Potentia, Inc.

    发明人： Ambar K. Mitra ,  Ashraf F. Bastawros ,  Abhijit Chandra ,  Charles A. Lamaire

    IPC分类号： C25D5/02 ,  C25D17/00 ,  C25F3/02

    CPC分类号： C25D5/02 ,  C25D5/22 ,  C25D17/00 ,  C25F3/02 ,  C25F3/14

    摘要： Focused Electric Field Imprinting (FEFI) provides a focused electric field to guide an unplating operation and/or a plating operation to form very fine-pitched metal patterns on a substrate. The process is a variation of the electrochemical unplating process, wherein the process is modified for imprinting range of patterns of around 2000 microns to 20 microns or less in width, and from about 0.1 microns or less to 10 microns or more in depth. Some embodiments curve a proton-exchange membrane whose shape is varied using suction on a backing fluid through a support mask. Other embodiments use a curved electrode. Mask-membrane interaction parameters and process settings vary the feature size, which can generate sub-100-nm features. The feature-generation process is parallelized, and a stepped sequence of such FEFI operations, can generate sub-100-nm lines with sub-100-nm spacing. The described FEFI process is implemented on copper substrate, and also works well on other conductors.

    摘要翻译： 聚焦电场印记（FEFI）提供聚焦电场以引导不平坦的操作和/或电镀操作，以在基板上形成非常精细的金属图案。 该方法是电化学非电镀方法的变型，其中该方法被修改用于在2000微米至20微米或更小的宽度以及约0.1微米或更小至10微米或更深的深度的图案的压印范围。 一些实施方案曲线质子交换膜，其形状通过支撑掩模上的背衬液体上的抽吸而变化。 其他实施例使用弯曲电极。 掩模 - 膜相互作用参数和过程设置会改变特征尺寸，这可以产生亚100 nm的特征。 特征生成过程是并行化的，并且这种FEFI操作的阶梯序列可以产生具有亚100-nm间距的亚100nm线。 所描述的FEFI工艺在铜基板上实现，并且在其它导体上也能很好地工作。

    In situ plating and etching of materials covered with a surface film
    5.
    发明授权
    In situ plating and etching of materials covered with a surface film 失效
    用表面膜覆盖的材料进行原位镀层和蚀刻

    公开(公告)号：US08529738B2

    公开(公告)日：2013-09-10

    申请号：US11767461

    申请日：2007-06-22

    申请人： Robert J. Von Gutfeld ,  Alan C. West

    发明人： Robert J. Von Gutfeld ,  Alan C. West

    IPC分类号： C25D5/34

    CPC分类号： G06Q20/4016 ,  C25D5/022 ,  C25D5/08 ,  C25D5/18 ,  C25D5/22 ,  C25D17/00 ,  C25D17/02

    摘要： Systems and methods for plating and/or etching of hard-to-plate metals are provided. The systems and methods are designed to overcome the deleterious effect of superficial coating or oxide layers that interfere with the plating or etching of certain metal substrates. The systems and methods involve in situ removal of coating materials from the surfaces of the metal substrates while the substrates are either submerged in plating or etching solutions, or are positioned in a proximate enclosure just prior to submersion in the plating or etching solutions. Further, the substrates can be in contact with a suitable patterning mask to obtain patterned oxide-free regions for plating or etching. This in situ removal of coating layers may be achieved by pulse heating or photoablation of the substrate and the inhibiting coating layers. Electrical energy or laser light energy may be used for this purpose. Additionally or alternatively, the coating materials may be removed by mechanical means.

    摘要翻译： 提供了用于电镀和/或蚀刻硬 - 板金属的系统和方法。 这些系统和方法被设计为克服干扰电镀或蚀刻某些金属基底的表面涂层或氧化物层的有害影响。 这些系统和方法涉及从金属基材的表面原位去除涂层材料，同时将基底浸没在电镀或蚀刻溶液中，或者在浸入电镀或蚀刻溶液之前将其定位在邻近的外壳中。 此外，基板可以与合适的图案掩模接触以获得用于电镀或蚀刻的图案化的无氧化物区域。 涂层的原位去除可以通过衬底和抑制涂层的脉冲加热或光照化来实现。 电能或激光能量可用于此目的。 另外或替代地，可以通过机械方法去除涂层材料。

