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公开(公告)号：US08529738B2
公开(公告)日：2013-09-10
申请号：US11767461
申请日：2007-06-22
IPC分类号： C25D5/34
摘要： Systems and methods for plating and/or etching of hard-to-plate metals are provided. The systems and methods are designed to overcome the deleterious effect of superficial coating or oxide layers that interfere with the plating or etching of certain metal substrates. The systems and methods involve in situ removal of coating materials from the surfaces of the metal substrates while the substrates are either submerged in plating or etching solutions, or are positioned in a proximate enclosure just prior to submersion in the plating or etching solutions. Further, the substrates can be in contact with a suitable patterning mask to obtain patterned oxide-free regions for plating or etching. This in situ removal of coating layers may be achieved by pulse heating or photoablation of the substrate and the inhibiting coating layers. Electrical energy or laser light energy may be used for this purpose. Additionally or alternatively, the coating materials may be removed by mechanical means.
摘要翻译： 提供了用于电镀和/或蚀刻硬 - 板金属的系统和方法。 这些系统和方法被设计为克服干扰电镀或蚀刻某些金属基底的表面涂层或氧化物层的有害影响。 这些系统和方法涉及从金属基材的表面原位去除涂层材料，同时将基底浸没在电镀或蚀刻溶液中，或者在浸入电镀或蚀刻溶液之前将其定位在邻近的外壳中。 此外，基板可以与合适的图案掩模接触以获得用于电镀或蚀刻的图案化的无氧化物区域。 涂层的原位去除可以通过衬底和抑制涂层的脉冲加热或光照化来实现。 电能或激光能量可用于此目的。 另外或替代地，可以通过机械方法去除涂层材料。
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公开(公告)号：US08475642B2
公开(公告)日：2013-07-02
申请号：US11867399
申请日：2007-10-04
IPC分类号： G01N27/416 , G01N27/403
CPC分类号： G01N27/42
摘要： Methods and systems for monitoring electrolyte bath fluids are provided. The electrolyte bath fluids can be electroplating, electroless plating or etching solutions. The monitoring systems employ microfluidic devices, which have built in microfluidic channels and microfabricated thin-film electrodes. The devices are configured with fluid pumps to control the movement and mixing of test fluids through the microfluidic channels. The microfabricated thin-film electrodes are configured so that the plating or etching bath fluid composition can be characterized by electrochemical measurements. The monitoring methods and system provide faster measurement times, generate minimal waste, and occupy dramatically reduced physical space compared to conventional bath-monitor systems. The monitoring systems and method also provide low-cost system and methods for measuring or monitoring electroless plating bath rates.
摘要翻译： 提供了用于监测电解液液体的方法和系统。 电解液液体可以是电镀，无电镀或蚀刻溶液。 监测系统采用微流体装置，其内置微流体通道和微细的薄膜电极。 这些装置配置有流体泵，以控制测试流体通过微流体通道的移动和混合。 微制造的薄膜电极被配置为使得电镀或蚀刻浴液组合物可以通过电化学测量来表征。 监测方法和系统提供更快的测量时间，产生最少的浪费，并且与传统的浴室监视系统相比，占据显着减少的物理空间。 监测系统和方法还提供了用于测量或监测化学镀浴率的低成本系统和方法。
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3.发明申请公开(公告)号：US20110042201A1
公开(公告)日：2011-02-24
申请号：US12897379
申请日：2010-10-04
摘要： The disclosed subject matter provides systems and methods for etching and/or metal plating of substrate materials. An exemplary method in accordance with the disclosed subject matter for metal-plating or etching a substrate includes submerging portions of the substrate in a first bath of chemical solution, performing in-situ laser ablation of the substrate to achieve an immersion plated pattern with a first cation, plating-up the immersion plated pattern with the first cation in the first bath, and plating-up the immersion plated pattern with a second cation in a second bath. The same or another exemplary method can utilize a reel-to-reel system. The plating-up can begin after patterning by immersion plating is complete. Further, a single plating pattern can be used to define a pattern and the same bath can be used to plate the immersion pattern, thereby achieving a uniform thickness of the pattern.
