-
公开(公告)号：US20180272714A1
公开(公告)日：2018-09-27
申请号：US15924725
申请日：2018-03-19
申请人： SII Printek Inc.
IPC分类号： B41J2/16 , C23C18/32 , C23C18/42 , C23C18/16 , G03F7/16 , H01L41/047 , H01L41/09 , H01L41/29
CPC分类号： B41J2/1643 , B41J2/14209 , B41J2/1607 , B41J2/1609 , B41J2/1623 , B41J2/1629 , B41J2/1631 , B41J2/1632 , B41J2/1634 , B41J2/1635 , B41J2/1642 , B41J2002/14491 , C23C18/1605 , C23C18/32 , C23C18/42 , G03F7/16 , H01L41/047 , H01L41/09 , H01L41/1876 , H01L41/29
摘要： A discharge channel and a non-discharge channel are formed to have a similar shape, that is, to include extension portions and raise-and-cut portions continuing from end portions of both the extension portions, respectively. Then, imparting of a catalyst, washing of an unnecessary catalyst, plating, and the like are performed on a target surface, as a plating step. In an embodiment, an electrode clearance groove is formed after the plating step. Since channel grooves for the discharge channel and the non-discharge channel have a similar shape, it is possible to cause a water flow to uniformly flow in the channels when washing is performed, and thus to avoid an occurrence of a situation in which a lump is formed in the channel groove by plating.
-
公开(公告)号：US20180207933A1
公开(公告)日：2018-07-26
申请号：US15898089
申请日：2018-02-15
申请人： XEROX CORPORATION
发明人： David L. Knierim
CPC分类号： B41J2/14274 , B23K1/00 , B23K1/0016 , B23K1/206 , B23K20/026 , B23K20/16 , B23K20/24 , B23K2101/36 , B23K2103/166 , B41J2/1607 , B41J2/1643
摘要： A method of bonding two components includes plating a first of the components with a first silver layer, a tin layer, and a second silver layer, plating a second of the components with silver, inserting the first and second components into a pre-heated press, and applying pressure to the components causing the components to bond. A method of manufacturing a print head includes plating a piezoelectric layer with a first silver layer, a tin layer, and a second silver layer, plating a steel layer of a jet stack with silver, inserting the piezoelectric layer and the steel layer into a pre-heated press, and applying pressure to the piezoelectric layer and the steel layer causing the layers to bond.
-
公开(公告)号：US20180170054A1
公开(公告)日：2018-06-21
申请号：US15801525
申请日：2017-11-02
IPC分类号： B41J2/16
CPC分类号： B41J2/164 , B41J2/1603 , B41J2/1623 , B41J2/1628 , B41J2/1629 , B41J2/1631 , B41J2/1632 , B41J2/1642 , B41J2/1643 , B41J2/1645 , B41J2/1646 , B41J2002/14467 , B41J2202/22
摘要： A method for forming a patterned film on a substrate includes: step of patterning a mask material on the substrate, thereby covering, with the mask material, the region except a patterned film forming region on a substrate surface on which the patterned film is to be formed; step of covering, with a protective member, at least a part of the surface of the mask material opposite to the substrate so as to allow the patterned film forming region to communicate with outside air, thereby forming a workpiece to be subjected to film formation in following step; step of forming a film on at least the patterned film forming region of the surface of the workpiece communicating with the outside air; step of releasing the protective member from the mask material; and step of removing the mask material and a part of the film on the mask material.
