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    Multi-layer, multi-material fabrication methods for producing micro-scale and millimeter-scale devices with enhanced electrical and/or mechanical properties
    3.
    发明授权
    Multi-layer, multi-material fabrication methods for producing micro-scale and millimeter-scale devices with enhanced electrical and/or mechanical properties 有权
    用于生产具有增强的电和/或机械性能的微尺度和毫米级装置的多层多材料制造方法

    公开(公告)号：US08613846B2

    公开(公告)日：2013-12-24

    申请号：US12906970

    申请日：2010-10-18

    Applicant: Ming Ting Wu ,  Rulon Joseph Larsen, III ,  Young Kim ,  Kieun Kim ,  Adam L. Cohen ,  Ananda H. Kumar ,  Michael S. Lockard ,  Dennis R. Smalley

    Inventor： Ming Ting Wu ,  Rulon Joseph Larsen, III ,  Young Kim ,  Kieun Kim ,  Adam L. Cohen ,  Ananda H. Kumar ,  Michael S. Lockard ,  Dennis R. Smalley

    IPC: C25D5/02 ,  C25D5/10

    CPC classification number: G01R1/06716 ,  B33Y10/00 ,  C23C18/1605 ,  C23C18/1651 ,  C25D1/003 ,  G01R1/06744 ,  G01R1/06755 ,  G01R3/00 ,  H01L21/4853

    Abstract: Some embodiments of the invention are directed to electrochemical fabrication methods for forming structures or devices (e.g. microprobes for use in die level testing of semiconductor devices) from a core material and a shell or coating material that partially coats the surface of the structure. Other embodiments are directed to electrochemical fabrication methods for producing structures or devices (e.g. microprobes) from a core material and a shell or coating material that completely coats the surface of each layer from which the probe is formed including interlayer regions. Additional embodiments of the invention are directed to electrochemical fabrication methods for forming structures or devices (e.g. microprobes) from a core material and a shell or coating material wherein the coating material is located around each layer of the structure without locating the coating material in inter-layer regions. Each of these groups of embodiments incorporate both the core material and the coating material during the formation of each layer and each layer is also formed with a sacrificial material that is removed after formation of all layers of the structure. In some embodiments the core material may be a genuine structural material while in others it may be only a functional structural material (i.e. a material that would be removed with sacrificial material if it were accessible by an etchant during removal of sacrificial material.

    Abstract translation: 本发明的一些实施方案涉及用于从芯材料和部分涂覆结构表面的壳或涂层材料形成结构或器件（例如用于半导体器件的晶片级测试的微探针）的电化学制造方法。 其它实施方案涉及用于从芯材和壳或涂层材料制造结构或器件（例如微探针）的电化学制造方法，其完全涂覆形成探针的每个层的表面，包括中间层区域。 本发明的另外的实施方案涉及用于从核心材料和壳或涂层材料形成结构或器件（例如微针）的电化学制造方法，其中涂层材料围绕结构的每一层定位，而不将涂层材料定位在相互之间， 层区域。 这些实施例组中的每一个在形成每个层期间都包括芯材料和涂层材料，并且每个层还形成有牺牲材料，该牺牲材料在形成所述结构的所有层之后被去除。 在一些实施例中，芯材料可以是真正的结构材料，而在其它实施例中，其可以仅是功能性结构材料（即，如果在去除牺牲材料期间可通过蚀刻剂获得牺牲材料，则该材料将被除去。

    Method for Electrochemical Fabrication
    7.
    发明申请
    Method for Electrochemical Fabrication 审中-公开
    电化学加工方法

    公开(公告)号：US20120234688A1

    公开(公告)日：2012-09-20

    申请号：US13441136

    申请日：2012-04-06

    Applicant: Adam L. Cohen

    Inventor： Adam L. Cohen

    IPC: C25D5/02 ,  C25D5/48

    CPC classification number: C25D5/10 ,  B33Y10/00 ,  B33Y70/00 ,  B81C1/00126 ,  B81C2201/0181 ,  B81C2201/0197 ,  B81C2201/032 ,  C25D1/00 ,  C25D1/003 ,  C25D5/022 ,  C25D5/12 ,  C25D5/22 ,  C25D17/06 ,  H01L21/2885 ,  H05K3/241 ,  Y10T428/12486 ,  Y10T428/239

    Abstract: An electroplating method that includes: a) contacting a first substrate with a first article, which includes a substrate and a conformable mask disposed in a pattern on the substrate; b) electroplating a first metal from a source of metal ions onto the first substrate in a first pattern, the first pattern corresponding to the complement of the conformable mask pattern; and c) removing the first article from the first substrate, is disclosed. Electroplating articles and electroplating apparatus are also disclosed.