摘要翻译： 所公开的主题提供了用于衬底材料的蚀刻和/或金属电镀的系统和方法。 根据所公开的用于金属电镀或蚀刻衬底的主题的示例性方法包括将衬底的部分浸没在化学溶液的第一浴中，对衬底进行原位激光烧蚀以实现具有第一 在第一浴中用第一阳离子电镀浸镀图案，并在第二浴中用第二阳离子电镀浸镀的图案。 相同或另一示例性方法可以利用卷对卷系统。 通过浸镀完成图案化之后可以开始电镀。 此外，可以使用单个电镀图案来限定图案，并且可以使用相同的镀液来沉积浸渍图案，从而实现图案的均匀厚度。
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4.发明申请SYSTEM AND METHOD FOR OBTAINING ANISOTROPIC ETCHING OF PATTERNED SUBSTRATES 审中-公开用于获取图形基板的异相蚀刻的系统和方法公开(公告)号：US20080245674A1
公开(公告)日：2008-10-09
申请号：US12040378
申请日：2008-02-29
IPC分类号： B05D5/04
CPC分类号： C25F3/02 , B81C1/00571 , B81C2201/0133 , B81C2201/0139 , B81C2201/0142 , C23F1/02 , C23F1/08 , H05K3/068 , H05K2203/1105 , H05K2203/1115
摘要： Systems and methods for etching topographic features in non-crystalline or metallic substrates are provided. A protective material is placed and patterned on a surface of the substrate to define exposed and protected regions of the substrate for etching in a liquid etchant having etching rates that are thermally activated. A nonuniform temperature profile is imposed on the substrate so that the temperatures and hence the etching rates at surfaces in the exposed regions are higher than those in the protected regions. Arrangements for imposing the nonuniform temperature profile include heating designated portions of the substrate with light radiation. Alternatively, the non-uniform temperature profile is developed as etching progresses by passing current pulses through the substrate in a manner that causes geometrically non-uniform heating of the substrate.
摘要翻译： 提供用于蚀刻非晶体或金属基底中的地形特征的系统和方法。 保护材料被放置并图案化在衬底的表面上以限定衬底的暴露和保护区域，以在具有热激活蚀刻速率的液体蚀刻剂中蚀刻。 对基板施加不均匀的温度曲线，使得暴露区域中的表面的温度和蚀刻速率高于受保护区域中的温度。 施加不均匀温度分布的布置包括用光辐射加热衬底的指定部分。 或者，当通过使电流脉冲以导致衬底的几何不均匀加热的方式通过衬底时蚀刻进行蚀刻而开发不均匀的温度分布。
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5.发明授权Systems and methods for in situ annealing of electro- and electroless platings during deposition 失效沉积期间电化学镀和无电镀的原位退火的系统和方法公开(公告)号：US08496799B2
公开(公告)日：2013-07-30
申请号：US12208287
申请日：2008-09-10
CPC分类号： C25D5/50 , C23C18/161 , C23C18/1612 , C23C18/1628 , C23C18/163 , C23C18/1678 , C23C18/1692 , C25D5/024 , C25D5/026 , C25D17/00 , C25D17/06 , C25D21/02
摘要： Systems and methods for in-situ annealing of metal layers as they are being plated on a substrate by action of a chemical solution are provided. The in-situ annealing, in conjunction with controlled slow growth rates, allows control of the structure of the plated metal layers. The systems and methods are used for maskless plating of the substrates.
摘要翻译： 提供了通过化学溶液的作用将金属层原位退火的系统和方法，其被电镀在基板上。 原位退火结合受控的缓慢生长速率，允许控制电镀金属层的结构。 该系统和方法用于基板的无掩模电镀。
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6.发明申请SUBSTRATE LASER OXIDE REMOVAL PROCESS FOLLOWED BY ELECTRO OR IMMERSION PLATING 有权基体电镀或浸渍镀层后的氧化铝激光去除工艺公开(公告)号：US20110104396A1
公开(公告)日：2011-05-05
申请号：US12940703
申请日：2010-11-05
IPC分类号： C25D17/00 , C25D5/34 , C25D5/10 , C25D5/44 , C25D5/38 , C25D5/36 , B05D3/06 , B05C1/06 , B23K26/00
摘要： Method of ablating the surface of a substrate including providing a dry substrate and an electrolyte source, ablating the surface of the dry substrate to at least partially remove a native oxide layer, and immersing the ablated dry substrate in the electrolyte source, in which the dry substrate is ablated prior to being introduced into the electrolyte source. Also provided is a method of ablating the surface of a substrate that includes providing a dry substrate and an electrolyte, depositing a portion of the electrolyte on the substrate at a thickness of less than 10 microns and ablating the surface of the substrate with the electrolyte applied thereon. System for use in the ablation of the surface of a substrate are also provided.