-
公开(公告)号：US20180086072A1
公开(公告)日：2018-03-29
申请号：US15694928
申请日：2017-09-04
发明人： Takashi TOZUKA
CPC分类号： B41J2/14201 , B41J2/03 , B41J2/14032 , B41J2/14209 , B41J2/1606 , B41J2/1609 , B41J2/1623 , B41J2/1626 , B41J2/1631 , B41J2/1634 , B41J2/1642 , B41J2/1643 , B41J2/175 , B41J2002/14241 , B41J2002/14362 , B41J2002/14491 , B41J2202/22
摘要： According to one embodiment, a method for manufacturing an inkjet head includes attaching a piezoelectric body facing the substrate, forming slanting side surfaces on the piezoelectric body, the slanting side surfaces extending between a first surface and a second surface of the piezoelectric body such that first surface has a remaining area that is less that a remaining area of second surface, forming a groove in the piezoelectric body from the first surface towards the second surface, the groove passing through two slanting side surfaces on opposite sides of the piezoelectric body, forming a conductive film on an inner surface of the groove, trimming portions of the conductive film proximate to the first surface and the slanting side surfaces such that the conductive film is separated from the first surface and the slanting side surfaces at outer edges of the groove, and forming an insulating film over the conductive film.
-
公开(公告)号：US20180079641A1
公开(公告)日：2018-03-22
申请号：US15698478
申请日：2017-09-07
发明人： Masashi YOSHIIKE
CPC分类号： B81B7/007 , B41J2/14201 , B41J2/14233 , B41J2/161 , B41J2/1623 , B41J2/1628 , B41J2/1629 , B41J2/1631 , B41J2/1632 , B41J2/1643 , B41J2/1646 , B41J2002/14491 , B81B2201/052 , B81B2207/07 , B81C1/00301 , B81C2201/013
摘要： There is provided a MEMS device which includes a second substrate which is disposed with an interval from a first substrate, and an interposed member which is interposed between the first substrate and the second substrate, and which has space which is defined by the first substrate, the second substrate, and the interposed member, in which the first substrate includes a wiring which extends from a first surface side which is a surface on a side opposite to the second substrate toward a second surface side which is a surface of the second substrate side and is made of a conductor, in which an end portion of the first surface side of the wiring is covered by a first protective film provided on the first surface side, and in which an end portion of the second surface side of the wiring faces the space.
-
公开(公告)号：US09902150B2
公开(公告)日：2018-02-27
申请号：US15295773
申请日：2016-10-17
CPC分类号： B41J2/14201 , B41J2/14233 , B41J2/1607 , B41J2/161 , B41J2/1623 , B41J2/1628 , B41J2/1629 , B41J2/1634 , B41J2/1643 , B41J2002/14491 , B41J2202/18
摘要： A liquid ejecting head includes a first substrate in which a piezoelectric element is provided; and a second substrate on which the first substrate is connected to a first surface, in which the second substrate is provided with a penetration hole, which penetrates through the second substrate in a plate thickness direction, and penetration wiring, which is formed from a conductor that is formed in an inner portion of the penetration hole, the penetration wiring is formed from a first end portion, which is provided on a first surface side, a second end portion, which is provided on a second surface side, which is a surface that is on an opposite side to the first surface, and connection wiring, which connects the first end portion and the second end portion, and a cross-sectional area of the connection wiring in a planar direction of the first surface is smaller than cross-sectional areas of the first end portion and the second end portion in the planar direction.
-
公开(公告)号：US20170217166A1
公开(公告)日：2017-08-03
申请号：US15502307
申请日：2015-09-08
发明人： Norihiko Ochi , Koji Kitani
CPC分类号： B41J2/14 , B41J2/14209 , B41J2/16 , B41J2/1609 , B41J2/1626 , B41J2/1632 , B41J2/1634 , B41J2/1643 , B41J2002/14491
摘要： Provided is a liquid ejection device capable of ejecting a minute liquid droplet with stability, in which a capacity of a pressure chamber facing a second partition portion increases, and a capacity of the pressure chamber facing a first partition portion decreases, at a time when a voltage is applied so that a potential of a first electrode becomes lower than a potential of a second electrode, compared to a time when a voltage is applied so that the potential of the first electrode becomes the same as the potential of the second electrode, the first electrode and the second electrode being included in an electrode formed on each of both side surfaces of partitions.