    Abstract translation: 一种电镀方法，包括：a）使第一衬底与第一制品接触，所述第一制品包括衬底和以衬底形式设置的贴合掩模; b）以第一图案将来自金属离子源的第一金属电镀到所述第一基板上，所述第一图案对应于所述适形掩模图案的所述补体; 和c）从第一基板上去除第一制品。 还公开了电镀制品和电镀装置。

    Micro-turbines, roller bearings, bushings, and design of hollow closed structures and fabrication methods for creating such structures
    8.
    发明授权
    Micro-turbines, roller bearings, bushings, and design of hollow closed structures and fabrication methods for creating such structures 有权
    微型涡轮机，滚子轴承，衬套以及中空封闭结构的设计以及用于制造这种结构的制造方法

    公开(公告)号：US08257573B1

    公开(公告)日：2012-09-04

    申请号：US12565186

    申请日：2009-09-23

    Applicant: Adam L. Cohen

    Inventor： Adam L. Cohen

    IPC: C25D17/00

    CPC classification number: C25D1/003 ,  B33Y10/00

    Abstract: Multi-layer fabrication methods (e.g. electrochemical fabrication methods) for forming microscale and mesoscale devices or structures (e.g. turbines) provide bushings or roller bearing that allow rotational or linear motion which is constrained by multiple structural elements spaced from one another by gaps that are effectively less than minimum features sizes associated with the individual layers used to form the structures. In some embodiments, features or protrusions formed on different layers on opposing surfaces are offset along the axis of layer stacking so as to bring the features into positions that are closer than allowed by the minimum features sizes associated with individual layers. In other embodiments, interference is used to create effective spacings that are less than the minimum features sizes.

    Abstract translation: 用于形成微尺寸和中尺度装置或结构（例如涡轮机）的多层制造方法（例如电化学制造方法）提供衬套或滚子轴承，其允许由多个结构元件约束的旋转或线性运动，这些结构元件通过有效的间隙彼此间隔开 小于与用于形成结构的各个层相关联的最小特征尺寸。 在一些实施例中，形成在相对表面上的不同层上的特征或突起沿着层堆叠的轴线偏移，以便使特征进入比由与各个层相关联的最小特征尺寸允许的位置更近的位置。 在其他实施例中，使用干涉来产生小于最小特征尺寸的有效间隔。

    Discrete or Continuous Tissue Capture Device and Method for Making
    9.
    发明申请
    Discrete or Continuous Tissue Capture Device and Method for Making 失效
    离散或连续组织捕获装置及其制造方法

    公开(公告)号：US20120071842A1

    公开(公告)日：2012-03-22

    申请号：US13270545

    申请日：2011-10-11

    Applicant: Adam L. Cohen

    Inventor： Adam L. Cohen

    IPC: A61M1/00 ,  C25D5/02

    CPC classification number: A61B10/0266 ,  A61B10/04 ,  A61B17/149 ,  A61B17/320016 ,  A61B17/320783 ,  A61B2010/0225 ,  A61B2017/00243 ,  A61B2017/00345 ,  A61B2017/00526 ,  A61B2017/320064 ,  B33Y80/00

    Abstract: Some embodiments of the invention provide an instrument for mechanically removing segments of tissue from a patient during a minimally invasive surgical procedure. An exemplary instrument provides an inlet for receiving tissue a mechanism for cutting away received tissue and for simultaneously moving the cut away tissue away from the inlet to allow additional material to enter the inlet for removal wherein multiple specimens can be captured and eventually removed from the patient's body without the need of removing the instrument after each capture.

    Abstract translation: 本发明的一些实施例提供一种用于在微创手术过程中从患者机械地去除组织的部分的器械。 示例性仪器提供用于接收组织的入口，用于切除接收的组织并同时移动切除组织远离入口的机构，以允许另外的材料进入入口以移除，其中可以捕获多个样本并最终从患者的组织中移除 每次捕获后无需去除仪器。

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