摘要翻译： 消除基材表面的方法，包括提供干基质和电解质源，对干基质表面进行烧蚀以至少部分除去天然氧化物层，以及将消融的干基质浸入电解质源中，其中干燥 衬底在被引入电解质源之前被消融。 还提供了一种消除基底表面的方法，其包括提供干燥的基底和电解质，将电解质的一部分沉积在基底上，厚度小于10微米，并且用施加的电解质来烧蚀基底的表面 上。 还提供了用于消除基底表面的系统。
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公开(公告)号：US20080264801A1
公开(公告)日：2008-10-30
申请号：US11867399
申请日：2007-10-04
IPC分类号： G01N27/416 , G01N27/26
CPC分类号： G01N27/42
摘要： Methods and systems for monitoring electrolyte bath fluids are provided. The electrolyte bath fluids can be electroplating, electroless plating or etching solutions. The monitoring systems employ microfluidic devices, which have built in microfluidic channels and microfabricated thin-film electrodes. The devices are configured with fluid pumps to control the movement and mixing of test fluids through the microfluidic channels. The microfabricated thin-film electrodes are configured so that the plating or etching bath fluid composition can be characterized by electrochemical measurements. The monitoring methods and system provide faster measurement times, generate minimal waste, and occupy dramatically reduced physical space compared to conventional bath-monitor systems. The monitoring systems and method also provide low-cost system and methods for measuring or monitoring electroless plating bath rates.
摘要翻译： 提供了用于监测电解液液体的方法和系统。 电解液液体可以是电镀，无电镀或蚀刻溶液。 监测系统采用微流体装置，其内置微流体通道和微细的薄膜电极。 这些装置配置有流体泵，以控制测试流体通过微流体通道的移动和混合。 微制造的薄膜电极被配置为使得电镀或蚀刻浴液组合物可以通过电化学测量来表征。 监测方法和系统提供更快的测量时间，产生最少的浪费，并且与传统的浴室监视系统相比，占据显着减少的物理空间。 监测系统和方法还提供了用于测量或监测化学镀浴率的低成本系统和方法。
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公开(公告)号：US20080142367A1
公开(公告)日：2008-06-19
申请号：US11767461
申请日：2007-06-22
摘要： Systems and methods for plating and/or etching of hard-to-plate metals are provided. The systems and methods are designed to overcome the deleterious effect of superficial coating or oxide layers that interfere with the plating or etching of certain metal substrates. The systems and methods involve in situ removal of coating materials from the surfaces of the metal substrates while the substrates are either submerged in plating or etching solutions, or are positioned in a proximate enclosure just prior to submersion in the plating or etching solutions. Further, the substrates can be in contact with a suitable patterning mask to obtain patterned oxide-free regions for plating or etching. This in situ removal of coating layers may be achieved by pulse heating or photoablation of the substrate and the inhibiting coating layers. Electrical energy or laser light energy may be used for this purpose. Additionally or alternatively, the coating materials may be removed by mechanical means.