-
公开(公告)号：US09707758B2
公开(公告)日：2017-07-18
申请号：US14869583
申请日：2015-09-29
发明人： Frank Edward Anderson , Richard Earl Corley , Michael John Dixon , Jiandong Fang , Jeanne Marie Saldanha Singh
CPC分类号： B41J2/1433 , B41J2/14 , B41J2/14072 , B41J2/1601 , B41J2/1623 , B41J2/1626 , B41J2/1632 , B41J2/1634 , B41J2/1643 , B41J2002/14419 , B41J2002/14491 , B41J2202/20 , H01L2224/48091 , H01L2224/73265 , H01L2924/10155 , H01L2924/00014
摘要： A micro-fluid ejection head has an ejection chip to expel fluid. It connects to a laminate construct. The construct has vertically configured wiring layers interspersed with non-conductive layers, such as carbon fiber layers. An upper of the wiring layers electrically connects to the ejection chip. The upper layer may also support a planar undersurface of the chip directly on a surface or in a recessed pocket. The two can connect with a die bond, such as one having silica or boron nitride. Fluid connections exist between ink feed slots of the chip and the laminate construct. A silicon tile or other material may also fluidly interconnect with the two. A plastic manifold optionally supports the laminate construct and may fluidly connect to it. The wiring layers of the laminate contemplate ground, power, and various bond pads. Other construct layers contemplate prepreg or core FR4 layers.
-
9.发明授权公开(公告)号：US09656467B2
公开(公告)日：2017-05-23
申请号：US14757550
申请日：2015-12-24
发明人： Toru Kakiuchi , Hideki Hayashi , Keita Hirai , Atsushi Hirota
CPC分类号： B41J2/14201 , B41J2/14233 , B41J2/161 , B41J2/1628 , B41J2/1629 , B41J2/1631 , B41J2/1643 , B41J2/1646 , B41J2002/14266 , B41J2002/14459 , B41J2002/14491
摘要： There is provided a piezoelectric actuator including: a plurality of piezoelectric elements forming first and second piezoelectric element rows, and including first, second electrodes and piezoelectric portion; an electrode conductive portion; a contact section; a plurality of drive wires; and conductive wires. A part of the drive wires corresponding to the piezoelectric elements of the second piezoelectric element row are extended toward the contact section while passing between two adjacent piezoelectric elements of the first piezoelectric element row which are adjacent in the first direction. The conductive wires are arranged between two adjacent piezoelectric elements of the second piezoelectric element row, each of the conductive wires is conducted, at two locations thereof apart in the second direction, with the electrode conductive portion.
-
公开(公告)号：US09469109B2
公开(公告)日：2016-10-18
申请号：US14531830
申请日：2014-11-03
CPC分类号： B41J2/1433 , B41J2/14129 , B41J2/1603 , B41J2/162 , B41J2/1623 , B41J2/1626 , B41J2/1628 , B41J2/1629 , B41J2/1632 , B41J2/1642 , B41J2/1643
摘要： Embodiments disclose herein are directed to a microfluidic delivery device that has a predominantly semiconductor structure, such as silicon. In particular, the structure for delivering fluid may be formed from polycrystalline silicon, also called polysilicon, or epitaxial silicon. The microfluidic delivery device that predominantly uses silicon based materials to form the structures that are in contact with the dispensed fluid results in a device that is compatible with a wide set of fluids and applications.
摘要翻译： 本文公开的实施方案涉及具有主要半导体结构（例如硅）的微流体递送装置。 特别地，用于输送流体的结构可以由也称为多晶硅的多晶硅或外延硅形成。 主要使用硅基材料以形成与分配的流体接触的结构的微流体递送装置导致与广泛流体和应用相容的装置。
-
-
-
-
-
-
-
-
-
搜索结果
2183 条记录 (耗时 0.027 秒)