    ELECTROPLATING APPARATUS AND METHOD
    7.
    发明申请
    ELECTROPLATING APPARATUS AND METHOD 审中-公开
    电镀设备和方法

    公开(公告)号：US20120298518A1

    公开(公告)日：2012-11-29

    申请号：US13182632

    申请日：2011-07-14

    申请人： Seung Ki JOO

    发明人： Seung Ki JOO

    IPC分类号： C25D5/04 ,  C25D5/00

    CPC分类号： C25D5/02 ,  C25D5/04 ,  C25D5/10 ,  C25D5/22 ,  C25D17/10 ,  C25D17/12

    摘要： Provided is an electroplating apparatus including: a copper electrode plate that is disposed with a gap from an upper surface of an insulating substrate on which seed electrodes are formed; a driving unit that makes the copper electrode plate move along a rectilinear line; a power supply that applies electric current between the copper electrode plate and each of the seed electrodes; and spacers that are provided on the lower surface of the copper electrode plate to thereby make an electrolyte stay by surface tension between the copper electrode plate and the insulating substrate, and that maintains the gap between the copper electrode plate and the insulating substrate so that the electrolyte may move together with the copper electrode plate. Accordingly, a uniform copper film can be formed on the surface of a large substrate.

    摘要翻译： 提供一种电镀设备，包括：铜电极板，与形成有种子电极的绝缘基板的上表面间隔设置; 使铜电极板沿直线移动的驱动单元; 在铜电极板和种子电极之间施加电流的电源; 以及设置在铜电极板的下表面上的间隔物，从而通过铜电极板和绝缘基板之间的表面张力使电解液滞留，并且保持铜电极板和绝缘基板之间的间隙，使得 电解质可以与铜电极板一起移动。 因此，可以在大基板的表面上形成均匀的铜膜。

    Method for Electrochemical Fabrication
    8.
    发明申请
    Method for Electrochemical Fabrication 审中-公开
    电化学加工方法

    公开(公告)号：US20100264037A1

    公开(公告)日：2010-10-21

    申请号：US12789704

    申请日：2010-05-28

    申请人： Adam L. Cohen

    发明人： Adam L. Cohen

    IPC分类号： C25D5/02

    CPC分类号： C25D5/10 ,  B33Y10/00 ,  B33Y70/00 ,  B81C1/00126 ,  B81C2201/0181 ,  B81C2201/0197 ,  B81C2201/032 ,  C25D1/00 ,  C25D1/003 ,  C25D5/022 ,  C25D5/12 ,  C25D5/22 ,  C25D17/06 ,  H01L21/2885 ,  H05K3/241 ,  Y10T428/12486 ,  Y10T428/239

    摘要： An electroplating method that includes: a) contacting a first substrate with a first article, which includes a substrate and a conformable mask disposed in a pattern on the substrate; b) electroplating a first metal from a source of metal ions onto the first substrate in a first pattern, the first pattern corresponding to the complement of the conformable mask pattern; and c) removing the first article from the first substrate, is disclosed. Electroplating articles and electroplating apparatus are also disclosed.

    摘要翻译： 一种电镀方法，包括：a）使第一衬底与第一制品接触，所述第一制品包括衬底和以衬底形式设置的贴合掩模; b）以第一图案将来自金属离子源的第一金属电镀到所述第一基板上，所述第一图案对应于所述适形掩模图案的所述补体; 和c）从第一基板上去除第一制品。 还公开了电镀制品和电镀装置。

    NOZZLE PLATE OF A SPRAY APPARATUS AND FABRICATION METHOD THEREOF
    9.
    发明申请
    NOZZLE PLATE OF A SPRAY APPARATUS AND FABRICATION METHOD THEREOF 审中-公开
    喷涂装置喷嘴板及其制造方法

    公开(公告)号：US20100224499A1

    公开(公告)日：2010-09-09

    申请号：US12781529

    申请日：2010-05-17

    申请人： Chun-Fu Lu

    发明人： Chun-Fu Lu

    IPC分类号： C25D5/02

    CPC分类号： B41J2/162 ,  B05B17/0646 ,  B05B17/0661 ,  B41J2/135 ,  B41J2/1625 ,  B41J2/164 ,  B41J2/1643 ,  C25D1/08 ,  C25D5/02 ,  C25D5/022 ,  C25D5/16 ,  C25D5/22 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49401 ,  Y10T29/496

    摘要： A nozzle plate for use with a spray apparatus and a fabrication method thereof are provided. The nozzle plate has a plurality of orifices each including an inlet end and an outlet end. The inlet end and the outlet end have a geometrical structure with mirror symmetry and a centroid with positional deviation from a pattern center. The pattern center is the center of an imaginary circle circumscribed about the geometrical structure. The geometrical structure controls the propagation direction of liquid spray, expands the nebulizing range per unit density of orifices, enables product miniaturization, and saves energy.

    摘要翻译： 提供了一种用于喷雾装置的喷嘴板及其制造方法。 喷嘴板具有多个孔，每个孔包括入口端和出口端。 入口端和出口端具有镜像对称性的几何结构和与图案中心位置偏离的质心。 图案中心是围绕几何结构的假想圆的中心。 几何结构控制液体喷雾的传播方向，扩大了每单位密度孔的喷雾范围，使产品小型化，节省能源。