摘要翻译： 提供了用于电镀和/或蚀刻硬 - 板金属的系统和方法。 这些系统和方法被设计为克服干扰电镀或蚀刻某些金属基底的表面涂层或氧化物层的有害影响。 这些系统和方法涉及从金属基材的表面原位去除涂层材料，同时将基底浸没在电镀或蚀刻溶液中，或者在浸入电镀或蚀刻溶液之前将其定位在邻近的外壳中。 此外，基板可以与合适的图案掩模接触以获得用于电镀或蚀刻的图案化的无氧化物区域。 涂层的原位去除可以通过衬底和抑制涂层的脉冲加热或光照化来实现。 电能或激光能量可用于此目的。 另外或替代地，可以通过机械方法去除涂层材料。
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公开(公告)号：US20120219483A1
公开(公告)日：2012-08-30
申请号：US13453300
申请日：2012-04-23
申请人： Klaus S. Lackner , Alan C. West , Jennifer L. Wade
发明人： Klaus S. Lackner , Alan C. West , Jennifer L. Wade
IPC分类号： B01D53/62 , B01J27/232
CPC分类号： B01D53/228 , B01D67/0041 , B01D67/0088 , B01D69/142 , B01D71/02 , B01D71/024 , B01D2256/22 , B01D2258/0208 , B01D2323/08 , C04B35/48 , C04B38/061 , C04B2111/00801 , C04B2235/6025 , H01M8/0668 , H01M2008/1293 , Y02C10/04 , Y02C10/10 , C04B38/0054
摘要： A carbon dioxide permeable membrane is described. In some embodiments, the membrane includes a body having a first side and an opposite second side; a plurality of first regions formed from a molten carbonate having a temperature of about 400 degrees Celsius to about 1200 degrees Celsius, the plurality of first regions forming a portion of the body and the plurality of first regions extending from the first side of the body to the second side of the body; a plurality of second regions formed from an oxygen conductive solid oxide, the plurality of second regions combining with the plurality of first regions to form the body and the plurality of second regions extending from the first side of the body to the second side of the body; and the body is configured to allow carbon dioxide to pass from the first side to the second side.
摘要翻译： 描述了二氧化碳可渗透膜。 在一些实施例中，膜包括具有第一侧和相对的第二侧的主体; 由熔融碳酸盐形成的多个第一区域，其具有约400摄氏度至约1200摄氏度的温度，所述多个第一区域形成所述主体的一部分，并且所述多个第一区域从所述主体的第一侧延伸到 身体的第二面 由氧传导性固体氧化物形成的多个第二区域，所述多个第二区域与所述多个第一区域结合以形成所述主体，并且所述多个第二区域从所述主体的第一侧向所述主体的第二侧延伸 ; 并且所述主体构造成允许二氧化碳从所述第一侧通过到所述第二侧。
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公开(公告)号：US08163065B2
公开(公告)日：2012-04-24
申请号：US13052392
申请日：2011-03-21
申请人： Klaus S. Lackner , Alan C. West , Jennifer L. Wade
发明人： Klaus S. Lackner , Alan C. West , Jennifer L. Wade
IPC分类号： B01D53/22
CPC分类号： B01D53/228 , B01D67/0041 , B01D67/0088 , B01D69/142 , B01D71/02 , B01D71/024 , B01D2256/22 , B01D2258/0208 , B01D2323/08 , C04B35/48 , C04B38/061 , C04B2111/00801 , C04B2235/6025 , H01M8/0668 , H01M2008/1293 , Y02C10/04 , Y02C10/10 , C04B38/0054
摘要： A carbon dioxide permeable membrane is described. In some embodiments, the membrane includes a body having a first side and an opposite second side; a plurality of first regions formed from a molten carbonate having a temperature of about 400 degrees Celsius to about 1200 degrees Celsius, the plurality of first regions forming a portion of the body and the plurality of first regions extending from the first side of the body to the second side of the body; a plurality of second regions formed from an oxygen conductive solid oxide, the plurality of second regions combining with the plurality of first regions to form the body and the plurality of second regions extending from the first side of the body to the second side of the body; and the body is configured to allow carbon dioxide to pass from the first side to the second side.
摘要翻译： 描述了二氧化碳可渗透膜。 在一些实施例中，膜包括具有第一侧和相对的第二侧的主体; 由熔融碳酸盐形成的多个第一区域，其具有约400摄氏度至约1200摄氏度的温度，所述多个第一区域形成所述主体的一部分，并且所述多个第一区域从所述主体的第一侧延伸到 身体的第二面 由导电固体氧化物形成的多个第二区域，所述多个第二区域与所述多个第一区域结合以形成所述主体，并且所述多个第二区域从所述主体的第一侧延伸到所述主体的第二侧 ; 并且所述主体构造成允许二氧化碳从所述第一侧通过到所述第二侧。
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